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Brent Allen Boudreaux

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  • Highland Village, TX, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Heat sink with precompressed bias member
    • Patent number 7,567,438
    • Issue date Jul 28, 2009
    • Hewlett-Packard Development Company, L.P.
    • Stephan Karl Barsun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-processor module
    • Patent number 7,475,175
    • Issue date Jan 6, 2009
    • Hewlett-Packard Development Company, L.P.
    • David A. Klein
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Electronic system and method
    • Patent number 7,450,400
    • Issue date Nov 11, 2008
    • Hewlett-Packard Development Company, L.P.
    • Brent Boudreaux
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processor module with rigidly coupled processor and voltage-regulat...
    • Patent number 7,385,824
    • Issue date Jun 10, 2008
    • Hewlett-Packard Development Company, L.P.
    • Stephan K. Barsun
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Alignment system
    • Patent number 7,347,713
    • Issue date Mar 25, 2008
    • Hewlett-Packard Development Company, L.P.
    • Brent Boudreaux
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heat spreader with multiple stacked printed circuit boards
    • Patent number 7,345,885
    • Issue date Mar 18, 2008
    • Hewlett-Packard Development Company, L.P.
    • Brent A. Boudreaux
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thermally expanding base of heatsink to receive fins
    • Patent number 7,286,352
    • Issue date Oct 23, 2007
    • Hewlett-Packard Development Company, L.P.
    • Robert B. Curtis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Fastener for variable mounting
    • Patent number 7,197,806
    • Issue date Apr 3, 2007
    • Hewlett-Packard Development Company, L.P.
    • Brent Boudreaux
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Grant

    Mechanical highly compliant thermal interface pad
    • Patent number 7,131,199
    • Issue date Nov 7, 2006
    • Hewlett-Packard Development Company, L.P.
    • Eric C. Peterson
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Heat sink
    • Patent number 7,117,929
    • Issue date Oct 10, 2006
    • Hewlett-Packard Development Company, L.P.
    • Robert Curtis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thermal pouch interface
    • Patent number 7,096,926
    • Issue date Aug 29, 2006
    • Hewlett-Packard Development Company, L.P.
    • Christian L Belady
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    High surface area heat sink
    • Patent number 7,028,754
    • Issue date Apr 18, 2006
    • Hewlett-Packard Development Company, L.P.
    • Brent A. Boudreaux
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Routing system
    • Patent number 7,018,215
    • Issue date Mar 28, 2006
    • Hewlett-Packard Development Company, L.P.
    • Gary W. Williams
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electromagnetic interference shield for electronic devices on a cir...
    • Patent number 6,958,445
    • Issue date Oct 25, 2005
    • Hewlett-Packard Development Company, L.P.
    • Brent A. Boudreaux
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,947,286
    • Issue date Sep 20, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,922,340
    • Issue date Jul 26, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Mechanical highly compliant thermal interface pad
    • Patent number 6,910,271
    • Issue date Jun 28, 2005
    • Hewlett-Packard Development Company, L.P.
    • Eric C. Peterson
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,900,987
    • Issue date May 31, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,873,530
    • Issue date Mar 29, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,862,186
    • Issue date Mar 1, 2005
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cooling apparatus for stacked components
    • Patent number 6,819,562
    • Issue date Nov 16, 2004
    • Hewlett-Packard Development Company, L.P.
    • Brent A. Boudreaux
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stack up assembly
    • Patent number 6,816,378
    • Issue date Nov 9, 2004
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Power module for multi-chip printed circuit boards
    • Patent number 6,771,507
    • Issue date Aug 3, 2004
    • Hewlett-Packard Development Company, L.P.
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Modular input/output expansion system for an external computer
    • Patent number 6,748,458
    • Issue date Jun 8, 2004
    • Hewlett-Packard Development Company, L.P.
    • J. Michael Andrewartha
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Adjustable pedestal thermal interface
    • Patent number 6,695,042
    • Issue date Feb 24, 2004
    • Hewlett-Packard Development Company, L.P.
    • Brent A. Boudreaux
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Management system for multiple cables
    • Patent number 6,675,720
    • Issue date Jan 13, 2004
    • Hewlett-Packard Development Company, L.P.
    • Martha G. Peterson
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Cable shield termination system using clamps and ferrules
    • Patent number 6,623,303
    • Issue date Sep 23, 2003
    • Hewlett-Packard Development Company, L.P.
    • Farrukh S. Syed
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heat-activated self-aligning heat sink
    • Patent number 6,625,026
    • Issue date Sep 23, 2003
    • Hewlett-Packard Development Company, L.P.
