Bernd Schmoelzer

Person

Radenthein, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device module having vertical metallic contacts and a...
- Patent number 12,080,669
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an embedded semiconductor die
- Patent number 12,002,739
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with connection lug
- Patent number 11,728,250
- Issue date Aug 15, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and method for mounting an electronic component to a subst...
- Patent number 11,211,304
- Issue date Dec 28, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package top-side-cooling
- Patent number 10,755,999
- Issue date Aug 25, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with top side cooling
- Patent number 10,699,978
- Issue date Jun 30, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with improved thermal and electrical performance
- Patent number 10,373,897
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising side wall marking
- Patent number 9,972,576
- Issue date May 15, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...
- Publication number 20240250004
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Providing an Even Current Distribution and St...
- Publication number 20240170377
- Publication date May 23, 2024
- Infineon Technologies Austria AG
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240162205
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Marcus BÖHM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package or a Printed Circuit Board, Both Modified to...
- Publication number 20240014104
- Publication date Jan 11, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESIO...
- Publication number 20230378011
- Publication date Nov 23, 2023
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED...
- Publication number 20230360929
- Publication date Nov 9, 2023
- Infineon Technologies Austria AG
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...
- Publication number 20230361009
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING T...
- Publication number 20230282591
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MODULE ARRANGEMENT
- Publication number 20230230905
- Publication date Jul 20, 2023
- Peter Luniewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE WITH DELAMINATION MITIGATION
- Publication number 20230106642
- Publication date Apr 6, 2023
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising a Cavity with Exposed Contacts and...
- Publication number 20230093341
- Publication date Mar 23, 2023
- Infineon Technologies Austria AG
- Julian Treu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Connection Lug
- Publication number 20220375830
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Package with Connection Lug
- Publication number 20220375832
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20220157682
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE
- Publication number 20220148934
- Publication date May 12, 2022
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...
- Publication number 20220102311
- Publication date Mar 31, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE AND A...
- Publication number 20210249334
- Publication date Aug 12, 2021
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Package Top-Side-Cooling
- Publication number 20190295920
- Publication date Sep 26, 2019
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package with Top Side Cooling
- Publication number 20190080973
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly and Method for Mounting an Electronic Component to a Subst...
- Publication number 20190057923
- Publication date Feb 21, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE
- Publication number 20170179009
- Publication date Jun 22, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package comprising side wall marking
- Publication number 20170148743
- Publication date May 25, 2017
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS

Bernd Schmoelzer

Person

Patents Grantslast 30 patents

Method of forming a semiconductor package with connection lug

Package with electrically insulated carrier and at least one step o...

Semiconductor device module having vertical metallic contacts and a...

Semiconductor device including an embedded semiconductor die

Linear spacer for spacing a carrier of a package

Package with electrically insulated carrier and at least one step o...

Semiconductor package with connection lug

Assembly and method for mounting an electronic component to a subst...

Multi-package top-side-cooling

SMD package with top side cooling

Semiconductor devices with improved thermal and electrical performance

Semiconductor chip package comprising side wall marking

Patents Applicationslast 30 patents

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...

Semiconductor Package Providing an Even Current Distribution and St...

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

Semiconductor Package or a Printed Circuit Board, Both Modified to...

ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESIO...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED...

SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...

SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING T...

STACKED MODULE ARRANGEMENT

EMBEDDED PACKAGE WITH DELAMINATION MITIGATION

Semiconductor Package Comprising a Cavity with Exposed Contacts and...

Semiconductor Package with Connection Lug

Method of Forming a Semiconductor Package with Connection Lug

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE

SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...

SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE AND A...

Multi-Package Top-Side-Cooling

SMD Package with Top Side Cooling

Assembly and Method for Mounting an Electronic Component to a Subst...

SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE

Semiconductor chip package comprising side wall marking