Brandon M. Rawlings

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for conductively coating millimeter waveguides
- Patent number 12,183,961
- Issue date Dec 31, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,749,628
- Issue date Sep 5, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Zero-misalignment two-via structures
- Patent number 11,694,951
- Issue date Jul 4, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure fabrication using grayscale lithography
- Patent number 11,664,303
- Issue date May 30, 2023
- Intel Corporation
- Johanna Swan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,527,501
- Issue date Dec 13, 2022
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Zero-misalignment two-via structures using photoimageable dielectri...
- Patent number 11,502,037
- Issue date Nov 15, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual sided thermal management solutions for integrated circuit pack...
- Patent number 11,460,499
- Issue date Oct 4, 2022
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide connector having a curved array of waveguides configured...
- Patent number 11,394,094
- Issue date Jul 19, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero-misalignment two-via structures using photoimageable dielectri...
- Patent number 11,328,996
- Issue date May 10, 2022
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 11,227,825
- Issue date Jan 18, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero-misalignment two-via structures
- Patent number 11,222,836
- Issue date Jan 11, 2022
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 11,133,263
- Issue date Sep 28, 2021
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure fabrication using grayscale lithography
- Patent number 11,101,205
- Issue date Aug 24, 2021
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for conductively coating millimeter waveguides
- Patent number 11,095,012
- Issue date Aug 17, 2021
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide comprising a dielectric waveguide core surrounded by a co...
- Patent number 11,031,666
- Issue date Jun 8, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide comprising an extruded dielectric waveguide core that is...
- Patent number 11,024,933
- Issue date Jun 1, 2021
- Intel Corporation
- Brandon M. Rawlings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposers for integrated circuit packages
- Patent number 10,998,272
- Issue date May 4, 2021
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System comprising first and second servers interconnected by a plur...
- Patent number 10,950,919
- Issue date Mar 16, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,645,813
- Issue date May 5, 2020
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-planar on-package via capacitor
- Patent number 10,595,410
- Issue date Mar 17, 2020
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform with thermally stable wireless interconnects
- Patent number 10,593,636
- Issue date Mar 17, 2020
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication between integrated circuit packages using a millimete...
- Patent number 10,476,545
- Issue date Nov 12, 2019
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package communication using radio interfaces connec...
- Patent number 10,452,571
- Issue date Oct 22, 2019
- Intel Corporation
- Sasha N. Oster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lithographacally defined vias for organic package substrate scaling
- Patent number 10,381,291
- Issue date Aug 13, 2019
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of dielectric waveguides including dielectric waveguide c...
- Patent number 10,263,312
- Issue date Apr 16, 2019
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric waveguide bundle including a supporting feature for conn...
- Patent number 10,249,925
- Issue date Apr 2, 2019
- Intel Corporation
- Georgios C. Dogiamis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,187,998
- Issue date Jan 22, 2019
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Platform with thermally stable wireless interconnects
- Patent number 10,083,923
- Issue date Sep 25, 2018
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...
- Publication number 20250112077
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS
- Publication number 20250112218
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon M. Rawlings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...
- Publication number 20250006695
- Publication date Jan 2, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RESPONSIVE PHOTORESISTS AND METHODS
- Publication number 20240264530
- Publication date Aug 8, 2024
- Intel Corporation
- Ryan Carrazzone
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES
- Publication number 20230207407
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR WITH INTEGRATED MAGNETICS
- Publication number 20230207493
- Publication date Jun 29, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...
- Publication number 20230207492
- Publication date Jun 29, 2023
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...
- Publication number 20230207408
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES
- Publication number 20230208010
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS
- Publication number 20230207404
- Publication date Jun 29, 2023
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...
- Publication number 20230208009
- Publication date Jun 29, 2023
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES
- Publication number 20230198058
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...
- Publication number 20230197592
- Publication date Jun 22, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGR...
- Publication number 20230197620
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS VIAS AND PLANES WITH REDUCED TAPERING
- Publication number 20230197541
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica STRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...
- Publication number 20230197646
- Publication date Jun 22, 2023
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND R...
- Publication number 20230187362
- Publication date Jun 15, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES
- Publication number 20230094979
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES
- Publication number 20230095654
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAV...
- Publication number 20230074970
- Publication date Mar 9, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS
- Publication number 20220102261
- Publication date Mar 31, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZERO-MISALIGNMENT TWO-VIA STRUCTURES
- Publication number 20220084931
- Publication date Mar 17, 2022
- Intel Corporation
- Veronica STRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONDUCTIVELY COATING MILLIMETER WAVEGUIDES
- Publication number 20210376437
- Publication date Dec 2, 2021
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY INTERCONNECTS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210358855
- Publication date Nov 18, 2021
- Intel Corporation
- Veronica Strong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTION STRUCTURE FABRICATION USING GRAYSCALE LITHOGRAPHY
- Publication number 20210343635
- Publication date Nov 4, 2021
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACK...
- Publication number 20210080500
- Publication date Mar 18, 2021
- Intel Corporation
- Henning Braunisch
- G01 - MEASURING TESTING
Information Patent Application
HIGH-DENSITY INTERCONNECTS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210082825
- Publication date Mar 18, 2021
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSERS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210082822
- Publication date Mar 18, 2021
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Brandon M. Rawlings

