Bret Street

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 12,080,678
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic conductive column in a semiconductor device and associat...
- Patent number 12,074,094
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination-bonded die pair packaging and associated systems and me...
- Patent number 11,776,926
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically or temperature activated shape-memory materials for wa...
- Patent number 11,658,129
- Issue date May 23, 2023
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods...
- Patent number 11,410,973
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,962
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,963
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 11,302,653
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination-bonded die pair packaging and associated systems and me...
- Patent number 11,289,440
- Issue date Mar 29, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layered protection mechanism and associ...
- Patent number 11,114,415
- Issue date Sep 7, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,943,842
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically or temperature activated shape-memory materials for wa...
- Patent number 10,861,797
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Bret K. Street
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,210
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,209
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 10,748,857
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an electrically-coupled protection mechan...
- Patent number 10,741,528
- Issue date Aug 11, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layered protection mechanism and associ...
- Patent number 10,615,150
- Issue date Apr 7, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,580,710
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer with fuse-selectable routing array
- Patent number 10,580,720
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an electrically-coupled protection mechan...
- Patent number 10,475,771
- Issue date Nov 12, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layered protection mechanism and associ...
- Patent number 10,381,329
- Issue date Aug 13, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 10,103,134
- Issue date Oct 16, 2018
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mount tape die release system for thin die ejection
- Patent number 10,043,688
- Issue date Aug 7, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 9,865,578
- Issue date Jan 9, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing wafer-level assemblies to reduce warpage, and...
- Patent number 9,786,612
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing wafer-level assemblies to reduce warpage, and...
- Patent number 9,589,933
- Issue date Mar 7, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units and methods of manufacturing microele...
- Patent number 7,858,420
- Issue date Dec 28, 2010
- Micron Technology, Inc.
- James M. Derderian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units
- Patent number 7,786,574
- Issue date Aug 31, 2010
- Aptina Imaging Corp.
- James M. Derderian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing microelectronic imaging units on a microfe...
- Patent number 7,691,660
- Issue date Apr 6, 2010
- Aptina Imaging Corporation
- James M. Derderian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE PAD ON A THROUGH-SILICON VIA
- Publication number 20240379596
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20240379503
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS
- Publication number 20240332229
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SEMICONDUCTOR DIES THROUGH TRACES
- Publication number 20240079369
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20240071969
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGI...
- Publication number 20240063068
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
- Publication number 20240055400
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
- Publication number 20230395545
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...
- Publication number 20230343672
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...
- Publication number 20230343673
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...
- Publication number 20230260964
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20230260875
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20230260876
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE CYLINDER IN A SEMICONDUCTOR DEVICE AND ASSOCI...
- Publication number 20230260877
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRINDABLE HEAT SINK FOR MULTIPLE DIE PACKAGING
- Publication number 20230238300
- Publication date Jul 27, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230197669
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20230048311
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20220375902
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION-BONDED DIE PAIR PACKAGING AND ASSOCIATED SYSTEMS AND ME...
- Publication number 20220246569
- Publication date Aug 4, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION-BONDED DIE PAIR PACKAGING AND ASSOCIATED SYSTEMS AND ME...
- Publication number 20220102308
- Publication date Mar 31, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20210183716
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20210118852
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210091037
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210074671
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically or Temperature Activated Shape-Memory Materials for Wa...
- Publication number 20210066212
- Publication date Mar 4, 2021
- Micron Technology, Inc.
- Bret K. Street
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200373252
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LAYERED PROTECTION MECHANISM AND ASSOCI...
- Publication number 20200219851
- Publication date Jul 9, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200212000
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200211999
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Bret Street

Person

Patents Grantslast 30 patents

Methods and systems for manufacturing semiconductor devices

Monolithic conductive column in a semiconductor device and associat...

Combination-bonded die pair packaging and associated systems and me...

Semiconductor device with a protection mechanism and associated sys...

Electrically or temperature activated shape-memory materials for wa...

Microelectronic device assemblies and packages and related methods...

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Die features for self-alignment during die bonding

Combination-bonded die pair packaging and associated systems and me...

Semiconductor device with a layered protection mechanism and associ...

Semiconductor device with a protection mechanism and associated sys...

Electrically or temperature activated shape-memory materials for wa...

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Die features for self-alignment during die bonding

Semiconductor device with an electrically-coupled protection mechan...

Semiconductor device with a layered protection mechanism and associ...

Semiconductor device with a protection mechanism and associated sys...

Silicon interposer with fuse-selectable routing array

Semiconductor device with an electrically-coupled protection mechan...

Semiconductor device with a layered protection mechanism and associ...

Methods of manufacturing multi-die semiconductor device packages an...

Method for mount tape die release system for thin die ejection

Methods of manufacturing multi-die semiconductor device packages an...

Methods of processing wafer-level assemblies to reduce warpage, and...

Methods of processing wafer-level assemblies to reduce warpage, and...

Microelectronic imaging units and methods of manufacturing microele...

Microelectronic imaging units

Methods of manufacturing microelectronic imaging units on a microfe...

Patents Applicationslast 30 patents

CONDUCTIVE PAD ON A THROUGH-SILICON VIA

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS

CONNECTING SEMICONDUCTOR DIES THROUGH TRACES

SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGI...

SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES

MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...

METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...

METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...

MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

MONOLITHIC CONDUCTIVE CYLINDER IN A SEMICONDUCTOR DEVICE AND ASSOCI...

GRINDABLE HEAT SINK FOR MULTIPLE DIE PACKAGING

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

COMBINATION-BONDED DIE PAIR PACKAGING AND ASSOCIATED SYSTEMS AND ME...

COMBINATION-BONDED DIE PAIR PACKAGING AND ASSOCIATED SYSTEMS AND ME...

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Electrically or Temperature Activated Shape-Memory Materials for Wa...

Die Features for Self-Alignment During Die Bonding

SEMICONDUCTOR DEVICE WITH A LAYERED PROTECTION MECHANISM AND ASSOCI...

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES