Brian T. Vaccaro

Person

Mertztown, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Soldering method and related device for improved resistance to brit...
- Patent number 8,242,378
- Issue date Aug 14, 2012
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Whisker-free lead frames
- Patent number 8,013,428
- Issue date Sep 6, 2011
- LSI Corporation
- Kultaransingh N. Hooghan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Integrated circuit chip assembly having array of thermally conducti...
- Patent number 7,982,307
- Issue date Jul 19, 2011
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture of devices including solder bumps
- Patent number 7,727,781
- Issue date Jun 1, 2010
- Agere Systems Inc.
- Joze Eura Antol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packages
- Patent number 7,671,436
- Issue date Mar 2, 2010
- Agere Systems Inc.
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus to reduce growth formations on plated conduct...
- Patent number 7,368,326
- Issue date May 6, 2008
- Agere Systems Inc.
- John William Osenbach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRIT...
- Publication number 20120280023
- Publication date Nov 8, 2012
- LSI Corporation
- Ahmed Amin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Method and Related Device for Improved Resistance to Brit...
- Publication number 20100243300
- Publication date Sep 30, 2010
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacture of devices including solder bumps
- Publication number 20100022034
- Publication date Jan 28, 2010
- Joze Eura Antol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Whisker-free lead frames
- Publication number 20090291321
- Publication date Nov 26, 2009
- LSI Corporation
- Kultaransingh N. Hooghan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic packages
- Publication number 20090273078
- Publication date Nov 5, 2009
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip Chip Assembly Having Improved Thermal Dissipation
- Publication number 20080116567
- Publication date May 22, 2008
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Whisker-free lead frames
- Publication number 20060068218
- Publication date Mar 30, 2006
- Kultaransingh N. Hooghan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Methods and apparatus to reduce growth formations on plated conduct...
- Publication number 20050153532
- Publication date Jul 14, 2005
- John William Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array (BGA) package having corner or edge tab supports
- Publication number 20050077080
- Publication date Apr 14, 2005
- Adesoji Dairo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Brian T. Vaccaro

Person

Patents Grantslast 30 patents

Soldering method and related device for improved resistance to brit...

Whisker-free lead frames

Integrated circuit chip assembly having array of thermally conducti...

Manufacture of devices including solder bumps

Electronic packages

Methods and apparatus to reduce growth formations on plated conduct...

Patents Applicationslast 30 patents

SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRIT...

Soldering Method and Related Device for Improved Resistance to Brit...

Manufacture of devices including solder bumps

Whisker-free lead frames

Electronic packages

Flip Chip Assembly Having Improved Thermal Dissipation

Whisker-free lead frames

Methods and apparatus to reduce growth formations on plated conduct...

Ball grid array (BGA) package having corner or edge tab supports