Claims
- 1. An assembly, comprising:
a first printed circuit board having a first opening and including a first heat-generating device; a second printed circuit board; a middle frame configured to mechanically couple said first printed circuit board to said second printed circuit board; a second heat-generating device; a first interposer configured to mechanically and electrically couple said second heat-generating device to said second printed circuit board; a heat sink mechanically coupled with said first and second printed circuit boards, thermally coupled with said first heat-generating device; and a gap-filling thermal interface configured to thermally couple said second-heat generating device with said heat sink.
- 2. The assembly of claim 1, further comprising:
a lower frame mechanically coupled with said second printed circuit board on a side of said second printed circuit board opposite that of said middle frame.
- 3. The assembly of claim 2, wherein said heat sink, said middle frame, and said lower frame are configured to act as a faraday cage.
- 4. The assembly of claim 2, wherein said heat sink, said middle frame, and said lower frame are configured to act as an EMI shield.
- 5. The assembly of claim 4, further comprising:
a third heat-generating device mechanically and electrically coupled with said second printed circuit board, and substantially aligned with said second opening in said first printed circuit board; and a second interposer configured to mechanically and electrically couple said third heat-generating device to said second printed circuit board.
- 6. The assembly of claim 5, wherein said second interposer is of sufficient height such that said third heat-generating device extends through said second opening in said first printed circuit board.
- 7. The assembly of claim 1, further comprising:
a lower frame mechanically coupled with said middle frame on a side of said second printed circuit board opposite that of said middle frame.
- 8. The assembly of claim 7, wherein said heat sink, said middle frame, and said lower frame are configured to act as a faraday cage.
- 9. The assembly of claim 7, wherein said heat sink, said middle frame, and said lower frame are configured to act as an EMI shield.
- 10. The assembly of claim 9, further comprising:
a third heat-generating device mechanically and electrically coupled with said second printed circuit board, and substantially aligned with said second opening in said first printed circuit board; and a second interposer configured to mechanically and electrically couple said third heat-generating device to said second printed circuit board.
- 11. The assembly of claim 10, wherein said second interposer is of sufficient height such that said third heat-generating device extends through said second opening in said first printed circuit board.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of application Ser. No. 10/425,548 also entitled, “Stack Up Assembly,” filed on Apr. 28, 2003 hereby incorporated herein by reference. Application Ser. No. 10/425,548 entitled, “Stack Up Assembly,” filed on Apr. 28, 2003 is a continuation-in-part of application Ser. No. 10/425,491 also entitled, “Stack Up Assembly,” filed on Apr. 28, 2003, and also hereby incorporated herein by reference.
Divisions (1)
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Number |
Date |
Country |
Parent |
10425548 |
Apr 2003 |
US |
Child |
10890626 |
Jul 2004 |
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
10425491 |
Apr 2003 |
US |
Child |
10425548 |
Apr 2003 |
US |