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Brandon P. Wirz
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Kuna, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device assembly with die support structures
Patent number
12,148,727
Issue date
Nov 19, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die edge protection for semiconductor device assembli...
Patent number
12,100,661
Issue date
Sep 24, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with surface-mount die support struct...
Patent number
12,087,720
Issue date
Sep 10, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with recessed pads for die stack interconnect...
Patent number
12,087,697
Issue date
Sep 10, 2024
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrates with heat transfer structures for bonding a stack of mic...
Patent number
11,961,818
Issue date
Apr 16, 2024
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulation warpage reduction for semiconductor die assemblies an...
Patent number
11,955,345
Issue date
Apr 9, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and methods for enhanced microelectronic device handling
Patent number
11,911,904
Issue date
Feb 27, 2024
Micron Technology, Inc.
Kuan Wei Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
Patent number
11,908,828
Issue date
Feb 20, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin die release for semiconductor device assembly
Patent number
11,791,212
Issue date
Oct 17, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating microelectronic devices and related microelec...
Patent number
11,784,050
Issue date
Oct 10, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die edge protection for semiconductor device assembli...
Patent number
11,776,908
Issue date
Oct 3, 2023
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for semiconductor die edge protection and semiconductor die...
Patent number
11,764,096
Issue date
Sep 19, 2023
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with recessed pads for die stack interconnect...
Patent number
11,715,696
Issue date
Aug 1, 2023
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bond tips and related apparatus and methods
Patent number
11,705,425
Issue date
Jul 18, 2023
Micron Technology, Inc.
Benjamin L. McClain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for solder bridging elimination for bulk solder C2S intercon...
Patent number
11,670,612
Issue date
Jun 6, 2023
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Recessed semiconductor devices, and associated systems and methods
Patent number
11,646,269
Issue date
May 9, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for temperature modification and reduction of...
Patent number
11,515,171
Issue date
Nov 29, 2022
Micron Technology, Inc.
Xiaopeng Qu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods and apparatus for temperature modification in bonding stack...
Patent number
11,410,961
Issue date
Aug 9, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
Patent number
11,410,964
Issue date
Aug 9, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for protection of dielectric films during mic...
Patent number
11,289,360
Issue date
Mar 29, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for reducing heat transfer in semiconductor assemblies, and...
Patent number
11,189,609
Issue date
Nov 30, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processes for adjusting dimensions of dielectric bond line material...
Patent number
11,189,590
Issue date
Nov 30, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bond tips and related apparatus and methods
Patent number
11,024,595
Issue date
Jun 1, 2021
Micron Technology, Inc.
Benjamin L. McClain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for integrated gang bonding and encapsulation...
Patent number
11,004,828
Issue date
May 11, 2021
Micron Technology, Inc.
Brandon P. Wirz
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Semiconductor device assembly with surface-mount die support struct...
Patent number
10,950,568
Issue date
Mar 16, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with die support structures
Patent number
10,923,447
Issue date
Feb 16, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for substrate moisture NCF voiding elimination
Patent number
10,879,195
Issue date
Dec 29, 2020
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices having tapered edge walls
Patent number
10,825,761
Issue date
Nov 3, 2020
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of processing semiconductor devices
Patent number
10,825,762
Issue date
Nov 3, 2020
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for 3D ink jet TCB interconnect control
Patent number
10,276,539
Issue date
Apr 30, 2019
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
Publication number
20240266191
Publication date
Aug 8, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES
Publication number
20240139940
Publication date
May 2, 2024
Micron Technology, Inc.
Kuan Wei Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
Publication number
20240063184
Publication date
Feb 22, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20240055366
Publication date
Feb 15, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...
Publication number
20240038707
Publication date
Feb 1, 2024
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE...
Publication number
20240006223
Publication date
Jan 4, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES AND RELATED METHODS OF FABRICATING MICROELE...
Publication number
20240006179
Publication date
Jan 4, 2024
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLI...
Publication number
20240006320
Publication date
Jan 4, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY
Publication number
20230420300
Publication date
Dec 28, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
Publication number
20230352413
Publication date
Nov 2, 2023
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHOD FOR SMOOTHING SURFA...
Publication number
20230317511
Publication date
Oct 5, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
Publication number
20230282607
Publication date
Sep 7, 2023
Micron Technology, Inc.
Ting Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR CHARACTERIZATION AND OPTIONAL SORTING AND...
Publication number
20220392792
Publication date
Dec 8, 2022
MicronTechnology, Inc.
Kuan Wei Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION IN BONDING STACK...
Publication number
20220375893
Publication date
Nov 24, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
Publication number
20220359230
Publication date
Nov 10, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECESSED SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AND METHODS
Publication number
20220352077
Publication date
Nov 3, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING MICROELECTRONIC DEVICES AND RELATED MICROELEC...
Publication number
20220344161
Publication date
Oct 27, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
Publication number
20220344270
Publication date
Oct 27, 2022
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLI...
Publication number
20220336366
Publication date
Oct 20, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING MICROELECTRONIC DEVICES AND RELATED MICROEL...
Publication number
20220336280
Publication date
Oct 20, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...
Publication number
20220320037
Publication date
Oct 6, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHODS FOR ENHANCED MICROELECTRONIC DEVICE HANDLING
Publication number
20220016768
Publication date
Jan 20, 2022
Micron Technology, Inc.
Kuan Wei Tseng
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Application
METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE...
Publication number
20220013401
Publication date
Jan 13, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF...
Publication number
20210384042
Publication date
Dec 9, 2021
Micron Technology, Inc.
Xiaopeng Qu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS FOR REDUCING HEAT TRANSFER IN SEMICONDUCTOR ASSEMBLIES, AND...
Publication number
20210343692
Publication date
Nov 4, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION IN BONDING STACK...
Publication number
20210296192
Publication date
Sep 23, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
Publication number
20210233887
Publication date
Jul 29, 2021
Micron Technology, Inc.
Benjamin L. McClain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
Publication number
20210193606
Publication date
Jun 24, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR PROTECTION OF DIELECTRIC FILMS DURING MIC...
Publication number
20210183682
Publication date
Jun 17, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
Publication number
20210183802
Publication date
Jun 17, 2021
Micron Technology, Inc.
BRANDON P. WIRZ
H01 - BASIC ELECTRIC ELEMENTS