Bo-Ru Yang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having liquid-cooling lid
- Patent number 12,087,664
- Issue date Sep 10, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with dummy thermal features on interposer
- Patent number 12,021,068
- Issue date Jun 25, 2024
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having liquid-cooling lid
- Patent number 11,640,930
- Issue date May 2, 2023
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal device and method of manufacture thereof
- Patent number 8,830,423
- Issue date Sep 9, 2014
- Merck Patent GmbH
- Bo-Ru Yang
- G02 - OPTICS
Information Patent Grant
Camphor-derived compounds, method for manufacturing the same, and a...
- Patent number 8,609,839
- Issue date Dec 17, 2013
- National Tsing Hua University
- Biing-Jiun Uang
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Dielectric ceramic composition
- Patent number 8,178,458
- Issue date May 15, 2012
- National Taiwan University Technology
- Sea-Fue Wang
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, METHOD OF FORMING THE SAME AND SEM...
- Publication number 20240274517
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Fa-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20240196537
- Publication date Jun 13, 2024
- MEDIATEK INC.
- Hui-Chi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230282625
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20230282626
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Tai-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230260866
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Yin-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING LIQUID-COOLING LID
- Publication number 20230238302
- Publication date Jul 27, 2023
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230197667
- Publication date Jun 22, 2023
- MEDIATEK INC.
- Yu-Jin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONFIGURABLE TO PERFORM ADAPTIVE THERMAL CEILING...
- Publication number 20230185280
- Publication date Jun 15, 2023
- MEDIATEK INC.
- Chih-Fu Tsai
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20230046413
- Publication date Feb 16, 2023
- MEDIATEK INC.
- Tai-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220328378
- Publication date Oct 13, 2022
- MEDIATEK INC.
- Bo-Jiun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DUMMY THERMAL FEATURES ON INTERPOSER
- Publication number 20220199593
- Publication date Jun 23, 2022
- MEDIATEK INC.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING LIQUID-COOLING LID
- Publication number 20210074608
- Publication date Mar 11, 2021
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMPHOR-DERIVED COMPOUNDS, METHOD FOR MANUFACTURING THE SAME, AND A...
- Publication number 20120077976
- Publication date Mar 29, 2012
- Biing-Jiun UANG
- C07 - ORGANIC CHEMISTRY
Information Patent Application
DIELECTRIC CERAMIC COMPOSITION
- Publication number 20110130268
- Publication date Jun 2, 2011
- NATIONAL TAIPEI UNIVERSITY TECHNOLOGY
- Sea-Fue WANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
LIQUID CRYSTAL DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20110037938
- Publication date Feb 17, 2011
- MERCK PATENT GESELLSCHAFT BESCHRANKTER HAFTUNG
- Peter Raynes
- G02 - OPTICS
Information Patent Application
ORGANIC ELECTROLUMINESCENCE DEVICE
- Publication number 20100109519
- Publication date May 6, 2010
- CHUNGHWA PICTURE TUBES, LTD.
- An-Chi Wei
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ORGANIC ELECTROLUMINESCENCE DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20080100201
- Publication date May 1, 2008
- CHUNGHWA PICTURE TUBES, LTD.
- An-Chi Wei
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Reflective liquid crystal display devices integrating self-emitting...
- Publication number 20070146588
- Publication date Jun 28, 2007
- Industrial Technology Research Institute
- Bo-Ru Yang
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Semiconductor package having liquid-cooling lid

Semiconductor device with dummy thermal features on interposer

Semiconductor package having liquid-cooling lid

Liquid crystal device and method of manufacture thereof

Camphor-derived compounds, method for manufacturing the same, and a...

Dielectric ceramic composition

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE, METHOD OF FORMING THE SAME AND SEM...

SEMICONDUCTOR PACKAGE ASSEMBLY

SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING LIQUID-COOLING LID

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT CONFIGURABLE TO PERFORM ADAPTIVE THERMAL CEILING...

SEMICONDUCTOR PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH DUMMY THERMAL FEATURES ON INTERPOSER

SEMICONDUCTOR PACKAGE HAVING LIQUID-COOLING LID

CAMPHOR-DERIVED COMPOUNDS, METHOD FOR MANUFACTURING THE SAME, AND A...

DIELECTRIC CERAMIC COMPOSITION

LIQUID CRYSTAL DEVICE AND METHOD OF MANUFACTURE THEREOF

ORGANIC ELECTROLUMINESCENCE DEVICE

ORGANIC ELECTROLUMINESCENCE DEVICE AND FABRICATING METHOD THEREOF

Reflective liquid crystal display devices integrating self-emitting...