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Bunshi Kuratomi
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Kodaira, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
8,476,113
Issue date
Jul 2, 2013
Renesas Electronics Corporation
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
8,117,742
Issue date
Feb 21, 2012
Renesas Electronics Corporation
Bunshi Kuratomi
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
8,119,050
Issue date
Feb 21, 2012
Renesas Electronics Corporation
Bunshi Kuratomi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,681,308
Issue date
Mar 23, 2010
Renesas Eastern Japan Semiconductor, Inc.
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
7,632,720
Issue date
Dec 15, 2009
Renesas Technology Corp.
Bunshi Kuratomi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
7,445,969
Issue date
Nov 4, 2008
Renesas Technology Corp.
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,377,031
Issue date
May 27, 2008
Renesas Technology Corp.
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
7,288,440
Issue date
Oct 30, 2007
Renesas Technology Corp.
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit card and a method of manufacturing the same
Patent number
7,176,060
Issue date
Feb 13, 2007
Renesas Technology Corp.
Nobuaki Yamada
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,144,755
Issue date
Dec 5, 2006
Renesas Technology Corp.
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,037,760
Issue date
May 2, 2006
Renesas Technology Corp.
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
6,797,542
Issue date
Sep 28, 2004
Renesas Technology Corp.
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20120009737
Publication date
Jan 12, 2012
RENESAS ELECTRONICS CORPORATION
Bunshi KURATOMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20100233857
Publication date
Sep 16, 2010
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20090160084
Publication date
Jun 25, 2009
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20090004779
Publication date
Jan 1, 2009
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Memory card and manufacturing method of the same
Publication number
20080173995
Publication date
Jul 24, 2008
RENESAS TECHNOLOGY CORP.
Bunshi Kuratomi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20080057626
Publication date
Mar 6, 2008
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
Publication number
20080020510
Publication date
Jan 24, 2008
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a semiconductor device
Publication number
20070057379
Publication date
Mar 15, 2007
RENESAS TECHNOLOGY CORP.
Bunshi Kuratomi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Method of manufacturing a semiconductor device
Publication number
20060216867
Publication date
Sep 28, 2006
Youichi Kawata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20060105504
Publication date
May 18, 2006
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a semiconductor device
Publication number
20060043641
Publication date
Mar 2, 2006
Bunshi Kuratomi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Method of manufacturing a semiconductor device
Publication number
20050106786
Publication date
May 19, 2005
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a semiconductor device
Publication number
20050070047
Publication date
Mar 31, 2005
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit card and a method of manufacturing the same
Publication number
20050052851
Publication date
Mar 10, 2005
Nobuaki Yamada
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20050019979
Publication date
Jan 27, 2005
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20040166605
Publication date
Aug 26, 2004
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20030153130
Publication date
Aug 14, 2003
Bunshi Kuratomi
H01 - BASIC ELECTRIC ELEMENTS