Claims
- 1. A package for a device comprising:
- a. a leadframe comprising leads for effecting circuit connections to said device wherein at least one of said leads is an RF lead having a low pass filter characteristic;
- b. a metal ground piece separate from but connected to said leadframe on a frontside of said metal ground piece and exposed on a backside of said metal ground piece after encapsulation;
- c. one or more RF port lead pairs each comprising a coupled lead pair formed from said leads; and
- d. one or more ground lead pair each comprising a coupled lead pair formed from said leads.
- 2. The package of claim 1, wherein said ground piece is a ground slug.
- 3. The package of claim 1, wherein said ground piece is a metal ground plane which serves as a base for said package.
- 4. The package of claim 1, wherein one or more of said leads is substantially wider than the remainder of said leads.
- 5. The package of claim 4, wherein, in operation, said wider leads are connected to ground.
- 6. The package of claim 4, wherein, in operation, said wider leads carry RF signals.
- 7. The package of claim 1, wherein said RF ports are separated by ground leads.
- 8. The package of claim 1, wherein said RF ports are essentially diagonal to each other in said package.
- 9. The package of claim 1, wherein said RF ports are on opposite sides of said package.
- 10. The package of claim 1, wherein said leadframe is extended inward to facilitate connection to said device.
- 11. The package of claim 1, wherein a ceramic circuit is used to route signals and minimize wire lengths.
- 12. The package of claim 1, wherein multiple components are installed therein.
- 13. The package of claim 1, wherein said package is encapsulated in optically transparent plastic.
- 14. The package of claim 1, wherein said package is a small outline package.
- 15. A packaged device comprising:
- a. a leadframe comprising leads for effecting circuit connections to said device wherein at least one of said leads is an RF lead having a low pass filter characteristic; and
- b. a metal ground piece separate from but connected to said leadframe on a frontside of said metal ground piece and exposed on a backside of said metal ground piece after encapsulation;
- c. one or more RF port lead pairs each comprising a coupled lead pair formed from said leads; and
- d. one or more ground lead pairs each comprising a coupled lead pair formed from said leads.
- 16. The packaged device of claim 15, wherein said device is an amplifier.
- 17. The packaged device of claim 16, wherein said amplifier includes GaAs heterojunction bipolar transistors.
- 18. The packaged device of claim 15, wherein said device is a portion of a communication system.
- 19. The packaged device of claim 15, wherein said device is a switch.
- 20. The packaged device of claim 15, wherein said device is operable in a X-band frequency range.
Parent Case Info
This application is a continuation of application Ser. No. 07/967,483, filed Oct. 26, 1992 abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0052054 |
May 1982 |
EPX |
0272187 |
Jun 1988 |
EPX |
0331289 |
Sep 1989 |
EPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
967483 |
Oct 1992 |
|