Semiconductor Component Arrangement

Abstract

A semiconductor component arrangement having a semiconductor component, a mount, and an adhesive, wherein the adhesive connects the semiconductor component to the mount and the adhesive contains a marker substance. Also disclosed is a method for inspecting the connection of a semiconductor component to a mount. The semiconductor component is fixed on the mount using an adhesive, wherein the adhesive contains a marker substance, the mount with the semiconductor component is cleaned, and the mount is inspected for residues of the adhesive on the basis of radiation which is characteristic of the marker substance.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a cross-section of an exemplary embodiment of a semiconductor component arrangement.

DETAILED DESCRIPTION OF THE DRAWINGS

Semiconductor components, such as integrated circuits or discrete semiconductor components, are, inter alia, connected to a mount with the aid of adhesives. Subsequently the semiconductor component connected to the mount is enveloped by a further substance, whose task it is to insulate the semiconductor component from the surroundings. This enveloping substance can be a moulding compound, for example, which subsequently also gives shape to the semiconductor component arrangement. Such a semiconductor component arrangement is referred to as semiconductor in a housing. Furthermore, semiconductor components can be applied to mounts comprising further semiconductor components and other electronic components. In this case, the mount could be, for example, a printed circuit board on which the semiconductor element is applied, connected using an adhesive and subsequently insulated from the surroundings using a substance. It is similarly possible to apply a semiconductor component on another semiconductor component. This case is referred to as chip-on-chip mounting.

The admixing of a marker substance in the adhesive connecting the semiconductor component to the mount has the particular advantage that defects that occur are recognized easily by means of a simple visual check. Undesired adhesive residues can similarly be recognized by an automatic optical check. If the adhesive is cured in a thermal process, there is a risk that substances from the adhesive mixture will spread thinly on the mount. If a semiconductor component intended to be connected to the mount by means of an adhesive is pressed into the adhesive compound at high pressure, substances from the adhesive mixture can be distributed thinly on the mount. Such a thin distribution, that is to say a film-like spreading of adhesive substances, is referred to as bleed-out.

Marker substances which can be used include both organic and inorganic dyes.

The marker substance used has a proportion by mass in the adhesive of less than about 0.1% in one embodiment.

The marker substance used can be dissolved in the solvent of the adhesive.

The marker substance used can be fluorescent. The marker substance used can have a radiation intensity which is limited to a narrow frequency range.

The adhesive with a marker substance can be used to connect a semiconductor component to a further semiconductor component.

A method for inspecting the connection of a semiconductor component to a mount according to the invention comprises the step of fixing the semiconductor component on the mount using an adhesive. The adhesive contains a marker substance. The mount is inspected for residues of the adhesive after the mount with the connected semiconductor component has been cleaned. Based on the specific characteristics of the marker substance in the adhesive, it is possible to reliably recognize the residues of the adhesive.

Based on the specific characteristics of the marker substance in the adhesive, it is possible to recognize the residues of the adhesive by means of an automatic method.

On account of a high radiation intensity of the marker substance it is possible to carry out a simple and efficient process check.

Embodiments of the invention are illustrated in detail below with reference to the attached drawings, in which FIG. 1 shows an exemplary embodiment of a semiconductor component arrangement.

FIG. 1 shows a semiconductor component 200, a mount 100, an adhesive 300 and bled-out constituents of the adhesive 310. An adhesive 300 connecting the semiconductor component 200 to the mount 100 is applied to the mount 100. Constituents of the adhesive can form a film 310 on the mount. As the adhesive contains a marker substance, the bled-out constituents of the adhesive can be easily recognized.

Claims

1. A semiconductor component arrangement comprising: a semiconductor component;a mount; andan adhesive, wherein the adhesive connects the semiconductor component to the mount and comprises a marker substance.

2. A semiconductor component arrangement according to claim 1, wherein the marker substance is an organic dye.

3. A semiconductor component arrangement according to claim 1, wherein the marker substance is an inorganic dye.

4. A semiconductor component arrangement according to claim 1, wherein the marker substance in the adhesive has a proportion by mass of less than about 0.1%.

5. A semiconductor component arrangement according to claim 1, wherein the marker substance is dissolved in a solvent of the adhesive.

6. A semiconductor component arrangement according to claim 1, wherein the marker substance is admixed as a pigment in the adhesive.

7. A semiconductor component arrangement according to claim 1, wherein a radiation intensity of the marker substance of the adhesive is limited to a narrow frequency range.

8. A semiconductor component arrangement according to claim 1, wherein the mount is a further semiconductor component.

9. A method for inspecting the connection of a semiconductor component to a mount, comprising the steps of: fixing the semiconductor component on the mount using an adhesive, wherein the adhesive comprises a marker substance; andinspecting the mount for residues of the adhesive on the basis of radiation characteristic of the marker substance.

10. A method according to claim 9, further comprising the step of cleaning the mount with the semiconductor component before the step of inspecting.

11. A method according to claim 9, wherein the marker substance of the adhesive is an organic dye.

12. A method according to claim 9, wherein the marker substance of the adhesive is an inorganic dye.

13. A method according to claim 9, wherein the marker substance in the adhesive has a proportion by mass of less than about 0.1%.

14. A method according to claim 9, wherein a radiation intensity of the marker substance of the adhesive is limited to a narrow frequency range.

15. A method according to claim 9, wherein a connection between the semiconductor component and the mount is inspected by a visual check.

16. A method according to claim 15, wherein the connection is inspected by a visual check using a microscope.

17. A method according to claim 9, wherein a connection between the semiconductor component and the mount is inspected by an automatic method.

18. A method according to claim 15, wherein the connection is inspected using a spectral filter.

19. A method according to claim 17, wherein the connection is inspected using a spectral filter.