BOR-CHIUAN HSIEH

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Gap patterning for metal-to-source/drain plugs in a semiconductor d...
- Patent number 11,842,930
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,798,984
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap patterning for metal-to-source/drain plugs in a semiconductor d...
- Patent number 11,355,399
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,239,310
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for supplying a precursor for an atomic layer dep...
- Patent number 11,053,584
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Bor-Chiuan Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Seamless gap fill
- Patent number 10,672,866
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs and methods of forming the same
- Patent number 10,510,867
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bor Chiuan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for supplying a precursor for an atomic layer dep...
- Patent number 10,443,127
- Issue date Oct 15, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Bor-Chiuan Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
FinFETs and methods of forming the same
- Patent number 10,157,997
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bor Chiuan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 10,084,040
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance self aligned contacts and method of forming same
- Patent number 9,437,712
- Issue date Sep 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall free CESL for enlarging ILD gap-fill window
- Patent number 9,218,974
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sidewall-free CESL for enlarging ILD gap-fill window
- Patent number 8,999,834
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of dual epi process for semiconductor device
- Patent number 8,900,957
- Issue date Dec 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dual EPI process for semiconductor device
- Patent number 8,900,956
- Issue date Dec 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dual EPI process for semiconductor device
- Patent number 8,609,497
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS structure with multiple spacers
- Patent number 8,299,508
- Issue date Oct 30, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor Chiuan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a shallow trench isolation structure
- Patent number 7,947,551
- Issue date May 24, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Hong Syue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for preventing silicon hole defect formation a...
- Patent number 6,214,128
- Issue date Apr 10, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bor-Hann Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUMMY HYBRID FILM FOR SELF ALIGNMENT CONTACT FORMATION
- Publication number 20240379815
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bor Chiuan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...
- Publication number 20240145302
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shien SHIAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...
- Publication number 20240087960
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Forming the Same
- Publication number 20230317469
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bor Chiuan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230187530
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Hybrid Film for Self-Alignment Contact Formation
- Publication number 20230163194
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bor Chiuan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...
- Publication number 20220270931
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FILM SCHEME FOR SELF-ALIGNED CONTACT
- Publication number 20220246473
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Gap Fill
- Publication number 20220157934
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...
- Publication number 20210366780
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAMLESS GAP FILL
- Publication number 20200295131
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Supplying a Precursor for an Atomic Layer Dep...
- Publication number 20200040450
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- BOR-CHIUAN HSIEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FinFETs and Methods of Forming the Same
- Publication number 20190140076
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor Chiuan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Gap Fill
- Publication number 20180350906
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFETs and Methods of Forming the Same
- Publication number 20180315830
- Publication date Nov 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor Chiuan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Gap Fill
- Publication number 20170194424
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Performance Self Aligned Contacts and Method of Forming Same
- Publication number 20150255275
- Publication date Sep 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPPLYING A PRECURSOR FOR AN ATOMIC LAYER DEP...
- Publication number 20150125591
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- BOR-CHIUAN HSIEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SIDEWALL-FREE CESL FOR ENLARGING ILD GAP-FILL WINDOW
- Publication number 20140170846
- Publication date Jun 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DUAL EPI PROCESS FOR SEMICONDCUTOR DEVICE
- Publication number 20140073097
- Publication date Mar 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DUAL EPI PROCESS FOR SEMICONDUCTOR DEVICE
- Publication number 20140073096
- Publication date Mar 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall-Free CESL for Enlarging ILD Gap-Fill Window
- Publication number 20130270651
- Publication date Oct 17, 2013
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Dual EPI Process For Semiconductor Device
- Publication number 20110201164
- Publication date Aug 18, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Structure For Semiconductor Device
- Publication number 20110084355
- Publication date Apr 14, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS STRUCTURE WITH MULTIPLE SPACERS
- Publication number 20110031538
- Publication date Feb 10, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor Chiuan HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall-Free CESL for Enlarging ILD Gap-Fill Window
- Publication number 20100314690
- Publication date Dec 16, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS

BOR-CHIUAN HSIEH

Person

Patents Grantslast 30 patents

Gap patterning for metal-to-source/drain plugs in a semiconductor d...

Seamless gap fill

Gap patterning for metal-to-source/drain plugs in a semiconductor d...

Seamless gap fill

System and method for supplying a precursor for an atomic layer dep...

Seamless gap fill

FinFETs and methods of forming the same

System and method for supplying a precursor for an atomic layer dep...

FinFETs and methods of forming the same

Seamless gap fill

High performance self aligned contacts and method of forming same

Sidewall free CESL for enlarging ILD gap-fill window

Sidewall-free CESL for enlarging ILD gap-fill window

Method of dual epi process for semiconductor device

Method of dual EPI process for semiconductor device

Method of dual EPI process for semiconductor device

CMOS structure with multiple spacers

Method of forming a shallow trench isolation structure

Method and apparatus for preventing silicon hole defect formation a...

Patents Applicationslast 30 patents

DUMMY HYBRID FILM FOR SELF ALIGNMENT CONTACT FORMATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...

GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...

Semiconductor Device and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Dummy Hybrid Film for Self-Alignment Contact Formation

GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...

HYBRID FILM SCHEME FOR SELF-ALIGNED CONTACT

Seamless Gap Fill

GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...

SEAMLESS GAP FILL

System and Method for Supplying a Precursor for an Atomic Layer Dep...

FinFETs and Methods of Forming the Same

Seamless Gap Fill

FinFETs and Methods of Forming the Same

Seamless Gap Fill

High Performance Self Aligned Contacts and Method of Forming Same

SYSTEM AND METHOD FOR SUPPLYING A PRECURSOR FOR AN ATOMIC LAYER DEP...

SIDEWALL-FREE CESL FOR ENLARGING ILD GAP-FILL WINDOW

METHOD OF DUAL EPI PROCESS FOR SEMICONDCUTOR DEVICE

METHOD OF DUAL EPI PROCESS FOR SEMICONDUCTOR DEVICE

Sidewall-Free CESL for Enlarging ILD Gap-Fill Window

Method of Dual EPI Process For Semiconductor Device

Isolation Structure For Semiconductor Device

CMOS STRUCTURE WITH MULTIPLE SPACERS

Sidewall-Free CESL for Enlarging ILD Gap-Fill Window