Adhesion tape and method for mounting a chip onto a substrate

Abstract

An adhesion tape can be used for transferring an adhesive material onto the underside of a chip for further mounting of the chip onto a substrate. In order to provide effective compensation of the curvature of the wafers and of the dies without adversely affecting the mounting process in this case, an adhesion tape having an at least two-layered adhesive layer is provided. The adhesive layer comprises a first and a second adhesive layer. Both adhesive layers can be cured selectively with respect to one another.

Description

DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawing, in which:

FIG. 1 schematically shows an arrangement of a chip on a DDAF tape and the pick up thereof according to the prior art;

FIG. 2 schematically shows an arrangement of a chip on a DDAF tape and the pick up thereof according to the invention; and

FIG. 3 schematically shows an arrangement of a chip on an adhesion tape and the pick up thereof without the first adhesive layer being taken over.

Claims

1. An adhesion tape comprising: a substrate foil;a first layer of adhesive material adjacent a surface of the substrate foil; anda second layer of adhesive material adjacent a surface of the first layer, wherein a curing characteristic of the first layer is different from a curing characteristic of the second layer such that the first and second layers can be cured selectively with respect to each other.

2. The adhesion tape as claimed in claim 1, wherein the curing characteristic comprises curing temperature such that the first layer and the second layer are curable at different temperatures.

3. The adhesion tape as claimed in claim 2, wherein the curing temperature of the second layer is lower than the curing temperature of the first layer.

4. The adhesion tape as claimed in claim 1, wherein the curing characteristic comprises a curing wavelength such that the first layer and the second layer are curable under UV radiation with different wavelengths.

5. The adhesion tape as claimed in claim 1, wherein the curing characteristic of the first layer comprises a physical property that is different than the curing characteristic of the second layer.

6. The adhesion tape as claimed in claim 5, wherein the first layer comprises a temperature-curable material and the second layer comprises a UV-radiation-curable material.

7. The adhesion tape as claimed in claim 5, wherein the first layer comprises a UV-radiation-curable material and the second layer comprises a temperature-curable material.

8. An adhesion tape comprising: a substrate foil;a first layer of adhesive material adjacent a surface of the substrate foil; anda second layer of adhesive material adjacent a surface of the first layer, wherein a curing characteristic of the first layer is different from a curing characteristic of the second layer for curing the second layers selectively with respect to the first layer.

9. The adhesion tape as claimed in claim 8, wherein the first layer of adhesive material and the second layer of adhesive material are curable at different temperatures.

10. The adhesion tape as claimed in claim 9, wherein the curing temperature of the second layer is lower than the curing temperature of the first layer.

11. The adhesion tape as claimed in claim 8, wherein the curable first layer of adhesive material and the second layer of adhesive material are under UV radiation with different wavelengths.

12. The adhesion tape as claimed in claim 8, wherein the material of the first layer is curable under different physical properties than the material of the second layer.

13. The adhesion tape as claimed in claim 12, wherein the first layer comprises a temperature-curable material and the second layer comprises a UV-radiation-curable material.

14. The adhesion tape as claimed in claim 12, wherein the first layer comprises a UV-radiation-curable material and the second layer comprises a temperature-curable material.

15. The adhesion tape as claimed in claim 8, wherein the first layer comprises a non-curable material and the second layer comprises a curable material.

16. A method of mounting a chip onto a substrate, the method comprising: adhering a back side of a chip to an adhesion tape, the adhesion tape including a first layer of adhesive material and a second layer of adhesive material adjacent the first layer of adhesive material, wherein a curing characteristic of the first layer is different from a curing characteristic of the second layer;curing the second layer of adhesive material to mechanically stabilize the chip, wherein the first layer remains uncured;removing the chip from a substrate foil such that the first and second layers both remain adhered to the back side of the chip, wherein the removing includes stripping an upper surface of the first layer from the substrate foil;attaching the chip to a substrate by placing the upper surface of the first layer on the substrate; andcuring the first layer.

17. The method as claimed in claim 16, wherein a curing temperature of the first layer is different from a curing temperature of the second layer.

18. The method as claimed in claim 17, wherein the curing temperature of the second layer is lower than the curing temperature of the first layer, the method further comprising exposing the chip with the adhesion tape to a temperature at least as high as the curing temperature of the second layer but lower than the curing temperature of the first layer prior to removing the chip from the substrate foil.

19. The method as claimed in claim 16, wherein the first layer is curable under radiation of a first wavelength and the second layer is curable under radiation of a second wavelength, the first wavelength being different than the second wavelength.

20. The method as claimed in claim 16, wherein the curing characteristic of the first layer comprises a different physical property than the curing characteristic of the second layer.

21. The method as claimed in claim 20, wherein the first layer comprises a temperature-curable material and the second layer comprises a UV-radiation-curable material.

22. The method as claimed in claim 20, wherein the first layer comprises a UV-radiation-curable material and the second layer comprises a temperature-curable material.

23. A method of mounting a chip onto a substrate, the method comprising: providing a back side of a chip with an adhesion tape comprising a first layer of adhesive material and a second layer of adhesive material adjacent the first layer, wherein a curing characteristic of the first layer is different from a curing characteristic of the second layer such that the second layer can be cured selectively with respect to the first layer;curing the second layer such that the first layer remains uncured;removing the chip from a substrate foil such that the second layer is attached to the chip and the first layer is attached to the substrate foil, the removing being performed by stripping the second layer from the first layer; andmounting the chip onto a substrate.

24. The method as claimed in claim 23, wherein a curing temperature of the first layer is different from a curing temperature of the second layer.

25. The method as claimed in claim 24, wherein the curing temperature of the second layer is lower than the curing temperature of the first layer.

26. The method as claimed in claim 23, wherein the first layer is curable under radiation of a first wavelength and the second layer is curable under radiation of a second wavelength, the first wavelength being different than the second wavelength.

27. The method as claimed in claim 23, wherein the curing characteristic of the first layer comprises a different physical property than the curing characteristic of the second layer.

28. The method as claimed in claim 27, wherein the first layer comprises a temperature-curable material and the second layer comprises a UV-radiation-curable material.

29. The method as claimed in claim 27, wherein the first layer comprises a UV-radiation-curable material and the second layer comprises a temperature-curable material.

30. The method as claimed in claim 23, wherein the first layer comprises a non-curable material and the second layer comprises a curable material.