Bin Mu

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Two-dimensional metal-organic framework alloy photocatalysts
- Patent number 11,753,731
- Issue date Sep 12, 2023
- Arizona Board of Regents on behalf of Arizona State University
- Bin Mu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Phototunable metal-organic framework compositions, and methods of s...
- Patent number 9,716,239
- Issue date Jul 25, 2017
- ARIZONA BOARD OF REGENTS ON BEHALF OF ARI
- Bin Mu
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES
- Publication number 20250218926
- Publication date Jul 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...
- Publication number 20250192070
- Publication date Jun 12, 2025
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PR...
- Publication number 20240222130
- Publication date Jul 4, 2024
- Intel Corporation
- Shaojiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219660
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- G02 - OPTICS
Information Patent Application
GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA
- Publication number 20240203806
- Publication date Jun 20, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FILM PHOTORESIST WET LAMINATION AND METHOD
- Publication number 20240203853
- Publication date Jun 20, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL METAL-ORGANIC FRAMEWORK ALLOY PHOTOCATALYSTS
- Publication number 20230383427
- Publication date Nov 30, 2023
- Bin Mu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TWO-DIMENSIONAL METAL-ORGANIC FRAMEWORK ALLOY PHOTOCATALYSTS
- Publication number 20200354845
- Publication date Nov 12, 2020
- Bin Mu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TWO-DIMENSIONAL METAL-ORGANIC-FRAMEWORKS
- Publication number 20190276476
- Publication date Sep 12, 2019
- Bohan Shan
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PHOTOTUNABLE METAL-ORGANIC FRAMEWORK COMPOSITIONS, AND METHODS OF S...
- Publication number 20170092879
- Publication date Mar 30, 2017
- Arizona Board of Regents on behalf of Arizona State University
- Bin Mu
- C07 - ORGANIC CHEMISTRY

Person

Patents Grantslast 30 patents

Two-dimensional metal-organic framework alloy photocatalysts

Phototunable metal-organic framework compositions, and methods of s...

Patents Applicationslast 30 patents

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

CONTROLLING SUBSTRATE BUMP HEIGHT

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PR...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA

DRY FILM PHOTORESIST WET LAMINATION AND METHOD

TWO-DIMENSIONAL METAL-ORGANIC FRAMEWORK ALLOY PHOTOCATALYSTS

TWO-DIMENSIONAL METAL-ORGANIC FRAMEWORK ALLOY PHOTOCATALYSTS

TWO-DIMENSIONAL METAL-ORGANIC-FRAMEWORKS

PHOTOTUNABLE METAL-ORGANIC FRAMEWORK COMPOSITIONS, AND METHODS OF S...