Brian H. KIM

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Temperature stabilizing enclosure
- Patent number 10,655,896
- Issue date May 19, 2020
- Invensense, Inc.
- Muhammad Maaz Qazi
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Assembly and packaging of MEMS device
- Patent number 10,472,231
- Issue date Nov 12, 2019
- Invensense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated package containing MEMS acoustic sensor and pressure sensor
- Patent number 10,351,419
- Issue date Jul 16, 2019
- Invensense, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated CMOS back cavity acoustic transducer and the method of p...
- Patent number 9,828,240
- Issue date Nov 28, 2017
- Invensense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Edge coupling alignment using embedded features
- Patent number 9,583,684
- Issue date Feb 28, 2017
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and packaging of MEMS device
- Patent number 9,508,663
- Issue date Nov 29, 2016
- Invensense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical connector assembly
- Patent number 9,494,750
- Issue date Nov 15, 2016
- Intel Corporation
- Simon S. Lee
- G02 - OPTICS
Information Patent Grant
Integrated CMOS back cavity acoustic transducer and the method of p...
- Patent number 9,299,671
- Issue date Mar 29, 2016
- Invensense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Edge coupling alignment using embedded features
- Patent number 9,209,369
- Issue date Dec 8, 2015
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical connector assembly
- Patent number 9,188,753
- Issue date Nov 17, 2015
- Intel Corporation
- Simon S. Lee
- G02 - OPTICS
Information Patent Grant
Semiconductor substrate for an optical receiver
- Patent number 9,099,352
- Issue date Aug 4, 2015
- Intel Corporation
- John Heck
- G01 - MEASURING TESTING
Information Patent Grant
Optical frame attached with alignment features microfabricated in die
- Patent number 8,684,612
- Issue date Apr 1, 2014
- Intel Corporation
- Brian H. Kim
- G02 - OPTICS
Information Patent Grant
Optical connection through single assembly overhang flip chip optic...
- Patent number 8,373,259
- Issue date Feb 12, 2013
- Intel Corporation
- Brian H. Kim
- G02 - OPTICS
Information Patent Grant
Redundant channel implementation to extend optical transceiver life...
- Patent number 7,801,442
- Issue date Sep 21, 2010
- Intel Corporation
- Frank Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Aligning lens carriers and ferrules with alignment frames
- Patent number 7,578,623
- Issue date Aug 25, 2009
- Intel Corporation
- William H. Wang
- G02 - OPTICS
Information Patent Grant
Aligning lens carriers and ferrules with alignment frames
- Patent number 7,452,139
- Issue date Nov 18, 2008
- Intel Corporation
- William H. Wang
- G02 - OPTICS
Information Patent Grant
Monolithic active optical cable assembly for data device applicatio...
- Patent number 7,371,014
- Issue date May 13, 2008
- Intel Corporation
- Thomas G. Willis
- G02 - OPTICS
Information Patent Grant
Fiber optic communication assembly
- Patent number 7,352,969
- Issue date Apr 1, 2008
- Intel Corporation
- Brian H. Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transceiver assembly for use in fiber optics communications
- Patent number 7,101,090
- Issue date Sep 5, 2006
- Stratos International, Inc.
- Hengju Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transceiver assembly for use in fiber optics communications
- Patent number 7,097,365
- Issue date Aug 29, 2006
- Stratos International, Inc.
- Hengju Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module with latching/delatching mechanism
- Patent number 7,083,336
- Issue date Aug 1, 2006
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transceiver assembly for use in fiber optics communications
- Patent number 7,073,954
- Issue date Jul 11, 2006
- Stratos International, Inc.
- Hengju Cheng
- G02 - OPTICS
Information Patent Grant
Transceiver assembly for use in fiber optics communications
- Patent number 7,073,955
- Issue date Jul 11, 2006
- Stratos International, Inc.
- Hengju Cheng
- G02 - OPTICS
Information Patent Grant
Transceiver assembly for use in fiber optics communications
- Patent number 7,056,032
- Issue date Jun 6, 2006
- Stratos International, Inc.
- Hengju Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lens array for use in parallel optics modules for fiber optics comm...
- Patent number 6,739,766
- Issue date May 25, 2004
- Stratos International, Inc.
- Lee L. Xu
- G02 - OPTICS
Information Patent Grant
Parallel optics subassembly having at least twelve lenses
- Patent number 6,729,771
- Issue date May 4, 2004
- Stratos Lightwave, Inc.
- Brian Kim
- G02 - OPTICS
Information Patent Grant
Method and apparatus for aligning guide pins with a connector guide
- Patent number 6,616,341
- Issue date Sep 9, 2003
- Agilent Technologies, Inc.
- Kendra Gallup
- G02 - OPTICS
Information Patent Grant
Optical systems for Z-axis alignment of fiber, lens and source arrays
- Patent number 6,510,262
- Issue date Jan 21, 2003
- Agilent Technologies, Inc.
- Kendra Gallup
- G02 - OPTICS
Information Patent Grant
Flexible circuit with two stiffeners for optical module packaging
- Patent number 6,492,698
- Issue date Dec 10, 2002
- Agilent Technologies, Inc.
