Buford H. Carter Jr.

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame tooling design for bleed barrier groove
- Patent number 6,465,274
- Issue date Oct 15, 2002
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame tooling design for exposed pad features
- Patent number 6,401,765
- Issue date Jun 11, 2002
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor ball grid array device and method...
- Patent number 6,365,980
- Issue date Apr 2, 2002
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with depressions for receiving solder bal...
- Patent number 6,365,976
- Issue date Apr 2, 2002
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance power package for integrated circuits
- Patent number 6,211,462
- Issue date Apr 3, 2001
- Texas Instruments Incorporated
- Buford H. Carter
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Exposed leadframe for semiconductor packages and bend forming metho...
- Patent number 6,072,230
- Issue date Jun 6, 2000
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad for integrated circuit
- Patent number 5,905,308
- Issue date May 18, 1999
- Texas Instruments Incorporated
- Taylor R. Efland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device package for high frequency applications
- Patent number 5,663,597
- Issue date Sep 2, 1997
- Texas Instruments Incorporated
- Stephen R. Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Downset exposed die mount pad leadframe and package
- Patent number 5,594,234
- Issue date Jan 14, 1997
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging
- Patent number 5,376,909
- Issue date Dec 27, 1994
- Texas Instruments Incorporated
- Stephen R. Nelson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PCB solder pad geometry including patterns improving solder coverage
- Publication number 20030141103
- Publication date Jul 31, 2003
- Wee Lee Ng
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead frame tooling design for bleed barrier groove
- Publication number 20020047185
- Publication date Apr 25, 2002
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame tooling design for bleed barrier groove
- Publication number 20020025598
- Publication date Feb 28, 2002
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS

Buford H. Carter Jr.

Person

Patents Grantslast 30 patents

Lead frame tooling design for bleed barrier groove

Lead frame tooling design for exposed pad features

Thermally enhanced semiconductor ball grid array device and method...

Integrated circuit device with depressions for receiving solder bal...

Low inductance power package for integrated circuits

Exposed leadframe for semiconductor packages and bend forming metho...

Bond pad for integrated circuit

RF device package for high frequency applications

Downset exposed die mount pad leadframe and package

Device packaging

Patents Applicationslast 30 patents

PCB solder pad geometry including patterns improving solder coverage

Lead frame tooling design for bleed barrier groove

Lead frame tooling design for bleed barrier groove