Brian G. Anthony

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
In-line protection from process induced dielectric damage
- Patent number 10,446,436
- Issue date Oct 15, 2019
- NXP USA, INC.
- William Ernest Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device including interconnect barri...
- Patent number 6,713,381
- Issue date Mar 30, 2004
- Motorola, Inc.
- Alexander L. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,573,173
- Issue date Jun 3, 2003
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device barrier layer
- Patent number 6,451,181
- Issue date Sep 17, 2002
- Motorola, Inc.
- Dean J. Denning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,444,569
- Issue date Sep 3, 2002
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,274,478
- Issue date Aug 14, 2001
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IN-LINE PROTECTION FROM PROCESS INDUCED DIELECTRIC DAMAGE
- Publication number 20190096749
- Publication date Mar 28, 2019
- NXP USA, Inc.
- WILLIAM ERNEST EDWARDS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
- Publication number 20020151167
- Publication date Oct 17, 2002
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a barrier layer for use in a copper interconnect
- Publication number 20020092763
- Publication date Jul 18, 2002
- Dean J. Denning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device and method of formation
- Publication number 20020093098
- Publication date Jul 18, 2002
- Alexander L. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONDUCTIVE BUMP AND INTERCONNECT BARRIER
- Publication number 20020000665
- Publication date Jan 3, 2002
- ALEXANDER L. BARR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
- Publication number 20010027083
- Publication date Oct 4, 2001
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS