Boping XIE

Person

San Ramon, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical transceiver integrated circuit
- Patent number 12,052,058
- Issue date Jul 30, 2024
- Intel Corporation
- Alexander Krichevsky
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical receiver package with backside lens-integrated photodetecto...
- Patent number 11,251,228
- Issue date Feb 15, 2022
- Intel Corporation
- Boping Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning LIDAR system using a curved rotating surface
- Patent number 10,838,042
- Issue date Nov 17, 2020
- Vipul Dutt Badoni
- G01 - MEASURING TESTING
Information Patent Grant
Photonic package with a bridge between a photonic die and an optica...
- Patent number 10,598,875
- Issue date Mar 24, 2020
- Intel Corporation
- Boping Xie
- G02 - OPTICS
Information Patent Grant
OSA cage with reinforced connection to PCB
- Patent number 9,405,082
- Issue date Aug 2, 2016
- Lumentum Operations LLC
- Rui Zhou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module including a clamp
- Patent number 9,122,030
- Issue date Sep 1, 2015
- JDS Uniphase Corporation
- Boping Xie
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR OPTICAL ALIGNMENT FOR PHOTONIC INTEGRATED...
- Publication number 20240361541
- Publication date Oct 31, 2024
- Intel Corporation
- Alexander Krichevsky
- G02 - OPTICS
Information Patent Application
NOVEL DESIGN FOR FIBER ARRAY UNIT (FAU) FOR OPTICAL TRANSCEIVER PRO...
- Publication number 20240069287
- Publication date Feb 29, 2024
- Intel Corporation
- Vinod ADIVARAHAN
- G02 - OPTICS
Information Patent Application
PACKAGE WITH MULTIPLE PHOTONIC INTEGRATED CIRCUIT DIES OPTICALLY CO...
- Publication number 20230318247
- Publication date Oct 5, 2023
- Intel Corporation
- Eleanor Patricia Paras RABADAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A BEAM EXPANSION AND COLLIMATION FOR PHOTONIC INTE...
- Publication number 20230204877
- Publication date Jun 29, 2023
- Intel Corporation
- John M. Heck
- G02 - OPTICS
Information Patent Application
THERMAL CONTROL FOR CHIP TO CHIP OPTICAL COUPLING
- Publication number 20230204856
- Publication date Jun 29, 2023
- Intel Corporation
- Eredzhep MENUMEROV
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR COUPLING FROM PHOTONIC INTEGRATED CIRCUITS WITH AN...
- Publication number 20230204876
- Publication date Jun 29, 2023
- Intel Corporation
- Alexander Krichevsky
- G02 - OPTICS
Information Patent Application
SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS
- Publication number 20220404474
- Publication date Dec 22, 2022
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- G02 - OPTICS
Information Patent Application
WIRE-BONDING METHODOLOGIES UTILIZING PREFORMED GLASS OPTICAL WIRES...
- Publication number 20220404546
- Publication date Dec 22, 2022
- Intel Corporation
- Alexander Krichevsky
- G02 - OPTICS
Information Patent Application
System, Apparatus And Method For Integrating Laser And Optical Circ...
- Publication number 20220011519
- Publication date Jan 13, 2022
- Boping Xie
- G02 - OPTICS
Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER INTEGRATED CIRCUIT
- Publication number 20210058159
- Publication date Feb 25, 2021
- Intel Corporation
- Alexander Krichevsky
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONIC PACKAGE WITH A BRIDGE BETWEEN A PHOTONIC DIE AND AN OPTICA...
- Publication number 20190137706
- Publication date May 9, 2019
- Intel Corporation
- Boping Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL RECEIVER PACKAGE WITH BACKSIDE LENS-INTEGRATED PHOTODETECTO...
- Publication number 20190123109
- Publication date Apr 25, 2019
- Intel Corporation
- Boping Xie
- G02 - OPTICS
Information Patent Application
Scanning LIDAR System using a curved rotating surface
- Publication number 20180143301
- Publication date May 24, 2018
- Vipul Dutt Badoni
- G01 - MEASURING TESTING
Information Patent Application
OSA CAGE WITH REINFORCED CONNECTION TO PCB
- Publication number 20150086208
- Publication date Mar 26, 2015
- JDS Uniphase Corporation
- Rui ZHOU
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE INCLUDING A CLAMP
- Publication number 20130071072
- Publication date Mar 21, 2013
- Boping XIE
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Optical transceiver integrated circuit

Optical receiver package with backside lens-integrated photodetecto...

Scanning LIDAR system using a curved rotating surface

Photonic package with a bridge between a photonic die and an optica...

OSA cage with reinforced connection to PCB

Optical module including a clamp

Patents Applicationslast 30 patents

APPARATUS AND METHODS FOR OPTICAL ALIGNMENT FOR PHOTONIC INTEGRATED...

NOVEL DESIGN FOR FIBER ARRAY UNIT (FAU) FOR OPTICAL TRANSCEIVER PRO...

PACKAGE WITH MULTIPLE PHOTONIC INTEGRATED CIRCUIT DIES OPTICALLY CO...

TECHNOLOGIES FOR A BEAM EXPANSION AND COLLIMATION FOR PHOTONIC INTE...

THERMAL CONTROL FOR CHIP TO CHIP OPTICAL COUPLING

TECHNOLOGIES FOR COUPLING FROM PHOTONIC INTEGRATED CIRCUITS WITH AN...

SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS

WIRE-BONDING METHODOLOGIES UTILIZING PREFORMED GLASS OPTICAL WIRES...

System, Apparatus And Method For Integrating Laser And Optical Circ...

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

OPTICAL TRANSCEIVER INTEGRATED CIRCUIT

PHOTONIC PACKAGE WITH A BRIDGE BETWEEN A PHOTONIC DIE AND AN OPTICA...

OPTICAL RECEIVER PACKAGE WITH BACKSIDE LENS-INTEGRATED PHOTODETECTO...

Scanning LIDAR System using a curved rotating surface

OSA CAGE WITH REINFORCED CONNECTION TO PCB

OPTICAL MODULE INCLUDING A CLAMP