- Brian H. Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY AND PACKAGING OF MEMS DEVICE
- Publication number 20190308874
- Publication date Oct 10, 2019
- InvenSense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND PRESSURE SENSOR
- Publication number 20170334714
- Publication date Nov 23, 2017
- InvenSense, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEMPERATURE STABILIZING ENCLOSURE
- Publication number 20170176062
- Publication date Jun 22, 2017
- InvenSense, Inc.
- Muhammad Maaz QAZI
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
ASSEMBLY AND PACKAGING OF MEMS DEVICE
- Publication number 20170044007
- Publication date Feb 16, 2017
- InvenSense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...
- Publication number 20160167956
- Publication date Jun 16, 2016
- InvenSense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR SEALING A MEMS DEVICE
- Publication number 20160093791
- Publication date Mar 31, 2016
- InvenSense, Inc.
- Anthony D. Minervini
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES
- Publication number 20160087172
- Publication date Mar 24, 2016
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONNECTOR ASSEMBLY
- Publication number 20160062066
- Publication date Mar 3, 2016
- Intel Corporation
- Simon S. Lee
- G02 - OPTICS
Information Patent Application
INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...
- Publication number 20150102390
- Publication date Apr 16, 2015
- Invensense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ASSEMBLY AND PACKAGING OF MEMS DEVICE
- Publication number 20150028432
- Publication date Jan 29, 2015
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL CONNECTOR ASSEMBLY
- Publication number 20140270655
- Publication date Sep 18, 2014
- Simon S. Lee
- G02 - OPTICS
Information Patent Application
EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES
- Publication number 20140175477
- Publication date Jun 26, 2014
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE FOR AN OPTICAL TRANSMITTER APPARATUS AND ME...
- Publication number 20130273672
- Publication date Oct 17, 2013
- John Heck
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL FRAME ATTACHED WITH ALIGNMENT FEATURES MICROFABRICTATED IN DIE
- Publication number 20130004167
- Publication date Jan 3, 2013
- Brian H. Kim
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION THROUGH SINGLE ASSEMBLY OVERHANG FLIP CHIP OPTIC...
- Publication number 20120025209
- Publication date Feb 2, 2012
- Brian H. Kim
- G02 - OPTICS
Information Patent Application
Redundant channel implementation to extend optical transceiver life...
- Publication number 20080273880
- Publication date Nov 6, 2008
- Frank Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Monolithic active optical cable assembly for data device applicatio...
- Publication number 20080044141
- Publication date Feb 21, 2008
- Thomas G. Willis
- G02 - OPTICS
Information Patent Application
Aligning lens carriers and ferrules with alignment frames
- Publication number 20080044140
- Publication date Feb 21, 2008
- William H. Wang
- G02 - OPTICS
Information Patent Application
Aligning lens carriers and ferrules with alignment frames
- Publication number 20080044143
- Publication date Feb 21, 2008
- William H. Wang
- G02 - OPTICS
Information Patent Application
Electro-optical communication system
- Publication number 20060291784
- Publication date Dec 28, 2006
- William H. Wang
- G02 - OPTICS
Information Patent Application
TRANSCEIVER ASSEMBLY FOR USE IN FIBER OPTICS COMMUNICATIONS
- Publication number 20060159403
- Publication date Jul 20, 2006
- Stratos International, Inc.
- Hengju Cheng
- G02 - OPTICS
Information Patent Application
Transceiver assembly for use in fiber optics communications
- Publication number 20060153506
- Publication date Jul 13, 2006
- Stratos International, Inc.
- Hengju Cheng
- G02 - OPTICS
Information Patent Application
TRANSCEIVER ASSEMBLY FOR USE IN FIBER OPTICS COMMUNICATIONS
- Publication number 20060153505
- Publication date Jul 13, 2006
- Stratos International, Inc.
- Hengju Cheng
- G02 - OPTICS
Information Patent Application
Transceiver assembly for use in fiber optics communications
- Publication number 20060147159
- Publication date Jul 6, 2006
- Stratos International, Inc.
- Hengju Cheng
- G02 - OPTICS
Information Patent Application
Optical transceiver module
- Publication number 20060067630
- Publication date Mar 30, 2006
- Brian H. Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fiber optic communication assembly
- Publication number 20060067684
- Publication date Mar 30, 2006
- Brian H. Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Optical module with latching/delatching mechanism
- Publication number 20050196109
- Publication date Sep 8, 2005
- Intel Corporation
- Brian H. Kim
- G02 - OPTICS
Information Patent Application
Lens array for use in parallel optics modules for fiber optics comm...
- Publication number 20030113077
- Publication date Jun 19, 2003
- PARACER, INC.
- Lee L. Xu
- G02 - OPTICS
Information Patent Application
Subassembly for use in fiber optic communications
- Publication number 20030113071
- Publication date Jun 19, 2003
- PARACER, INC.
- Brian Kim
- G02 - OPTICS
Information Patent Application
Transceiver assembly for use in fiber optics communications
- Publication number 20030053762
- Publication date Mar 20, 2003
- Hengju Cheng
- G02 - OPTICS

