The present invention relates generally to semiconductor packaging, and more particularly to an improved semiconductor package that has reduced susceptibility to cracking and a method of making the package.
As is well known, integrated circuits are formed on semiconductor dies. Such circuits are formed with multiple layers of materials, e.g., conductors and insulators that interconnect tiny transistors. The dies can be fragile and so must be protected. Further, because the dies are so small, they often are attached to a substrate that is used to interconnect the circuit formed in the die to other circuits. For example, the dies are susceptible to cracking especially at the corners caused by handling and pick-and-place machinery.
Referring now to
As discussed above, it is important that the die 12 is protected from damage during handling. One way to test the package integrity is to drop a weight 18 having a tip 20 on a corner of the die 12 to test the susceptibility of the die 12 to cracking.
Referring now to
It would be advantageous to have a packaged device in which the risk of the die cracking was substantially reduced or eliminated.
The present invention is illustrated by way of example and is not limited by the accompanying figures, in which like references indicate similar elements. Elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale.
In one embodiment, the present invention provides a method for packaging a semiconductor die. The method includes attaching the semiconductor die to a substrate and disposing an underfill material between the semiconductor die and the substrate. Next, the die is covered with a piece of tape. The tape extends from a top side of the semiconductor die to the substrate.
In another embodiment, the present invention is a packaged semiconductor device. The device includes a semiconductor die attached to a substrate. An underfill material is disposed between the semiconductor die and the substrate. A tape is placed over the die and covers the die. The tape extends from a top side of the semiconductor die to the substrate.
In yet another embodiment, the present invention provides an improved packaged semiconductor device. The device includes a semiconductor die attached to a substrate. An underfill material is disposed between the semiconductor die and the substrate. A tape covers the semiconductor die. Preferably the tape extends from a top side of the semiconductor die to the substrate. The tape includes air bubbles trapped within its side portions, that is, those portions of the tape that that extend from the die top to the substrate.
Referring now to
In the embodiment shown, the die 42 is electrically connected and attached to the substrate with a plurality of conductive balls 46 with a ball attach and reflow process. Such means for connecting and attaching a die to a substrate are well known to those of skill in the art so further description is not necessary for a complete understanding of the invention. Further, other means of attaching and connecting the die to the substrate also are known in the art and the present invention is not meant to be limited to the manner in which the die is connected to the substrate. An underfill material 48 is disposed between the semiconductor die 42 and the substrate 44. Underfill materials also are known in the art as are the manners of disposing the underfill material between the die and the substrate. Typical underfill materials are polymeric materials like liquid epoxy resin. In the embodiment shown, the underfill material 48 extends to less than about half-way up the die 42. However, the underfill material could extend higher (as shown in
A piece of tape 50 is placed over the die 42 and covers the die 42 and the underfill material 48 that is disposed outside of the area between the semiconductor die 42 and the substrate 44. That is, the tape 50 extends over the top side of the semiconductor die 42 and down both sides of the die 42 to the substrate 44. Here, the top side of the die refers to the die back side or the side of the die that does not have bond pads. The tape 50 may be provided on a reel (as discussed below with reference to
Referring now to
By now it should be appreciated that there has been provided an improved semiconductor package and a method of making the improved semiconductor package. Circuit details are not disclosed because knowledge thereof is not required for a complete understanding of the invention. Although the invention has been described using relative terms such as “front,” “back,” “top,” “bottom,” “over,” “under” and the like in the description and in the claims, such terms are used for descriptive purposes and not necessarily for describing permanent relative positions. It is understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other orientations than those illustrated or otherwise described herein.
Unless stated otherwise, terms such as “first” and “second” are used to arbitrarily distinguish between the elements such terms describe. Thus, these terms are not necessarily intended to indicate temporal or other prioritization of such elements. Further, the terms “a” or “an,” as used herein, are defined as one or more than one. Also, the use of introductory phrases such as “at least one” and “one or more” in the claims should not be construed to imply that the introduction of another claim element by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim element to inventions containing only one such element, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an.” The same holds true for the use of definite articles.
Although the invention is described herein with reference to specific embodiments, various modifications and changes can be made without departing from the scope of the present invention as set forth in the claims below. For example, the height of the underfill material relative to the height of the die may vary. Also, the air bubbles trapped between the tape and the underfill material are not necessary, and such air bubbles could be bled off before encapsulating the die with the encapsulation material. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of the present invention. Any benefits, advantages, or solutions to problems that are described herein with regard to specific embodiments are not intended to be construed as a critical, required, or essential feature or element of any or all the claims.
Number | Date | Country | Kind |
---|---|---|---|
PI 20095012 | Nov 2009 | MY | national |