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Bunji Yasumura
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
10,566,255
Issue date
Feb 18, 2020
Renesas Electronics Corporation
Toshihiko Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,163,740
Issue date
Dec 25, 2018
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
10,141,295
Issue date
Nov 27, 2018
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
10,134,648
Issue date
Nov 20, 2018
Renesas Electronics Corporation
Toshihiko Akiba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with bond pad wiring lead-out arrangement avoi...
Patent number
9,911,673
Issue date
Mar 6, 2018
Renesas Electronics Corporation
Toshihiko Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
9,825,017
Issue date
Nov 21, 2017
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,824,944
Issue date
Nov 21, 2017
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with bond pad wiring lead-out arrangement avoi...
Patent number
9,646,901
Issue date
May 9, 2017
Renesas Electronics Corporation
Toshihiko Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
9,490,218
Issue date
Nov 8, 2016
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
9,230,938
Issue date
Jan 5, 2016
Renesas Electronics Corporation
Akio Hasebe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,165,845
Issue date
Oct 20, 2015
Renesas Electronics Corporation
Toshihiko Akiba
G01 - MEASURING TESTING
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
9,053,954
Issue date
Jun 9, 2015
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
8,945,953
Issue date
Feb 3, 2015
Renesas Electronics Corporation
Akio Hasebe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
8,946,705
Issue date
Feb 3, 2015
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
8,912,540
Issue date
Dec 16, 2014
Renesas Electronics Corporations
Toshihiko Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
8,415,199
Issue date
Apr 9, 2013
Renesas Electronics Corporation
Toshihiko Akiba
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device and manufacturing method of the same
Patent number
8,101,433
Issue date
Jan 24, 2012
Renesas Electronics Corporation
Toshihiko Akiba
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20190348332
Publication date
Nov 14, 2019
RENESAS ELECTRONICS CORPORATION
Toshihiko AKIBA
G01 - MEASURING TESTING
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20190057913
Publication date
Feb 21, 2019
RENESAS ELECTRONICS CORPORATION
Toshihiko AKIBA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20180145001
Publication date
May 24, 2018
RENESAS ELECTRONICS CORPORATION
Toshihiko Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20180040598
Publication date
Feb 8, 2018
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20180040521
Publication date
Feb 8, 2018
RENESAS ELECTRONICS CORPORATION
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH BOND PAD WIRING LEAD-OUT ARRANGEMENT AVOI...
Publication number
20170229359
Publication date
Aug 10, 2017
RENESAS ELECTRONICS CORPORATION
Toshihiko Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20170018470
Publication date
Jan 19, 2017
RENESAS ELECTRONICS CORPORATION
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20170005080
Publication date
Jan 5, 2017
RENESAS ELECTRONICS CORPORATION
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20160336244
Publication date
Nov 17, 2016
RENESAS ELECTRONICS CORPORATION
Toshihiko Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Manufacturing Method of Semiconductor Device
Publication number
20160035636
Publication date
Feb 4, 2016
Renesas Electronics Corporation
Toshihiko Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20150243605
Publication date
Aug 27, 2015
RENESAS ELECTRONICS CORPORATION
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20150137125
Publication date
May 21, 2015
Renesas Electronics Corporation
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20150111317
Publication date
Apr 23, 2015
Renesas Electronics Corporation
Akio Hasebe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20140361299
Publication date
Dec 11, 2014
Toshihiko Akiba
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
Publication number
20140287541
Publication date
Sep 25, 2014
RENESAS ELECTRONICS CORPORATION
Bunji Yasumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20140179032
Publication date
Jun 26, 2014
RENESAS ELECTRONICS CORPORATION
Akio Hasebe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Manufacturing Method of Semiconductor Device
Publication number
20120077310
Publication date
Mar 29, 2012
Renesas Electronics Corporation
Toshihiko AKIBA
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20100295043
Publication date
Nov 25, 2010
RENESAS TECHNOLOGY CORP.
Bunji YASUMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20090243118
Publication date
Oct 1, 2009
RENESAS TECHNOLOGY CORP.
Toshihiko AKIBA
G01 - MEASURING TESTING