Brent S. Stone

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package connector assembly
- Patent number 9,674,954
- Issue date Jun 6, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array (LGA) socket for various package sizes
- Patent number 7,794,236
- Issue date Sep 14, 2010
- Intel Corporation
- Debendra Mallik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packages, systems, and methods
- Patent number 7,687,905
- Issue date Mar 30, 2010
- Intel Corporation
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid package with non-insertable and insertable conductive featur...
- Patent number 7,429,497
- Issue date Sep 30, 2008
- Intel Corporation
- Brent Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages, systems, and methods
- Patent number 7,339,263
- Issue date Mar 4, 2008
- Intel Corporation
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tilted land grid array package and socket, systems, and methods
- Patent number 7,220,132
- Issue date May 22, 2007
- Intel Corporation
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and apparatus for socket and package power/ground bar to inc...
- Patent number 7,161,243
- Issue date Jan 9, 2007
- Intel Corporation
- Hong Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array with socket plate
- Patent number 7,114,959
- Issue date Oct 3, 2006
- Intel Corporation
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid package with non-insertable and insertable conductive featur...
- Patent number 7,053,496
- Issue date May 30, 2006
- Intel Corporation
- Brent Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi-signal bus bars
- Patent number 7,034,390
- Issue date Apr 25, 2006
- Intel Corporation
- Tim M. Gates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket cover with recessed center and method
- Patent number 7,014,488
- Issue date Mar 21, 2006
- Intel Corporation
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket and package power/ground bar apparatus that increases curren...
- Patent number 6,992,378
- Issue date Jan 31, 2006
- Intel Corporation
- Hong Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging architecture
- Patent number 6,979,891
- Issue date Dec 27, 2005
- Intel Corporation
- Dustin P. Wood
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual power supply method and apparatus
- Patent number 6,853,061
- Issue date Feb 8, 2005
- Intel Corporation
- Kris Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having multi-signal bus bars
- Patent number 6,724,077
- Issue date Apr 20, 2004
- Intel Corporation
- Tim M. Gates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hole grid array package and socket technology
- Patent number 6,713,684
- Issue date Mar 30, 2004
- Intel Corporation
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low resistance contact for an integrated circuit
- Patent number 6,710,440
- Issue date Mar 23, 2004
- Intel Corporation
- Radha R. Kanaparthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket plane
- Patent number 6,561,820
- Issue date May 13, 2003
- Intel Corporation
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SURFACE-MOUNT INDUCTOR STRUCTURES FOR FORMING ONE OR MORE INDUCTORS...
- Publication number 20150155092
- Publication date Jun 4, 2015
- Intel Corporation
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE CONNECTOR ASSEMBLY
- Publication number 20140268577
- Publication date Sep 18, 2014
- Rajasekaran Raja Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT INDUCTOR STRUCTURES FOR FORMING ONE OR MORE INDUCTORS...
- Publication number 20140167900
- Publication date Jun 19, 2014
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land Grid Array (LGA) Socket for Various Package Sizes
- Publication number 20100151706
- Publication date Jun 17, 2010
- Debendra Mallik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES, SYSTEMS, AND METHODS
- Publication number 20080142962
- Publication date Jun 19, 2008
- Intel Corporation
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid package with non-insertable and insertable conductive featur...
- Publication number 20060166401
- Publication date Jul 27, 2006
- Intel Corporation
- Brent Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array with socket plate
- Publication number 20060046527
- Publication date Mar 2, 2006
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Socket cover with recessed center and method
- Publication number 20060024982
- Publication date Feb 2, 2006
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tilted land grid array package and socket, systems, and methods
- Publication number 20050287828
- Publication date Dec 29, 2005
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit packages, systems, and methods
- Publication number 20050285243
- Publication date Dec 29, 2005
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and apparatus for socket and package power/ground bar to inc...
- Publication number 20050208791
- Publication date Sep 22, 2005
- Hong Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic device signal transmission by way of a lid
- Publication number 20050127489
- Publication date Jun 16, 2005
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package
- Publication number 20050073805
- Publication date Apr 7, 2005
- Brent Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit packaging architecture
- Publication number 20050051889
- Publication date Mar 10, 2005
- Dustin P. Wood
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid package with non-insertable and insertable conductive featur...
- Publication number 20040262725
- Publication date Dec 30, 2004
- Intel Corporation
- Brent Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Motherboard power-leveler
- Publication number 20040100780
- Publication date May 27, 2004
- Brent Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual power supply method and apparatus
- Publication number 20040075165
- Publication date Apr 22, 2004
- Kris Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package having multi-signal bus bars
- Publication number 20040061215
- Publication date Apr 1, 2004
- Tim M. Gates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hole grid array package and socket technology
- Publication number 20040056298
- Publication date Mar 25, 2004
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW RESISTANCE CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20040036521
- Publication date Feb 26, 2004
- Intel Corporation
- Radha R. Kanaparthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package having multi-signal bus bars
- Publication number 20030089970
- Publication date May 15, 2003
- Tim M. Gates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hole grid array package and socket technology
- Publication number 20030079908
- Publication date May 1, 2003
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET PLANE
- Publication number 20030060063
- Publication date Mar 27, 2003
- Brent S. Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Socket and package power/ground bar apparatus that increases curren...
- Publication number 20020089045
- Publication date Jul 11, 2002
- Hong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Brent S. Stone

Person

Patents Grantslast 30 patents

Chip package connector assembly

Land grid array (LGA) socket for various package sizes

Integrated circuit packages, systems, and methods

Hybrid package with non-insertable and insertable conductive featur...

Integrated circuit packages, systems, and methods

Tilted land grid array package and socket, systems, and methods

System and apparatus for socket and package power/ground bar to inc...

Land grid array with socket plate

Hybrid package with non-insertable and insertable conductive featur...

Semiconductor package having multi-signal bus bars

Socket cover with recessed center and method

Socket and package power/ground bar apparatus that increases curren...

Integrated circuit packaging architecture

Dual power supply method and apparatus

Semiconductor package having multi-signal bus bars

Hole grid array package and socket technology

Low resistance contact for an integrated circuit

Socket plane

Patents Applicationslast 30 patents

SURFACE-MOUNT INDUCTOR STRUCTURES FOR FORMING ONE OR MORE INDUCTORS...

CHIP PACKAGE CONNECTOR ASSEMBLY

SURFACE-MOUNT INDUCTOR STRUCTURES FOR FORMING ONE OR MORE INDUCTORS...

Land Grid Array (LGA) Socket for Various Package Sizes

INTEGRATED CIRCUIT PACKAGES, SYSTEMS, AND METHODS

Hybrid package with non-insertable and insertable conductive featur...

Land grid array with socket plate

Socket cover with recessed center and method

Tilted land grid array package and socket, systems, and methods

Integrated circuit packages, systems, and methods

System and apparatus for socket and package power/ground bar to inc...

Microelectronic device signal transmission by way of a lid

Integrated circuit package

Integrated circuit packaging architecture

Hybrid package with non-insertable and insertable conductive featur...

Motherboard power-leveler

Dual power supply method and apparatus

Semiconductor package having multi-signal bus bars

Hole grid array package and socket technology

LOW RESISTANCE CONTACT FOR AN INTEGRATED CIRCUIT

Semiconductor package having multi-signal bus bars

Hole grid array package and socket technology

SOCKET PLANE

Socket and package power/ground bar apparatus that increases curren...