Buu Q. Diep

Person

Murphy, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Preventing epoxy bleed-out for biosensor devices
- Patent number 12,031,949
- Issue date Jul 9, 2024
- Qorvo US, Inc.
- Buu Quoc Diep
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing acoustic devices with improved performance
- Patent number 11,990,885
- Issue date May 21, 2024
- Qorvo US, Inc.
- Buu Quoc Diep
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
WLP BAW device with through-WLP vias
- Patent number 10,931,257
- Issue date Feb 23, 2021
- Qorvo US, Inc.
- Paul Stokes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic sensor device having UV-blocking cover
- Patent number 10,659,000
- Issue date May 19, 2020
- QORVO BIOTECHNOLOGIES, LLC
- Buu Quoc Diep
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
BAW devices having top electrode leads with reduced reflectance
- Patent number 10,574,210
- Issue date Feb 25, 2020
- Qorvo US, Inc.
- Buu Quoc Diep
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer-level-packaged BAW devices with surface mount connection stru...
- Patent number 10,367,470
- Issue date Jul 30, 2019
- Qorvo US, Inc.
- Matthew L. Wasilik
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 10,315,918
- Issue date Jun 11, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 10,262,913
- Issue date Apr 16, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level MEMS package including dual seal ring
- Patent number 9,969,610
- Issue date May 15, 2018
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,966,320
- Issue date May 8, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level MEMS package including dual seal ring
- Patent number 9,771,258
- Issue date Sep 26, 2017
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed package having stress reducing layer
- Patent number 9,708,181
- Issue date Jul 18, 2017
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,520,332
- Issue date Dec 13, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 9,427,776
- Issue date Aug 30, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed package having stress reducing layer
- Patent number 9,334,154
- Issue date May 10, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaged infrared (IR) focal plane array (FPA) with eva...
- Patent number 9,227,839
- Issue date Jan 5, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Getter structure and method for forming such structure
- Patent number 9,196,556
- Issue date Nov 24, 2015
- Raytheon Company
- Roland Gooch
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,187,312
- Issue date Nov 17, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,174,836
- Issue date Nov 3, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 9,132,496
- Issue date Sep 15, 2015
- Raytheon Company
- Buu Q. Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming deposited patterns on a surface
- Patent number 9,105,800
- Issue date Aug 11, 2015
- Raytheon Company
- Roland Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,093,444
- Issue date Jul 28, 2015
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Disposable bond gap control structures
- Patent number 9,073,298
- Issue date Jul 7, 2015
- Raytheon Company
- Buu Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protecting an optical surface
- Patent number 9,022,584
- Issue date May 5, 2015
- Raytheon Company
- Stephen H. Black
- G02 - OPTICS
Information Patent Grant
Fabrication of window cavity cap structures in wafer level packaging
- Patent number 8,980,676
- Issue date Mar 17, 2015
- Raytheon Company
- Buu Diep
- G01 - MEASURING TESTING
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 8,844,793
- Issue date Sep 30, 2014
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Incident radiation detector packaging
- Patent number 8,809,784
- Issue date Aug 19, 2014
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 8,736,045
- Issue date May 27, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device structures and their fabrication
- Patent number 8,530,984
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Disposable bond gap control structures
- Patent number 8,454,789
- Issue date Jun 4, 2013
- Raytheon Company
- Buu Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DETECTION OF SENSOR PASSIVATION FAILURE
- Publication number 20240353376
- Publication date Oct 24, 2024
- Qorvo US, Inc.
- Cody ROMBACH
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING ACOUSTIC DEVICES WITH IMPROVED PERFORMANCE
- Publication number 20240258982
- Publication date Aug 1, 2024
- Qorvo US, Inc.
- Buu Quoc Diep
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS FOR DEPOSITING PIEZOELECTRIC MATERIALS, AND MATERIALS DEPOS...
- Publication number 20230389430
- Publication date Nov 30, 2023
- QORVO BIOTECHNOLOGIES, LLC
- Derya Deniz
Information Patent Application
Assemblies Including an Acoustic Resonator Device and Methods of Fo...
- Publication number 20230378928
- Publication date Nov 23, 2023
- Qorvo Biotechnologies LLC
- Chuck Edward Carpenter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MANUFACTURING ACOUSTIC DEVICES WITH IMPROVED PERFORMANCE
- Publication number 20220416744
- Publication date Dec 29, 2022
- Qorvo US, Inc.
- Buu Quoc Diep
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PREVENTING EPOXY BLEED-OUT FOR BIOSENSOR DEVICES
- Publication number 20220404318
- Publication date Dec 22, 2022
- Qorvo US, Inc.
- Buu Quoc Diep
- G01 - MEASURING TESTING
Information Patent Application
WLP BAW DEVICE WITH THROUGH-WLP VIAS
- Publication number 20200007111
- Publication date Jan 2, 2020
- Qorvo US, Inc.
- Paul Stokes
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20180226309
- Publication date Aug 9, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL-PACKAGED BAW DEVICES WITH SURFACE MOUNT CONNECTION STRU...
- Publication number 20180109237
- Publication date Apr 19, 2018
- Qorvo US, Inc.
- Matthew L. Wasilik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUIDIC SENSOR DEVICE HAVING UV-BLOCKING COVER
- Publication number 20170294892
- Publication date Oct 12, 2017
- Qorvo US, Inc.
- Buu Quoc DIEP
- G01 - MEASURING TESTING
Information Patent Application
BAW DEVICES HAVING TOP ELECTRODE LEADS WITH REDUCED REFLECTANCE
- Publication number 20170288644
- Publication date Oct 5, 2017
- Qorvo US, Inc.
- Buu Quoc Diep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
- Publication number 20170129775
- Publication date May 11, 2017
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20170011977
- Publication date Jan 12, 2017
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
- Publication number 20160376146
- