Bernd Waidhas

Person

Pettendorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 12,362,251
- Issue date Jul 15, 2025
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 12,341,096
- Issue date Jun 24, 2025
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,243,828
- Issue date Mar 4, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out packaging pop mechanical attach method
- Patent number 12,243,856
- Issue date Mar 4, 2025
- Intel Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,211,796
- Issue date Jan 28, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of 2XD module using high density interconnect bridges
- Patent number 12,125,815
- Issue date Oct 22, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to implement wafer-level chip-scale packages with grounded c...
- Patent number 12,080,655
- Issue date Sep 3, 2024
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief die implementation
- Patent number 12,057,411
- Issue date Aug 6, 2024
- Intel Corporation
- Stephan Stoeckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package formation methods including coupling a molded routing layer...
- Patent number 12,057,364
- Issue date Aug 6, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 11,955,395
- Issue date Apr 9, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring-board islands for connecting chip packages and metho...
- Patent number 11,877,403
- Issue date Jan 16, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages, and methods for forming semiconductor packages
- Patent number 11,764,187
- Issue date Sep 19, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out packaging pop mechanical attach method
- Patent number 11,735,570
- Issue date Aug 22, 2023
- Intel Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale thin 3D die stacked package
- Patent number 11,581,287
- Issue date Feb 14, 2023
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package and methods
- Patent number 11,508,637
- Issue date Nov 22, 2022
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic coils in locally thinned silicon bridges and methods of as...
- Patent number 11,456,116
- Issue date Sep 27, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 11,404,339
- Issue date Aug 2, 2022
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package-on-package with adhesive die attach
- Patent number 11,380,616
- Issue date Jul 5, 2022
- Intel IP Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch antennas stitched to systems in packages and methods of assem...
- Patent number 11,374,323
- Issue date Jun 28, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 11,270,941
- Issue date Mar 8, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-up fan-out electronic package with passive components using a...
- Patent number 11,211,337
- Issue date Dec 28, 2021
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and lateral interconnects between dies
- Patent number 11,177,220
- Issue date Nov 16, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with angular deflections and wrapped printed wiring boar...
- Patent number 11,145,577
- Issue date Oct 12, 2021
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring-board islands for connecting chip packages and metho...
- Patent number 11,134,573
- Issue date Sep 28, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor inductors
- Patent number 11,127,813
- Issue date Sep 21, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 11,031,699
- Issue date Jun 8, 2021
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 11,018,114
- Issue date May 25, 2021
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component magnetic shielding for microelectronic devices
- Patent number 10,867,934
- Issue date Dec 15, 2020
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER ASSEMBLY
- Publication number 20250210428
- Publication date Jun 26, 2025
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active Cooling for Heterogenous Packages
- Publication number 20250210456
- Publication date Jun 26, 2025
- Intel Corporation
- Eduardo De Mesa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
- Publication number 20250201761
- Publication date Jun 19, 2025
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
- Publication number 20250167183
- Publication date May 22, 2025
- Intel Corporation
- David O'SULLIVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250157941
- Publication date May 15, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250132259
- Publication date Apr 24, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20240429221
- Publication date Dec 26, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...
- Publication number 20240429117
- Publication date Dec 26, 2024
- Intel Corporation
- Harshit DHAKAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20240405433
- Publication date Dec 5, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE ANTENNA ESD PROTECTION USING INTEGRATED POLYMER NAN...
- Publication number 20240364002
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPHERICAL ANTENNA ARRANGEMENT WITH Z-DIMENSIONAL PLATED ANTENNA STR...
- Publication number 20240364023
- Publication date Oct 31, 2024
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE WITH CAPACITIVE COUPLING
- Publication number 20240364000
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...
- Publication number 20240363567
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
- Publication number 20240363556
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...
- Publication number 20240355697
- Publication date Oct 24, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
- Publication number 20240194552
- Publication date Jun 13, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...
- Publication number 20240128202
- Publication date Apr 18, 2024
- Intel Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
- Publication number 20240128223
- Publication date Apr 18, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-FIRST LAYERED PACKAGING ARCHITECTURE
- Publication number 20230411348
- Publication date Dec 21, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
- Publication number 20230343766
- Publication date Oct 26, 2023
- Intel Corporation
- David O'SULLIVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
- Publication number 20230317551
- Publication date Oct 5, 2023
- Intel Corporation
- Vishnu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING
- Publication number 20230317562
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE
- Publication number 20230317621
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROOVED PACKAGE
- Publication number 20230317536
- Publication date Oct 5, 2023
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAYERS FOR STRESS MONITORING AND METHOD
- Publication number 20230307300
- Publication date Sep 28, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
- Publication number 20230299032
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT...
- Publication number 20230299043
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299014
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS

Bernd Waidhas

Person

Patents Grantslast 30 patents

Fan out package with integrated peripheral devices and methods

Bare-die smart bridge connected with copper pillars for system-in-p...

Microelectronic assemblies having topside power delivery structures

Fan out packaging pop mechanical attach method

Microelectronic assemblies having topside power delivery structures

Antenna with graded dielectirc and method of making the same

Assembly of 2XD module using high density interconnect bridges

Method to implement wafer-level chip-scale packages with grounded c...

Stress relief die implementation

Package formation methods including coupling a molded routing layer...

Fan out package with integrated peripheral devices and methods

Printed wiring-board islands for connecting chip packages and metho...

Semiconductor packages, and methods for forming semiconductor packages

Fan out packaging pop mechanical attach method

Chip scale thin 3D die stacked package

Fan out package and methods

Systems, methods, and apparatuses for implementing reduced height s...

Magnetic coils in locally thinned silicon bridges and methods of as...

Fan out package with integrated peripheral devices and methods

Fan out package-on-package with adhesive die attach

Patch antennas stitched to systems in packages and methods of assem...

Bare-die smart bridge connected with copper pillars for system-in-p...

Face-up fan-out electronic package with passive components using a...

Vertical and lateral interconnects between dies

Lead frame with angular deflections and wrapped printed wiring boar...

Printed wiring-board islands for connecting chip packages and metho...

Semiconductor inductors

Antenna with graded dielectirc and method of making the same

Monolithic silicon bridge stack including a hybrid baseband die sup...

Component magnetic shielding for microelectronic devices

Patents Applicationslast 30 patents

STIFFENER ASSEMBLY

Active Cooling for Heterogenous Packages

SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION

FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...

ANTENNA MODULES AND COMMUNICATION DEVICES

MILLIMETER WAVE ANTENNA ESD PROTECTION USING INTEGRATED POLYMER NAN...

SPHERICAL ANTENNA ARRANGEMENT WITH Z-DIMENSIONAL PLATED ANTENNA STR...

ANTENNA MODULE WITH CAPACITIVE COUPLING

RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...

INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION

PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...

FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS

METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...

ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES

CHIP-FIRST LAYERED PACKAGING ARCHITECTURE

FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD

HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

THIN CLIENT FORM FACTOR ASSEMBLY

DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING

GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE

THREE-DIMENSIONAL STACK COOLING WINGS

GROOVED PACKAGE

PACKAGE LAYERS FOR STRESS MONITORING AND METHOD

MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS

PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT...

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS