Bin Lin

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Hummelstown, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Cable assembly with dielectric clamshell connector for impedance co...
- Patent number 11,239,611
- Issue date Feb 1, 2022
- TE Connectivity Services GmbH
- Bin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-pad for a printed circuit board
- Patent number 10,925,150
- Issue date Feb 16, 2021
- TE Connectivity Corporation
- Bin Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer connector assembly
- Patent number 8,215,966
- Issue date Jul 10, 2012
- Tyco Electronics Corporation
- Bruce Allen Champion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector system having contact overlapping vias
- Patent number 8,007,287
- Issue date Aug 30, 2011
- Tyco Electronics Corporation
- Bruce Allen Champion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CABLE ASSEMBLY WITH DIELECTRIC CLAMSHELL CONNECTOR FOR IMPEDANCE CO...
- Publication number 20210328387
- Publication date Oct 21, 2021
- Bin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE CONTROL CONNECTOR
- Publication number 20210257786
- Publication date Aug 19, 2021
- Nicholas Lee EVANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-PAD FOR A PRINTED CIRCUIT BOARD
- Publication number 20210022240
- Publication date Jan 21, 2021
- TE Connectivity Corporation
- Bin Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER CONNECTOR ASSEMBLY
- Publication number 20110256743
- Publication date Oct 20, 2011
- Tyco Electronics Corporation
- Bruce Allen Champion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR SYSTEM HAVING CONTACT OVERLAPPING VIAS
- Publication number 20110230067
- Publication date Sep 22, 2011
- Tyco Electronics Corporation
- Bruce Allen Champion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR