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Bradley BITZ
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Printed wiring boards, printed wiring board assemblies, and electro...
Patent number
12,207,411
Issue date
Jan 21, 2025
Micron Technology, Inc.
Kristopher D. Hamrick
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermally conductive label for circuit
Patent number
11,997,782
Issue date
May 28, 2024
Micron Technology, Inc.
Kaleb A. Wilson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor die assemblies having molded underfill structures and...
Patent number
11,749,666
Issue date
Sep 5, 2023
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with through-mold cooling channel for...
Patent number
11,688,664
Issue date
Jun 27, 2023
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Separation method and assembly for chip-on-wafer processing
Patent number
11,676,955
Issue date
Jun 13, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for integrated gang bonding and encapsulation...
Patent number
11,004,828
Issue date
May 11, 2021
Micron Technology, Inc.
Brandon P. Wirz
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method for manufacturing a semiconductor device assembly with throu...
Patent number
10,916,487
Issue date
Feb 9, 2021
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die assemblies having molded underfill structures and...
Patent number
10,804,256
Issue date
Oct 13, 2020
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor device assembly with throu...
Patent number
10,424,531
Issue date
Sep 24, 2019
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die assemblies having molded underfill structures and...
Patent number
10,074,633
Issue date
Sep 11, 2018
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with through-mold cooling channel for...
Patent number
9,960,150
Issue date
May 1, 2018
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of packaging imager devices and optics modules, and resulti...
Patent number
8,709,878
Issue date
Apr 29, 2014
Micron Technology, Inc.
Todd Bolken
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Methods of packaging imager devices and optics modules, and resulti...
Patent number
8,110,884
Issue date
Feb 7, 2012
Micron Technology, Inc.
Todd Bolken
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY
Publication number
20240206069
Publication date
Jun 20, 2024
Micron Technology, Inc.
Bradley Russell BITZ
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
A DAMPER FOR A PRINTED CIRCUIT BOARD ASSEMBLY
Publication number
20240117855
Publication date
Apr 11, 2024
Micron Technology, Inc.
Kaleb A. Wilson
F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information
Patent Application
HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING...
Publication number
20240071863
Publication date
Feb 29, 2024
Micron Technology, Inc.
Charles E. Siko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED WIRING BOARDS, PRINTED WIRING BOARD ASSEMBLIES, AND ELECTRO...
Publication number
20240064906
Publication date
Feb 22, 2024
Micron Technology, Inc.
Kristopher D. Hamrick
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURES FOR COMPONENT PROTECTION
Publication number
20230422388
Publication date
Dec 28, 2023
Micron Technology, Inc.
Bradley Bitz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEPARATION METHOD AND ASSEMBLY FOR CHIP-ON-WAFER PROCESSING
Publication number
20230268334
Publication date
Aug 24, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR FOR COUPLING A CAPACITOR TO A PRINTED CIRCUIT BOARD ASSEMBLY
Publication number
20230216225
Publication date
Jul 6, 2023
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE LABEL FOR CIRCUIT
Publication number
20230065633
Publication date
Mar 2, 2023
Micron Technology, Inc.
Kaleb A. Wilson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEPARATION METHOD AND ASSEMBLY FOR CHIP-ON-WAFER PROCESSING
Publication number
20210391316
Publication date
Dec 16, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND...
Publication number
20210167058
Publication date
Jun 3, 2021
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE ASSEMBLY WITH THROU...
Publication number
20210125899
Publication date
Apr 29, 2021
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR INTEGRATED GANG BONDING AND ENCAPSULATION...
Publication number
20210066246
Publication date
Mar 4, 2021
Micron Technology, Inc.
Brandon P. Wirz
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-MOLD COOLING CHANNEL FOR...
Publication number
20190333840
Publication date
Oct 31, 2019
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND...
Publication number
20190006321
Publication date
Jan 3, 2019
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-MOLD COOLING CHANNEL FOR...
Publication number
20180219002
Publication date
Aug 2, 2018
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND...
Publication number
20180130773
Publication date
May 10, 2018
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device assembly with through-mold cooling channel for...
Publication number
20170358556
Publication date
Dec 14, 2017
Micron Technology, Inc.
Bradley R. Bitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF PACKAGING IMAGER DEVICES AND OPTICS MODULES, AND RESULTI...
Publication number
20120135560
Publication date
May 31, 2012
Micron Technology, Inc.
Todd BOLKEN
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
METHODS OF PACKAGING IMAGER DEVICES AND OPTICS MODULES, AND RESULTI...
Publication number
20090152658
Publication date
Jun 18, 2009
Todd Bolken
H04 - ELECTRIC COMMUNICATION TECHNIQUE