Brian H. KIM

Person

Patents Grantslast 30 patents

Temperature stabilizing enclosure

Assembly and packaging of MEMS device

Integrated package containing MEMS acoustic sensor and pressure sensor

Integrated CMOS back cavity acoustic transducer and the method of p...

Edge coupling alignment using embedded features

Assembly and packaging of MEMS device

Optical connector assembly

Integrated CMOS back cavity acoustic transducer and the method of p...

Edge coupling alignment using embedded features

Optical connector assembly

Semiconductor substrate for an optical receiver

Optical frame attached with alignment features microfabricated in die

Optical connection through single assembly overhang flip chip optic...

Redundant channel implementation to extend optical transceiver life...

Aligning lens carriers and ferrules with alignment frames

Aligning lens carriers and ferrules with alignment frames

Monolithic active optical cable assembly for data device applicatio...

Fiber optic communication assembly

Transceiver assembly for use in fiber optics communications

Transceiver assembly for use in fiber optics communications

Optical module with latching/delatching mechanism

Transceiver assembly for use in fiber optics communications

Transceiver assembly for use in fiber optics communications

Transceiver assembly for use in fiber optics communications

Lens array for use in parallel optics modules for fiber optics comm...

Parallel optics subassembly having at least twelve lenses

Method and apparatus for aligning guide pins with a connector guide

Optical systems for Z-axis alignment of fiber, lens and source arrays

Flexible circuit with two stiffeners for optical module packaging

Patents Applicationslast 30 patents

ASSEMBLY AND PACKAGING OF MEMS DEVICE

INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND PRESSURE SENSOR

TEMPERATURE STABILIZING ENCLOSURE

ASSEMBLY AND PACKAGING OF MEMS DEVICE

INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...

APPARATUS AND METHOD FOR SEALING A MEMS DEVICE

EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES

OPTICAL CONNECTOR ASSEMBLY

INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...

ASSEMBLY AND PACKAGING OF MEMS DEVICE

OPTICAL CONNECTOR ASSEMBLY

EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES

SEMICONDUCTOR SUBSTRATE FOR AN OPTICAL TRANSMITTER APPARATUS AND ME...

OPTICAL FRAME ATTACHED WITH ALIGNMENT FEATURES MICROFABRICTATED IN DIE

OPTICAL CONNECTION THROUGH SINGLE ASSEMBLY OVERHANG FLIP CHIP OPTIC...

Redundant channel implementation to extend optical transceiver life...

Monolithic active optical cable assembly for data device applicatio...

Aligning lens carriers and ferrules with alignment frames

Aligning lens carriers and ferrules with alignment frames

Electro-optical communication system

TRANSCEIVER ASSEMBLY FOR USE IN FIBER OPTICS COMMUNICATIONS

Transceiver assembly for use in fiber optics communications

TRANSCEIVER ASSEMBLY FOR USE IN FIBER OPTICS COMMUNICATIONS

Transceiver assembly for use in fiber optics communications

Optical transceiver module

Fiber optic communication assembly

Optical module with latching/delatching mechanism

Lens array for use in parallel optics modules for fiber optics comm...

Subassembly for use in fiber optic communications

Transceiver assembly for use in fiber optics communications