Claims
- 1. A method of conveying a printed circuit board in a printed circuit board conveying system wherein said conveying system comprises:
a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and a printed circuit board support assembly positioned to support a major portion of said printed circuit board between said lateral edge portions, said printed circuit board support assembly comprising
a support base defining a support surface and at least one recess formed therein, said recess defining an opening on said support surface; and a spacer selected from a plurality of spacers, each of said spacers defining an upper spacer surface and an opposite spacer surface, wherein (i) said upper spacer surface is sized and configured to support and engage a major portion of said printed circuit board, (ii) said spacers define a range of respective thickness dimensions between respective ones of said upper spacer surfaces and corresponding ones of said opposite spacer surfaces, (iii) each of said spacers includes at least one projection extending from said opposite spacer surface, and (iv) said respective projections and said recess formed in said support base are sized to enable extension of said respective projections into said recess and to limit movement of said spacer relative to a plane parallel to said support surface; and wherein said method comprises: selecting one of said plurality of spacers as a function of its thickness and a thickness profile of said printed circuit board engaged by said pair of conveyor rails; installing said selected spacer by extending at least one of said respective projections into said recess; and engaging an upper spacer surface of said selected spacer with said printed circuit board.
- 2. A method of conveying a printed circuit board in a printed circuit board conveying system wherein said conveying system comprises:
a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and a printed circuit board support positioned to support a major portion of said printed circuit board between said lateral edge portions, said printed circuit board support comprising
a support base defining a support surface; and a base extension assembly secured to said support base and arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of said printed circuit board support, wherein variation of said variable extension assembly height dimension results in variation of said height dimension of said printed circuit board support, and wherein said base extension assembly is configured such that said height dimension of said printed circuit board support permits engagement of said support surface with said printed circuit board; and wherein said method comprises: engaging said support surface of said support base with said printed circuit board engaged by said pair of conveyor rails; and varying said height dimension of said base extension assembly as a function of a thickness profile of said printed circuit board.
- 3. A method of processing a printed circuit board in a processing system including a printed circuit board conveying system coupling a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven, wherein said printed circuit board conveying system comprises:
a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and a printed circuit board support assembly positioned to support a major portion of said printed circuit board between said lateral edge portions within an operating envelope of said pick and place machine, said printed circuit board support assembly comprising
a support base defining a support surface and at least one recess formed therein, said recess defining an opening on said support surface; and a spacer selected from a plurality of spacers, each of said spacers defining an upper spacer surface and an opposite spacer surface, wherein (i) said upper spacer surface is sized and configured to support and engage a major portion of a printed circuit board, (ii) said spacers define a range of respective thickness dimensions between respective ones of said upper spacer surfaces and corresponding ones of said opposite spacer surfaces, (iii) each of said spacers includes at least one projection extending from said opposite spacer surface, and (iv) said respective projections and said recess formed in said support base are sized to enable extension of said respective projections into said recess and to limit movement of said spacer relative to a plane parallel to said support surface; and wherein said method comprises: selecting one of said plurality of spacers as a function of its thickness and a thickness profile of said printed circuit board engaged by said pair of conveyor rails; installing said selected spacer by extending at least one of said respective projections into said recess; and engaging an upper spacer surface of said selected spacer with said printed circuit board within said operating envelope of said pick and place machine.
- 4. A method of processing a printed circuit board in a processing system including a printed circuit board conveying system coupling a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven, wherein said printed circuit board conveying system comprises:
a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and a printed circuit board support positioned to support a major portion of said printed circuit board between said lateral edge portions within an operating envelope of said pick and place machine, said printed circuit board support comprising
a support base defining a support surface; and a base extension assembly secured to said support base and arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of said printed circuit board support, wherein variation of said variable extension assembly height dimension results in variation of said height dimension of said printed circuit board support, and wherein said base extension assembly is configured such that said height dimension of said printed circuit board support permits engagement of said support surface with said printed circuit board; and wherein said method comprises: engaging said support surface of said support base with said printed circuit board engaged by said pair of conveyor rails within said operating envelope of said pick and place machine; and varying said height dimension of said base extension assembly as a function of a thickness profile of said printed circuit board.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a division of co-pending application Ser. No. 09/704,294, filed Nov. 1, 2000 entitled “PRINTED CIRCUIT BOARD SUPPORT”, and is further related to co-pending application Ser. Nos. _/_,_ (Attorney Docket No. MIO 0070 VA),_/_,_ (Attorney Docket No. MIO 0070 V2), and _/_,_ (Attorney Docket No. MIO 0070 V3), which are all entitled “PRINTED CIRCUIT BOARD SUPPORT”.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09704294 |
Nov 2000 |
US |
Child |
10375818 |
Feb 2003 |
US |