Bruce K. Wachtmann

Person

Concord, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a surface micromachined MEMS device
- Patent number 7,906,359
- Issue date Mar 15, 2011
- Analog Devices, Inc.
- Bruce K. Wachtmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor assembly with conductive rim and method of producing...
- Patent number 7,034,393
- Issue date Apr 25, 2006
- Analog Devices, Inc.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method of forming a device layer
- Patent number 6,964,894
- Issue date Nov 15, 2005
- Analog Devices, Inc.
- Bruce K. Wachtmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
TiW platinum interconnect and method of making the same
- Patent number 6,956,274
- Issue date Oct 18, 2005
- Analog Devices, Inc.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with conductive path through substrate
- Patent number 6,936,918
- Issue date Aug 30, 2005
- Analog Devices, Inc.
- Kieran P. Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
TiW platinum interconnect and method of making the same
- Patent number 6,878,626
- Issue date Apr 12, 2005
- Analog Devices, Inc.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Method of Forming a Micromachined Device Using an Assisted Release
- Publication number 20070207562
- Publication date Sep 6, 2007
- Analog Devices, Inc.
- Bruce K. Wachtmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor assembly with conductive rim and method of producing...
- Publication number 20060118946
- Publication date Jun 8, 2006
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Conductive bond for through-wafer interconnect
- Publication number 20050170609
- Publication date Aug 4, 2005
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH CONDUCTIVE PATH THROUGH SUBSTRATE
- Publication number 20050127499
- Publication date Jun 16, 2005
- Kieran P. Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor assembly with conductive rim and method of producing...
- Publication number 20050127525
- Publication date Jun 16, 2005
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and method of forming a device layer
- Publication number 20040256689
- Publication date Dec 23, 2004
- Bruce K. Wachtmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming a surface micromachined MEMS device
- Publication number 20040104453
- Publication date Jun 3, 2004
- Bruce K. Wachtmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS device with alternative electrical connections
- Publication number 20040104444
- Publication date Jun 3, 2004
- Bruce K. Wachtmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TiW platinum interconnect and method of making the same
- Publication number 20030132522
- Publication date Jul 17, 2003
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bruce K. Wachtmann

Person

Patents Grantslast 30 patents

Method of forming a surface micromachined MEMS device

Semiconductor assembly with conductive rim and method of producing...

Apparatus and method of forming a device layer

TiW platinum interconnect and method of making the same

MEMS device with conductive path through substrate

TiW platinum interconnect and method of making the same

Patents Applicationslast 30 patents

Method of Forming a Micromachined Device Using an Assisted Release

Semiconductor assembly with conductive rim and method of producing...

Conductive bond for through-wafer interconnect

MEMS DEVICE WITH CONDUCTIVE PATH THROUGH SUBSTRATE

Semiconductor assembly with conductive rim and method of producing...

Apparatus and method of forming a device layer

Method of forming a surface micromachined MEMS device

MEMS device with alternative electrical connections

TiW platinum interconnect and method of making the same