Binbin ZHENG

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board having a sacrificial pad to mitigate galvanic...
- Patent number 12,193,166
- Issue date Jan 7, 2025
- SanDisk Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,901,260
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive bumps to improve EMI/RFI...
- Patent number 11,784,135
- Issue date Oct 10, 2023
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,444,001
- Issue date Sep 13, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including optically connected wafer stack
- Patent number 10,734,354
- Issue date Aug 4, 2020
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method, and device for network load balance processing
- Patent number 10,313,247
- Issue date Jun 4, 2019
- WANGSU SCIENCE & TECHNOLOGY CO., LTD
- Xionglin Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS
- Publication number 20230402361
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD HAVING A SACRIFICIAL PAD TO MITIGATE GALVANIC...
- Publication number 20230337372
- Publication date Oct 19, 2023
- Western Digital Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME
- Publication number 20220415750
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...
- Publication number 20220406726
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD BALANCING METHOD, DEVICE AND SYSTEM
- Publication number 20210203604
- Publication date Jul 1, 2021
- WANGSU SCIENCE & TECHNOLOGY CO., LTD.
- Yudong ZHUANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK
- Publication number 20190198479
- Publication date Jun 27, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM, METHOD, AND DEVICE FOR NETWORK LOAD BALANCE PROCESSING
- Publication number 20180109456
- Publication date Apr 19, 2018
- WANGSU SCIENCE & TECHNOLOGY CO.,LTD.
- Xionglin CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Binbin ZHENG

Person

Patents Grantslast 30 patents

Printed circuit board having a sacrificial pad to mitigate galvanic...

Thermoelectric semiconductor device and method of making same

Semiconductor device including conductive bumps to improve EMI/RFI...

Thermoelectric semiconductor device and method of making same

Semiconductor device including optically connected wafer stack

System, method, and device for network load balance processing

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

PRINTED CIRCUIT BOARD HAVING A SACRIFICIAL PAD TO MITIGATE GALVANIC...

THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...

LOAD BALANCING METHOD, DEVICE AND SYSTEM

SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK

SYSTEM, METHOD, AND DEVICE FOR NETWORK LOAD BALANCE PROCESSING