Boon Yew Low

Person

Petaling Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Conduit inserts for encapsulant compound formulation kneading and e...
- Patent number 11,787,097
- Issue date Oct 17, 2023
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit modules with front-side interposer terminals and through-mo...
- Patent number 11,581,241
- Issue date Feb 14, 2023
- NXP USA, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond wire reinforcement structure
- Patent number 11,056,457
- Issue date Jul 6, 2021
- NXP USA, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having bent leads and method for forming
- Patent number 9,947,614
- Issue date Apr 17, 2018
- NXP USA, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with sewn interconnects
- Patent number 9,418,929
- Issue date Aug 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming multilayer device having solder filled via conne...
- Patent number 9,351,407
- Issue date May 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded die ball grid array package
- Patent number 9,299,675
- Issue date Mar 29, 2016
- Freescale Semiconductor,INC
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-use substrate for integrated circuit
- Patent number 9,190,355
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated through holes
- Patent number 9,165,862
- Issue date Oct 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump and flip chip package using same
- Patent number 9,159,682
- Issue date Oct 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die ball grid array package
- Patent number 9,034,694
- Issue date May 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold cap for semiconductor device
- Patent number 9,030,000
- Issue date May 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with corner tie bars
- Patent number 9,000,570
- Issue date Apr 7, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with power bar for semiconductor device
- Patent number 8,933,547
- Issue date Jan 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar powered IC chip
- Patent number 8,809,078
- Issue date Aug 19, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 8,802,508
- Issue date Aug 12, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate with crimping interconnection
- Patent number 8,698,288
- Issue date Apr 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor die with power rail pads
- Patent number 8,643,189
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented substrate for semiconductor device
- Patent number 8,338,236
- Issue date Dec 25, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of testing same
- Patent number 8,338,828
- Issue date Dec 25, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with protective tape
- Patent number 8,237,293
- Issue date Aug 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Tzu Ling Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold and substrate for use with mold
- Patent number 8,198,143
- Issue date Jun 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for molding substrate
- Patent number 8,062,424
- Issue date Nov 22, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Vermal Raja Manikam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold and substrate for use with mold
- Patent number 7,956,471
- Issue date Jun 7, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND E...
- Publication number 20230415397
- Publication date Dec 28, 2023
- NXP USA, Inc.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND E...
- Publication number 20220250301
- Publication date Aug 11, 2022
- NXP USA, Inc.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MO...
- Publication number 20220208646
- Publication date Jun 30, 2022
- NXP USA, Inc.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BOND WIRE REINFORCEMMENT STRUCTURE
- Publication number 20200105709
- Publication date Apr 2, 2020
- NXP USA, Inc.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING BENT LEADS AND METHOD FOR FORMING
- Publication number 20170263538
- Publication date Sep 14, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan ORATTI KALANDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERPOSER FOR PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20160071789
- Publication date Mar 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Pei Fan Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMES HAVING METAL TRACES WITH METAL STUBS
- Publication number 20150311143
- Publication date Oct 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT
- Publication number 20150303137
- Publication date Oct 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE BALL GRID ARRAY PACKAGE
- Publication number 20150243621
- Publication date Aug 27, 2015
- NAVAS KHAN ORATTI KALANDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CORNER TOP GATE MOLDING
- Publication number 20150118802
- Publication date Apr 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SIDE VENTED PRESSURE SENSOR DEVICE
- Publication number 20150076630
- Publication date Mar 19, 2015
- Boon Yew Low
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COPPER PILLAR BUMP AND FLIP CHIP PACKAGE USING SAME
- Publication number 20150069603
- Publication date Mar 12, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CORNER TIE BARS
- Publication number 20150014831
- Publication date Jan 15, 2015
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET
- Publication number 20140374891
- Publication date Dec 25, 2014
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD CAP FOR SEMICONDUCTOR DEVICE
- Publication number 20140367840
- Publication date Dec 18, 2014
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR POWERED IC CHIP
- Publication number 20140225211
- Publication date Aug 14, 2014
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20140147975
- Publication date May 29, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS
- Publication number 20140021621
- Publication date Jan 23, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED SUBSTRATE FOR SEMICONDUCTOR DEVICE
- Publication number 20120319245
- Publication date Dec 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING SAME
- Publication number 20120032167
- Publication date Feb 9, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew LOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD AND SUBSTRATE FOR USE WITH MOLD
- Publication number 20110244637
- Publication date Oct 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
- Publication number 20110121468
- Publication date May 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Tzu Ling WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MOLDING SUBSTRATE
- Publication number 20110115125
- Publication date May 19, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Vermal Raja MANIKAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD AND SUBSTRATE FOR USE WITH MOLD
- Publication number 20100117202
- Publication date May 13, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Boon Yew Low

Person

Patents Grantslast 30 patents

Conduit inserts for encapsulant compound formulation kneading and e...

Circuit modules with front-side interposer terminals and through-mo...

Semiconductor device with bond wire reinforcement structure

Packaged semiconductor device having bent leads and method for forming

Integrated circuit with sewn interconnects

Method for forming multilayer device having solder filled via conne...

Embedded die ball grid array package

Multi-use substrate for integrated circuit

Semiconductor device with plated through holes

Copper pillar bump and flip chip package using same

Embedded die ball grid array package

Mold cap for semiconductor device

Semiconductor device with corner tie bars

Lead frame with power bar for semiconductor device

Solar powered IC chip

Semiconductor device package

Flexible substrate with crimping interconnection

Packaged semiconductor die with power rail pads

Vented substrate for semiconductor device

Semiconductor package and method of testing same

Semiconductor package with protective tape

Mold and substrate for use with mold

Method and apparatus for molding substrate

Mold and substrate for use with mold

Patents Applicationslast 30 patents

CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND E...

CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND E...

CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MO...

SEMICONDUCTOR DEVICE WITH BOND WIRE REINFORCEMMENT STRUCTURE

PACKAGED SEMICONDUCTOR DEVICE HAVING BENT LEADS AND METHOD FOR FORMING

MOLDED INTERPOSER FOR PACKAGED SEMICONDUCTOR DEVICE

LEAD FRAMES HAVING METAL TRACES WITH METAL STUBS

MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT

EMBEDDED DIE BALL GRID ARRAY PACKAGE

DUAL CORNER TOP GATE MOLDING

SIDE VENTED PRESSURE SENSOR DEVICE

COPPER PILLAR BUMP AND FLIP CHIP PACKAGE USING SAME

SEMICONDUCTOR DEVICE WITH CORNER TIE BARS

SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET

MOLD CAP FOR SEMICONDUCTOR DEVICE

SOLAR POWERED IC CHIP

SEMICONDUCTOR DEVICE PACKAGE

PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS

VENTED SUBSTRATE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING SAME

MOLD AND SUBSTRATE FOR USE WITH MOLD

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME

METHOD AND APPARATUS FOR MOLDING SUBSTRATE

MOLD AND SUBSTRATE FOR USE WITH MOLD