Bill Ahearn

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Boca Raton, FL, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,421,254
- Issue date Jul 16, 2002
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,266,246
- Issue date Jul 24, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for semiconductor die carrier
- Patent number 6,031,720
- Issue date Feb 29, 2000
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,016,256
- Issue date Jan 18, 2000
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-chip module having interconnect dies
- Publication number 20020176238
- Publication date Nov 28, 2002
- The Panda Project, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module having interconnect dies
- Publication number 20010040792
- Publication date Nov 15, 2001
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS