Brian F. Gordon

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for selective removal of material from wafer...
- Patent number 8,053,371
- Issue date Nov 8, 2011
- Micron Technology, Inc.
- Russell C. Zahorik
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for selective removal of material from wafer alignment marks
- Patent number 7,244,681
- Issue date Jul 17, 2007
- Micron Technology, Inc.
- Guy F. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board support
- Patent number 7,093,704
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board support
- Patent number 6,971,499
- Issue date Dec 6, 2005
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board support
- Patent number 6,962,248
- Issue date Nov 8, 2005
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inflatable bladder with suction for supporting circuit board assemb...
- Patent number 6,898,838
- Issue date May 31, 2005
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for selective removal of material from wafer alignment marks
- Patent number 6,889,698
- Issue date May 10, 2005
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board support
- Patent number 6,863,169
- Issue date Mar 8, 2005
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board support
- Patent number 6,863,170
- Issue date Mar 8, 2005
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inflatable bladder with suction for supporting circuit board assemb...
- Patent number 6,857,627
- Issue date Feb 22, 2005
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board support
- Patent number 6,749,054
- Issue date Jun 15, 2004
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Deadhesion method and mechanism for wafer processing
- Patent number 6,693,034
- Issue date Feb 17, 2004
- Micron Technology, Inc.
- Guy T. Blalock
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer planarization using a uniform layer of material and method fo...
- Patent number 6,656,402
- Issue date Dec 2, 2003
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer planarization using a uniform layer of material and method an...
- Patent number 6,645,345
- Issue date Nov 11, 2003
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board support
- Patent number 6,631,798
- Issue date Oct 14, 2003
- Micron Technology, Inc.
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer planarization using a uniform layer of material and method an...
- Patent number 6,624,089
- Issue date Sep 23, 2003
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods for selective removal of material from wafer alignment marks
- Patent number 6,610,610
- Issue date Aug 26, 2003
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate spinning apparatus
- Patent number 6,569,241
- Issue date May 27, 2003
- Micron Technology, Inc.
- Brian F. Gordon
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Substrate coating and semiconductor processing method of improving...
- Patent number 6,555,276
- Issue date Apr 29, 2003
- Micron Technology, Inc.
- Brian F. Gordon
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus for selective removal of material from wafer alignment marks
- Patent number 6,530,113
- Issue date Mar 11, 2003
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deadhesion method and mechanism for wafer processing
- Patent number 6,506,679
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Guy T. Blalock
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for selective removal of material from wafer a...
- Patent number 6,447,634
- Issue date Sep 10, 2002
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer planarization using a uniform layer of material and method an...
- Patent number 6,429,146
- Issue date Aug 6, 2002
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer planarization using a uniform layer of material and method an...
- Patent number 6,410,459
- Issue date Jun 25, 2002
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate coating apparatus
- Patent number 6,398,868
- Issue date Jun 4, 2002
- Micron Technology, Inc.
- Brian F. Gordon
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for selective removal of material from wafer a...
- Patent number 6,329,301
- Issue date Dec 11, 2001
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deadhesion method and mechanism for wafer processing
- Patent number 6,316,363
- Issue date Nov 13, 2001
- Micron Technology, Inc.
- Guy T. Blalock
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate coating apparatus and semiconductor processing method of...
- Patent number 6,232,247
- Issue date May 15, 2001
- Micron Technology, Inc.
- Brian F. Gordon
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for selective removal of material from wafer a...
- Patent number 6,103,636
- Issue date Aug 15, 2000
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods for selective removal of material from wafer alignment marks
- Publication number 20070207613
- Publication date Sep 6, 2007
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board support
- Publication number 20060040521
- Publication date Feb 23, 2006
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inflatable bladder with suction for supporting circuit board assemb...
- Publication number 20050029724
- Publication date Feb 10, 2005
- Micron Technology, Inc.
- Brian F. Gordon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Inflatable bladder with suction for supporting circuit board assemb...
- Publication number 20050023740
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Brian F. Gordon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Printed circuit board support
- Publication number 20050011724
- Publication date Jan 20, 2005
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for selective removal of material from wafer alignment marks
- Publication number 20040038543
- Publication date Feb 26, 2004
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board support
- Publication number 20030136636
- Publication date Jul 24, 2003
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board support
- Publication number 20030136637
- Publication date Jul 24, 2003
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board support
- Publication number 20030127304
- Publication date Jul 10, 2003
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board support
- Publication number 20030127305
- Publication date Jul 10, 2003
- Brian F. Gordon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for selective removal of material from wafer alignment marks
- Publication number 20030121538
- Publication date Jul 3, 2003
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inflatable bladder with suction for supporting circuit board assemb...
- Publication number 20030074788
- Publication date Apr 24, 2003
- Brian F. Gordon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Deadhesion method and mechanism for wafer processing
- Publication number 20030008508
- Publication date Jan 9, 2003
- Guy T. Blalock
- B24 - GRINDING POLISHING
Information Patent Application
Wafer planarization using a uniform layer of material and method an...
- Publication number 20020187650
- Publication date Dec 12, 2002
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Substrate spinning apparatus
- Publication number 20020148404
- Publication date Oct 17, 2002
- Brian F. Gordon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for selective removal of material from wafer a...
- Publication number 20020144720
- Publication date Oct 10, 2002
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for selective removal of material from wafer a...
- Publication number 20020025687
- Publication date Feb 28, 2002
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer planarization using a uniform layer of material and method an...
- Publication number 20020015753
- Publication date Feb 7, 2002
- Micron Technology Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Deadhesion method and mechanism for wafer processing
- Publication number 20020009825
- Publication date Jan 24, 2002
- Guy T. Blalock
- B24 - GRINDING POLISHING
Information Patent Application
Wafer planarization using a uniform layer of material and method an...
- Publication number 20020005260
- Publication date Jan 17, 2002
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Wafer planarization using a uniform layer of material and method an...
- Publication number 20010055686
- Publication date Dec 27, 2001
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Wafer planarization using a uniform layer of material and method an...
- Publication number 20010053446
- Publication date Dec 20, 2001
- Micron Technology, Inc.
- Guy T. Blalock
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Substrate coating apparatus and semiconductor processing method of...
- Publication number 20010023137
- Publication date Sep 20, 2001
- Brian F. Gordon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COATING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD OF...
- Publication number 20010002339
- Publication date May 31, 2001
- BRIAN F. GORDON
- H01 - BASIC ELECTRIC ELEMENTS

