Brian VIA

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Opelika, AL, US

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Patents Grantslast 30 patents

Information Patent Grant
Soy-modified resins for bonding wood
- Patent number 10,899,039
- Issue date Jan 26, 2021
- Auburn University
- Brian Via
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Use of soy flour in resin formulations used to manufacture engineer...
- Patent number 10,266,694
- Issue date Apr 23, 2019
- Auburn University
- Brian Via
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...

Patents Applicationslast 30 patents

Information Patent Application
SOY-SUBSTITUTED COLD-SET RESINS
- Publication number 20230340267
- Publication date Oct 26, 2023
- Auburn University
- BRIAN VIA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DEWATERING VISCOUS LIQUIDS WITH PRESSURIZED CARBON DIOXIDE
- Publication number 20230115487
- Publication date Apr 13, 2023
- Auburn University
- Osei Asafu-Adjaye
- C13 - SUGAR INDUSTRY
Information Patent Application
SOY-MODIFIED RESINS FOR BONDING WOOD
- Publication number 20170266930
- Publication date Sep 21, 2017
- Auburn University
- Brian Via
- B32 - LAYERED PRODUCTS
Information Patent Application
USE OF SOY FLOUR IN RESIN FORMULATIONS USED TO MANUFACTURE ENGINEER...
- Publication number 20160264781
- Publication date Sep 15, 2016
- Auburn University
- Brian VIA
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...