Bruce Trevino

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Spring, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Connector component and retention mechanism for M.2 form factor module
- Patent number 10,193,249
- Issue date Jan 29, 2019
- Hewlett-Packard Development Company, L.P.
- Chi So
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTOR COMPONENT
- Publication number 20170005422
- Publication date Jan 5, 2017
- Hewlett-Packard Development Company, L.P.
- Chi So
- H01 - BASIC ELECTRIC ELEMENTS