Brian F. Gordon

Person

Patents Grantslast 30 patents

Apparatus and methods for selective removal of material from wafer...

Methods for selective removal of material from wafer alignment marks

Printed circuit board support

Printed circuit board support

Printed circuit board support

Inflatable bladder with suction for supporting circuit board assemb...

Apparatus for selective removal of material from wafer alignment marks

Printed circuit board support

Printed circuit board support

Inflatable bladder with suction for supporting circuit board assemb...

Printed circuit board support

Deadhesion method and mechanism for wafer processing

Wafer planarization using a uniform layer of material and method fo...

Wafer planarization using a uniform layer of material and method an...

Printed circuit board support

Wafer planarization using a uniform layer of material and method an...

Methods for selective removal of material from wafer alignment marks

Substrate spinning apparatus

Substrate coating and semiconductor processing method of improving...

Apparatus for selective removal of material from wafer alignment marks

Deadhesion method and mechanism for wafer processing

Method and apparatus for selective removal of material from wafer a...

Wafer planarization using a uniform layer of material and method an...

Wafer planarization using a uniform layer of material and method an...

Substrate coating apparatus

Method and apparatus for selective removal of material from wafer a...

Deadhesion method and mechanism for wafer processing

Substrate coating apparatus and semiconductor processing method of...

Method and apparatus for selective removal of material from wafer a...

Patents Applicationslast 30 patents

Methods for selective removal of material from wafer alignment marks

Printed circuit board support

Inflatable bladder with suction for supporting circuit board assemb...

Inflatable bladder with suction for supporting circuit board assemb...

Printed circuit board support

Methods for selective removal of material from wafer alignment marks

Printed circuit board support

Printed circuit board support

Printed circuit board support

Printed circuit board support

Apparatus for selective removal of material from wafer alignment marks

Inflatable bladder with suction for supporting circuit board assemb...

Deadhesion method and mechanism for wafer processing

Wafer planarization using a uniform layer of material and method an...

Substrate spinning apparatus

Method and apparatus for selective removal of material from wafer a...

Method and apparatus for selective removal of material from wafer a...

Wafer planarization using a uniform layer of material and method an...

Deadhesion method and mechanism for wafer processing

Wafer planarization using a uniform layer of material and method an...

Wafer planarization using a uniform layer of material and method an...

Wafer planarization using a uniform layer of material and method an...

Substrate coating apparatus and semiconductor processing method of...

SUBSTRATE COATING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD OF...