Person

Patents Grantslast 30 patents

High-density interconnects for integrated circuit packages

Methods for conductively coating millimeter waveguides

High performance integrated RF passives using dual lithography process

Sacrificial redistribution layer in microelectronic assemblies havi...

Zero-misalignment two-via structures

Interconnection structure fabrication using grayscale lithography

Sacrificial redistribution layer in microelectronic assemblies havi...

Zero-misalignment two-via structures using photoimageable dielectri...

Dual sided thermal management solutions for integrated circuit pack...

Waveguide connector having a curved array of waveguides configured...

Zero-misalignment two-via structures using photoimageable dielectri...

High performance integrated RF passives using dual lithography process

Zero-misalignment two-via structures

High-density interconnects for integrated circuit packages

Interconnection structure fabrication using grayscale lithography

Methods for conductively coating millimeter waveguides

Waveguide comprising a dielectric waveguide core surrounded by a co...

Waveguide comprising an extruded dielectric waveguide core that is...

Organic interposers for integrated circuit packages

System comprising first and second servers interconnected by a plur...

Zero-misalignment via-pad structures

Non-planar on-package via capacitor

Platform with thermally stable wireless interconnects

Communication between integrated circuit packages using a millimete...

Microelectronic package communication using radio interfaces connec...

Lithographacally defined vias for organic package substrate scaling

Plurality of dielectric waveguides including dielectric waveguide c...

Dielectric waveguide bundle including a supporting feature for conn...

Zero-misalignment via-pad structures

Platform with thermally stable wireless interconnects

Patents Applicationslast 30 patents

ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS

SELECTIVE LAYER TRANSFER

PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...

LIGHT RESPONSIVE PHOTORESISTS AND METHODS

PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES

INDUCTOR WITH INTEGRATED MAGNETICS

COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...

SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...

3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES

COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS

WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...

EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES

POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGR...

GLASS VIAS AND PLANES WITH REDUCED TAPERING

LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...

PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND R...

CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES

CONFORMAL POWER DELIVERY STRUCTURES

SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAV...

HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS

ZERO-MISALIGNMENT TWO-VIA STRUCTURES

METHODS FOR CONDUCTIVELY COATING MILLIMETER WAVEGUIDES

HIGH-DENSITY INTERCONNECTS FOR INTEGRATED CIRCUIT PACKAGES

INTERCONNECTION STRUCTURE FABRICATION USING GRAYSCALE LITHOGRAPHY

DUAL SIDED THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACK...

HIGH-DENSITY INTERCONNECTS FOR INTEGRATED CIRCUIT PACKAGES

ORGANIC INTERPOSERS FOR INTEGRATED CIRCUIT PACKAGES