Boris Plikat

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Tegernheim, DE

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component
- Patent number 9,553,051
- Issue date Jan 24, 2017
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a power semiconductor module comprising surfac...
- Patent number 7,955,901
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Redirecting solder material to visually inspectable package surface
- Publication number 20170278762
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20160225717
- Publication date Aug 4, 2016
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20130341780
- Publication date Dec 26, 2013
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFAC...
- Publication number 20090093090
- Publication date Apr 9, 2009
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Arrangement
- Publication number 20080061449
- Publication date Mar 13, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS