Bret W. Simon

Person

Cedar Rapids, IA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) package with cantilever multi-chip module (...
- Patent number 11,948,855
- Issue date Apr 2, 2024
- Rockwell Collins, Inc.
- Bret W. Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically clear thermal spreader for status indication within an el...
- Patent number 11,637,211
- Issue date Apr 25, 2023
- Rockwell Collins, Inc.
- Ross K. Wilcoxon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for through silicon die level interconnect
- Patent number 11,621,219
- Issue date Apr 4, 2023
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including integrated circuit die mechanically i...
- Patent number 11,605,570
- Issue date Mar 14, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including mold material with recessed conductiv...
- Patent number 11,515,225
- Issue date Nov 29, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with enhanced thermal dissipation
- Patent number 11,502,060
- Issue date Nov 15, 2022
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled warping of shadow mask tooling for improved reliability...
- Patent number 11,326,246
- Issue date May 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal multi-plane material deposition
- Patent number 11,276,641
- Issue date Mar 15, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect assembly with flexible circuit
- Patent number 10,187,987
- Issue date Jan 22, 2019
- Rockwell Collins, Inc.
- Bret W. Simon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip stacking utilizing interposer
- Patent number 9,589,913
- Issue date Mar 7, 2017
- Rockwell Collins, Inc.
- Sarah M. Shepard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT
- Publication number 20220262715
- Publication date Aug 18, 2022
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICALLY CLEAR THERMAL SPREADER FOR STATUS INDICATION WITHIN AN EL...
- Publication number 20220246772
- Publication date Aug 4, 2022
- Rockwell Collins, Inc.
- Ross K. Wilcoxon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE WITH ENHANCED THERMAL DISSIPATION
- Publication number 20220165705
- Publication date May 26, 2022
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...
- Publication number 20220077016
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...
- Publication number 20220077015
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Warping of Shadow Mask Tooling for Improved Reliability...
- Publication number 20220025506
- Publication date Jan 27, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Bret W. Simon

Person

Patents Grantslast 30 patents

Integrated circuit (IC) package with cantilever multi-chip module (...

Optically clear thermal spreader for status indication within an el...

Method and apparatus for through silicon die level interconnect

Reconstituted wafer including integrated circuit die mechanically i...

Reconstituted wafer including mold material with recessed conductiv...

Microelectronics package with enhanced thermal dissipation

Controlled warping of shadow mask tooling for improved reliability...

Conformal multi-plane material deposition

Interconnect assembly with flexible circuit

Flip chip stacking utilizing interposer

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT

OPTICALLY CLEAR THERMAL SPREADER FOR STATUS INDICATION WITHIN AN EL...

MICROELECTRONICS PACKAGE WITH ENHANCED THERMAL DISSIPATION

RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...

RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...

Controlled Warping of Shadow Mask Tooling for Improved Reliability...