    • Brent A. Boudreaux
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Shielded cable system for high speed cable termination
    • Patent number 6,545,220
    • Issue date Apr 8, 2003
    • Hewlett-Packard Company
    • Farrukh S. Syed
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Clamp system for high speed cable termination
    • Patent number 6,540,531
    • Issue date Apr 1, 2003
    • Hewlett-Packard Development Company, L.P.
    • Farrukh S. Syed
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Processor module with rigidly coupled processor and voltage-regulat...
    • Publication number 20070025088
    • Publication date Feb 1, 2007
    • Stephan K. Barsun
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Alignment system
    • Publication number 20070020984
    • Publication date Jan 25, 2007
    • Brent Boudreaux
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Heatsink for electronic heat generating components
    • Publication number 20060232932
    • Publication date Oct 19, 2006
    • Robert B. Curtis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Heat spreader with multiple stacked printed circuit boards
    • Publication number 20060133043
    • Publication date Jun 22, 2006
    • Brent A. Boudreaux
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic system and method
    • Publication number 20060120060
    • Publication date Jun 8, 2006
    • Brent Boudreaux
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Heat sink
    • Publication number 20060086481
    • Publication date Apr 27, 2006
    • Robert Curtis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    High surface area heat sink
    • Publication number 20050236142
    • Publication date Oct 27, 2005
    • Brent A. Boudreaux
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    System and method for heat dissipation
    • Publication number 20050219820
    • Publication date Oct 6, 2005
    • Christian L. Belady
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Fastener for variable mounting
    • Publication number 20050191149
    • Publication date Sep 1, 2005
    • Brent Boudreaux
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    Stack up assembly
    • Publication number 20050152117
    • Publication date Jul 14, 2005
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Mechanical highly compliant thermal interface pad
    • Publication number 20050132571
    • Publication date Jun 23, 2005
    • Eric C. Peterson
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Routing system
    • Publication number 20050136728
    • Publication date Jun 23, 2005
    • Gary W. Williams
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stack up assembly
    • Publication number 20040257772
    • Publication date Dec 23, 2004
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stack up assembly
    • Publication number 20040257773
    • Publication date Dec 23, 2004
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stack up assembly
    • Publication number 20040246680
    • Publication date Dec 9, 2004
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stack up assembly
    • Publication number 20040246681
    • Publication date Dec 9, 2004
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Multi-processor module
    • Publication number 20040225821
    • Publication date Nov 11, 2004
    • David A. Klein
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    STACK UP ASSEMBLY
    • Publication number 20040212964
    • Publication date Oct 28, 2004
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Thermal pouch interface
    • Publication number 20040194915
    • Publication date Oct 7, 2004
    • Christian L. Belady
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Fastener for variable mounting
    • Publication number 20040156676
    • Publication date Aug 12, 2004
    • Brent Boudreaux
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    POWER MODULE FOR MULTI-CHIP PRINTED CIRCUIT BOARDS
    • Publication number 20040150954
    • Publication date Aug 5, 2004
    • Christian L. Belady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Cooling apparatus for stacked components
    • Publication number 20040150957
    • Publication date Aug 5, 2004
    • Brent A. Boudreaux
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Mechanical highly compliant thermal interface pad
    • Publication number 20040079519
    • Publication date Apr 29, 2004
    • Eric C. Peterson
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    ADJUSTABLE PEDESTAL THERMAL INTERFACE
    • Publication number 20040020634
    • Publication date Feb 5, 2004
    • Brent A. Boudreaux
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Thermal pouch interface
    • Publication number 20030178174
    • Publication date Sep 25, 2003
    • Christian L. Belady
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    SHIELDED CABLE SYSTEM FOR HIGH SPEED CABLE TERMINATION
    • Publication number 20030042032
    • Publication date Mar 6, 2003
    • Farrukh S. Syed
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Modular input/output expansion system for an external computer
    • Publication number 20030046452
    • Publication date Mar 6, 2003
    • J. Michael Andrewartha
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Cable shield termination system using clamps and ferrules
    • Publication number 20030045141
    • Publication date Mar 6, 2003
    • Farrukh S. Syed
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CABLE BUNDLE CLAMP
    • Publication number 20030045159
    • Publication date Mar 6, 2003
    • Brent A. Boudreaux
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Management system for multiple cables
    • Publication number 20030042096
    • Publication date Mar 6, 2003
    • Martha G. Peterson
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER