Burton J. Carpenter Jr.

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency packages containing multilevel power substrates and...
- Patent number 12,040,291
- Issue date Jul 16, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,967,507
- Issue date Apr 23, 2024
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having galvanic isolation and method t...
- Patent number 11,502,068
- Issue date Nov 15, 2022
- NXP USA, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having galvanic isolation and method t...
- Patent number 11,462,494
- Issue date Oct 4, 2022
- NXP USA, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,222,790
- Issue date Jan 11, 2022
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having stacked die and method for making
- Patent number 11,164,826
- Issue date Nov 2, 2021
- NXP USA, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid lead frame for semiconductor die package with improved creep...
- Patent number 10,734,311
- Issue date Aug 4, 2020
- NXP USA, INC.
- Mariano Layson Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having stacked die and method for therefor
- Patent number 10,734,312
- Issue date Aug 4, 2020
- NXP USA, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead reduction for improved creepage distance
- Patent number 10,734,327
- Issue date Aug 4, 2020
- NXP USA, INC.
- Mariano Layson Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having stacked die and method for therefor
- Patent number 10,446,476
- Issue date Oct 15, 2019
- NXP USA, INC.
- Leo M. Higgins
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device and methods
- Patent number 10,249,557
- Issue date Apr 2, 2019
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method for forming
- Patent number 10,242,935
- Issue date Mar 26, 2019
- NXP USA, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum clad copper structure of an electronic component package a...
- Patent number 9,437,459
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated bonding wire and methods for bonding using same
- Patent number 9,368,470
- Issue date Jun 14, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for reducing corrosion in wire bonds
- Patent number 9,324,675
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device assembly having a heat sp...
- Patent number 9,111,878
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with multilayer flex interconnect structures
- Patent number 9,111,937
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming die assembly with heat spreader
- Patent number 9,059,144
- Issue date Jun 16, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating a bond pad of a package substrate
- Patent number 9,012,263
- Issue date Apr 21, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 8,802,508
- Issue date Aug 12, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for configuring conductive elements for a semic...
- Patent number 8,754,518
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device assembly having a heat spreader
- Patent number 8,754,521
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an air gap and method for fo...
- Patent number 8,704,370
- Issue date Apr 22, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die assembly with heat spreader
- Patent number 8,674,509
- Issue date Mar 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded electronic component
- Patent number 8,556,159
- Issue date Oct 15, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged die for heat dissipation and method therefor
- Patent number 8,536,697
- Issue date Sep 17, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having pads and input/output (I/O) cells
- Patent number 7,808,117
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plated contacts and method thereof
- Patent number 5,990,547
- Issue date Nov 23, 1999
- Motorola, Inc.
- Laxminarayan Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positive photoresist composition containing photoacid generator and...
- Patent number 5,498,765
- Issue date Mar 12, 1996
- International Business Machines Corporation
- Burton J. Carpenter
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM COMPRISING A GATE DRIVER
- Publication number 20240380307
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Jerry Rudiak
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...
- Publication number 20230197645
- Publication date Jun 22, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING GALVANIC ISOLATION AND METHOD THEREFOR
- Publication number 20230085441
- Publication date Mar 16, 2023
- NXP USA, Inc.
- Jerry Rudiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING GALVANIC ISOLATION AND METHOD T...
- Publication number 20220285330
- Publication date Sep 8, 2022
- NXP USA, Inc.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING GALVANIC ISOLATION AND METHOD T...
- Publication number 20220102292
- Publication date Mar 31, 2022
- NXP USA, Inc.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20220093416
- Publication date Mar 24, 2022
- NXP USA, Inc.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20210202267
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR MAKING
- Publication number 20210066217
- Publication date Mar 4, 2021
- NXP USA, Inc.
- Burton Jesse Carpenter
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEP...
- Publication number 20200203262
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Mariano Layson CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE
- Publication number 20200203289
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Mariano Layson CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR
- Publication number 20200027823
- Publication date Jan 23, 2020
- NXP USA, Inc.
- BURTON JESSE CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR
- Publication number 20190088576
- Publication date Mar 21, 2019
- NXP USA, Inc.
- LEO M. HIGGINS
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING
- Publication number 20190067172
- Publication date Feb 28, 2019
- NXP USA, Inc.
- Burton Jesse CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE AND METHODS
- Publication number 20180342444
- Publication date Nov 29, 2018
- NXP USA, Inc.
- Leo M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BONDING WIRE AND METHODS FOR BONDING USING SAME
- Publication number 20160126208
- Publication date May 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH IMPROVED RELIABILITY
- Publication number 20160064316
- Publication date Mar 3, 2016
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH FOR WIREBONDING
- Publication number 20150380376
- Publication date Dec 31, 2015
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE
- Publication number 20150318240
- Publication date Nov 5, 2015
- FREESCALE SEMICONDUCTOR, INC.
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS
- Publication number 20150311173
- Publication date Oct 29, 2015
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES
- Publication number 20150303169
- Publication date Oct 22, 2015
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE
- Publication number 20150118791
- Publication date Apr 30, 2015
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET
- Publication number 20140374891
- Publication date Dec 25, 2014
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH MULTILAYER FLEX INTERCONNECT STRUCTURES
- Publication number 20140353830
- Publication date Dec 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMNG A SEMICONDUCTOR DEVICE ASSEMBLY HAVING A HEAT SPR...
- Publication number 20140213018
- Publication date Jul 31, 2014
- Leo M. Higgins III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20140147975
- Publication date May 29, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Electronic Component Packages with Through Mold...
- Publication number 20140063742
- Publication date Mar 6, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN AIR GAP AND METHOD FOR FO...
- Publication number 20140001632
- Publication date Jan 2, 2014
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE ASSEMBLY WITH HEAT SPREADER
- Publication number 20130320548
- Publication date Dec 5, 2013
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS

Burton J. Carpenter Jr.

Person

Patents Grantslast 30 patents

Radio frequency packages containing multilevel power substrates and...

Tie bar removal for semiconductor device packaging

Semiconductor device package having galvanic isolation and method t...

Semiconductor device package having galvanic isolation and method t...

Tie bar removal for semiconductor device packaging

Packaged integrated circuit having stacked die and method for making

Hybrid lead frame for semiconductor die package with improved creep...

Packaged integrated circuit having stacked die and method for therefor

Lead reduction for improved creepage distance

Packaged integrated circuit having stacked die and method for therefor

Surface finish for wirebonding

Packaged integrated circuit device and methods

Packaged semiconductor device and method for forming

Aluminum clad copper structure of an electronic component package a...

Coated bonding wire and methods for bonding using same

Structures for reducing corrosion in wire bonds

Method for forming a semiconductor device assembly having a heat sp...

Semiconductor devices with multilayer flex interconnect structures

Method for forming die assembly with heat spreader

Method for treating a bond pad of a package substrate

Semiconductor device package

Devices and methods for configuring conductive elements for a semic...

Semiconductor device assembly having a heat spreader

Semiconductor package structure having an air gap and method for fo...

Integrated circuit die assembly with heat spreader

Embedded electronic component

Packaged die for heat dissipation and method therefor

Integrated circuit having pads and input/output (I/O) cells

Semiconductor device having plated contacts and method thereof

Positive photoresist composition containing photoacid generator and...

Patents Applicationslast 30 patents

SYSTEM COMPRISING A GATE DRIVER

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...

SEMICONDUCTOR DEVICE HAVING GALVANIC ISOLATION AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGE HAVING GALVANIC ISOLATION AND METHOD T...

SEMICONDUCTOR DEVICE PACKAGE HAVING GALVANIC ISOLATION AND METHOD T...

TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING

TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING

PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR MAKING

HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEP...

LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE

PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR

PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR

PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING

PACKAGED INTEGRATED CIRCUIT DEVICE AND METHODS

COATED BONDING WIRE AND METHODS FOR BONDING USING SAME

PACKAGE SUBSTRATE WITH IMPROVED RELIABILITY

SURFACE FINISH FOR WIREBONDING

ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE

STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS

SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES

METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE

SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET

TIN-BASED WIREBOND STRUCTURES

SEMICONDUCTOR DEVICES WITH MULTILAYER FLEX INTERCONNECT STRUCTURES

METHOD FOR FORMNG A SEMICONDUCTOR DEVICE ASSEMBLY HAVING A HEAT SPR...

SEMICONDUCTOR DEVICE PACKAGE

Thermally Enhanced Electronic Component Packages with Through Mold...

SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN AIR GAP AND METHOD FOR FO...

INTEGRATED CIRCUIT DIE ASSEMBLY WITH HEAT SPREADER