Bo-Yuan Su

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including deep trench isolation structure comp...
- Patent number 12,046,615
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yung-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure and method of fabricating the same
- Patent number 11,929,418
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure and method of fabricating the same
- Patent number 11,881,518
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation structures resistant to cracking
- Patent number 11,302,734
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,239,082
- Issue date Feb 1, 2022
- United Microelectronics Corp.
- I-Fan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure and method of fabricating the same
- Patent number 11,205,705
- Issue date Dec 21, 2021
- United Microelectronics Corp.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having charge-absorbing structure disposed ov...
- Patent number 10,840,328
- Issue date Nov 17, 2020
- Vanguard International Semiconductor Corporation
- Jui-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing gate stack structure
- Patent number 10,468,493
- Issue date Nov 5, 2019
- United Microelectronics Corp.
- Chun-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,388,749
- Issue date Aug 20, 2019
- United Microelectronics Corp.
- Yen-Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,366,896
- Issue date Jul 30, 2019
- United Microelectronics Corp.
- I-Fan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal gate
- Patent number 10,186,594
- Issue date Jan 22, 2019
- United Microelectronics Corp.
- Chun-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 10,170,573
- Issue date Jan 1, 2019
- United Microelectronics Corp.
- Chun-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having void between gate electrode and sidewal...
- Patent number 10,062,764
- Issue date Aug 28, 2018
- United Microelectronics Corp.
- Yen-Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible device
- Patent number 9,786,790
- Issue date Oct 10, 2017
- Industrial Technology Research Institute
- Ching-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitors for leakage current improvement
- Patent number 9,543,152
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method
- Patent number 9,356,060
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ho Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming backside illuminated image sensor device str...
- Patent number 9,129,878
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240347571
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yung-Hsiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep Trench Isolation Structures Resistant to Cracking
- Publication number 20220238572
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220077300
- Publication date Mar 10, 2022
- UNITED MICROELECTRONICS CORP.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220069102
- Publication date Mar 3, 2022
- UNITED MICROELECTRONICS CORP.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20210366954
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Yung-Hsiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20200365686
- Publication date Nov 19, 2020
- Vanguard International Semiconductor Corporation
- Jui-Chun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURES
- Publication number 20200185138
- Publication date Jun 11, 2020
- Vanguard International Semiconductor Corporation
- Chien-Nan LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20200144387
- Publication date May 7, 2020
- UNITED MICROELECTRONICS CORP.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep Trench Isolation Structures Resistant to Cracking
- Publication number 20200006410
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20190295849
- Publication date Sep 26, 2019
- UNITED MICROELECTRONICS CORP.
- I-Fan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GATE STACK STRUCTURE
- Publication number 20190109202
- Publication date Apr 11, 2019
- UNITED MICROELECTRONICS CORP.
- Chun-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190043725
- Publication date Feb 7, 2019
- UNITED MICROELECTRONICS CORP.
- I-Fan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190006484
- Publication date Jan 3, 2019
- UNITED MICROELECTRONICS CORP.
- Yen-Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METAL GATE
- Publication number 20180358448
- Publication date Dec 13, 2018
- UNITED MICROELECTRONICS CORP.
- Chun-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE DEVICE
- Publication number 20170170329
- Publication date Jun 15, 2017
- Industrial Technology Research Institute
- Ching-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITORS FOR LEAKAGE CURRENT IMPROVEMENT
- Publication number 20160005805
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE STR...
- Publication number 20150076638
- Publication date Mar 19, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Bo-Chang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Device and Method
- Publication number 20140264701
- Publication date Sep 18, 2014
- Chih-Ho Tai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device including deep trench isolation structure comp...

Metal gate structure and method of fabricating the same

Metal gate structure and method of fabricating the same

Deep trench isolation structures resistant to cracking

Method for fabricating semiconductor device

Metal gate structure and method of fabricating the same

Semiconductor devices having charge-absorbing structure disposed ov...

Method for manufacturing gate stack structure

Manufacturing method of semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device having metal gate

Semiconductor device and fabrication method thereof

Semiconductor device having void between gate electrode and sidewal...

Flexible device

MIM capacitors for leakage current improvement

Image sensor device and method

Mechanisms for forming backside illuminated image sensor device str...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

Deep Trench Isolation Structures Resistant to Cracking

METAL GATE STRUCTURE AND METHOD OF FABRICATING THE SAME

METAL GATE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

INDUCTOR STRUCTURES

METAL GATE STRUCTURE AND METHOD OF FABRICATING THE SAME

Deep Trench Isolation Structures Resistant to Cracking

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING GATE STACK STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING METAL GATE

FLEXIBLE DEVICE

MIM CAPACITORS FOR LEAKAGE CURRENT IMPROVEMENT

MECHANISMS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE STR...

Image Sensor Device and Method