Bo Yang

Person

Dublin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective enclosure for an electronic device
- Patent number 12,016,111
- Issue date Jun 18, 2024
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enclosure fitting for electronic device
- Patent number 11,985,782
- Issue date May 14, 2024
- Western Digital Technologies, Inc.
- Bo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip bump with multi-PI opening
- Patent number 11,978,713
- Issue date May 7, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with heat transfer pedestal having optimized inte...
- Patent number 11,908,495
- Issue date Feb 20, 2024
- Western Digital Technologies, Inc.
- Bo Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device package having cover portion with curved surfa...
- Patent number 11,551,991
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including magnetic hold-down layer
- Patent number 11,177,242
- Issue date Nov 16, 2021
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT
- Publication number 20240304518
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...
- Publication number 20240260194
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
- Publication number 20240249950
- Publication date Jul 25, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS
- Publication number 20230402361
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
A DEVICE AND A METHOD OF MANUFACTURING A DEVICE, SUCH AS A LIQUID L...
- Publication number 20230393310
- Publication date Dec 7, 2023
- Corning Incorporated
- Naigeng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
- Publication number 20230395446
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Bump With Multi-PI Opening
- Publication number 20230378112
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH HEAT TRANSFER PEDESTAL HAVING OPTIMIZED INTE...
- Publication number 20230343370
- Publication date Oct 26, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- G11 - INFORMATION STORAGE
Information Patent Application
PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE
- Publication number 20230345614
- Publication date Oct 26, 2023
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enclosure fitting for electronic device
- Publication number 20230328910
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...
- Publication number 20230170312
- Publication date Jun 1, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Having Multi-Layer Molding Compound an...
- Publication number 20230101826
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING COVER PORTION WITH CURVED SURFA...
- Publication number 20210384099
- Publication date Dec 9, 2021
- Western Digital Technologies, Inc.
- Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MAGNETIC HOLD-DOWN LAYER
- Publication number 20200411477
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC GLASS LAMINATES
- Publication number 20200001576
- Publication date Jan 2, 2020
- Corning Incorporated
- Thomas Michael Cleary
- B60 - VEHICLES IN GENERAL

Person

Patents Grantslast 30 patents

Semiconductor device including a suspended reinforcing layer and me...

Protective enclosure for an electronic device

Enclosure fitting for electronic device

Flip chip bump with multi-PI opening

Semiconductor device package having multi-layer molding compound an...

Electronic device with heat transfer pedestal having optimized inte...

Semiconductor device package having cover portion with curved surfa...

Semiconductor device including magnetic hold-down layer

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT

SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...

SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

A DEVICE AND A METHOD OF MANUFACTURING A DEVICE, SUCH AS A LIQUID L...

MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK

Flip Chip Bump With Multi-PI Opening

ELECTRONIC DEVICE WITH HEAT TRANSFER PEDESTAL HAVING OPTIMIZED INTE...

PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE

Enclosure fitting for electronic device

SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...

Semiconductor Device Package Having Multi-Layer Molding Compound an...

SEMICONDUCTOR DEVICE PACKAGE HAVING COVER PORTION WITH CURVED SURFA...

SEMICONDUCTOR DEVICE INCLUDING MAGNETIC HOLD-DOWN LAYER

ASYMMETRIC GLASS LAMINATES