Bor-Ray Su

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,848,233
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar system and related method of scanning remote objects
- Patent number 11,777,509
- Issue date Oct 3, 2023
- TRON FUTURE TECH INC.
- Yu-Jiu Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radar system and related method of scanning remote objects
- Patent number 11,496,141
- Issue date Nov 8, 2022
- TRON FUTURE TECH INC.
- Yu-Jiu Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,289,373
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device and method of making the same
- Patent number 10,700,033
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device of handling block transmission in multicarrier system
- Patent number 10,601,620
- Issue date Mar 24, 2020
- NATIONAL TAIWAN UNIVERSITY
- Yen-Ming Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaging device and method of making the same
- Patent number 10,050,001
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication apparatus and the method thereof
- Patent number 9,942,011
- Issue date Apr 10, 2018
- Industrial Technology Research Institute
- Ming-Fu Tang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ring structure for chip packaging
- Patent number 9,887,144
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing uplink channel estimation and base station usi...
- Patent number 9,755,860
- Issue date Sep 5, 2017
- Industrial Technology Research Institute
- Ming-Hsuan Kao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Shadow pad for post-passivation interconnect structures
- Patent number 9,748,212
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device and method of making the same
- Patent number 9,449,933
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RADAR SYSTEM AND METHOD FOR SCANNING OBJECTS
- Publication number 20240310506
- Publication date Sep 19, 2024
- TRON FUTURE TECH INC.
- YEN-MING HUANG
- G01 - MEASURING TESTING
Information Patent Application
BEAMFORMING ANTENNA DEVICE AND METHOD FOR OPERATING A BEAMFORMING A...
- Publication number 20240178558
- Publication date May 30, 2024
- TRON FUTURE TECH INC.
- KUN-CHIEN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SATELLITE COMMUNICATION SYSTEM HAVING INTERCONNECTED CONSTELLATION...
- Publication number 20230361862
- Publication date Nov 9, 2023
- TRON FUTURE TECH INC.
- YU-JIU WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RADAR SYSTEM AND RELATED METHOD OF SCANNING REMOTE OBJECTS
- Publication number 20220360271
- Publication date Nov 10, 2022
- TRON FUTURE TECH INC.
- Yu-Jiu WANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216103
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADAR SYSTEM AND RELATED METHOD OF SCANNING REMOTE OBJECTS
- Publication number 20210048520
- Publication date Feb 18, 2021
- TRON FUTURE TECH INC.
- Yu-Jiu WANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200043782
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20180350764
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION APPARATUS AND THE METHOD THEREOF
- Publication number 20170331599
- Publication date Nov 16, 2017
- Industrial Technology Research Institute
- Ming-Fu Tang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF PERFORMING UPLINK CHANNEL ESTIMATION AND BASE STATION USI...
- Publication number 20170222835
- Publication date Aug 3, 2017
- Industrial Technology Research Institute
- Ming-Hsuan Kao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Device of Handling Block Transmission in Multicarrier System
- Publication number 20170070996
- Publication date Mar 9, 2017
- National Taiwan University
- Yen-Ming Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGING DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20170005060
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures, Packaged Semiconductor Devices, and Method...
- Publication number 20160322337
- Publication date Nov 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESOURCE ALLOCATION METHOD FOR D2D COMMUNICATIONS, BASE STATION USI...
- Publication number 20150085818
- Publication date Mar 26, 2015
- ASUSTek COMPUTER INC.
- Yen-Ming Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGING DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20130256870
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING STRUCTURE FOR CHIP PACKAGING
- Publication number 20130062752
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate layout method and structure for reducing cross talk of ad...
- Publication number 20020118528
- Publication date Aug 29, 2002
- Bor-Ray Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate layout method and structure for reducing cross talk of ad...
- Publication number 20020074162
- Publication date Jun 20, 2002
- Bor-Ray Su
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Radar system and related method of scanning remote objects

Radar system and related method of scanning remote objects

Semiconductor package and manufacturing method thereof

Packaging device and method of making the same

Device of handling block transmission in multicarrier system

Packaging device and method of making the same

Wireless communication apparatus and the method thereof

Ring structure for chip packaging

Method of performing uplink channel estimation and base station usi...

Shadow pad for post-passivation interconnect structures

Packaging device and method of making the same

Patents Applicationslast 30 patents

RADAR SYSTEM AND METHOD FOR SCANNING OBJECTS

BEAMFORMING ANTENNA DEVICE AND METHOD FOR OPERATING A BEAMFORMING A...

SATELLITE COMMUNICATION SYSTEM HAVING INTERCONNECTED CONSTELLATION...

RADAR SYSTEM AND RELATED METHOD OF SCANNING REMOTE OBJECTS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

RADAR SYSTEM AND RELATED METHOD OF SCANNING REMOTE OBJECTS

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGING DEVICE AND METHOD OF MAKING THE SAME

WIRELESS COMMUNICATION APPARATUS AND THE METHOD THEREOF

METHOD OF PERFORMING UPLINK CHANNEL ESTIMATION AND BASE STATION USI...

Device of Handling Block Transmission in Multicarrier System

PACKAGING DEVICE AND METHOD OF MAKING THE SAME

Interconnect Structures, Packaged Semiconductor Devices, and Method...

RESOURCE ALLOCATION METHOD FOR D2D COMMUNICATIONS, BASE STATION USI...

PACKAGING DEVICE AND METHOD OF MAKING THE SAME

RING STRUCTURE FOR CHIP PACKAGING

Substrate layout method and structure for reducing cross talk of ad...

Substrate layout method and structure for reducing cross talk of ad...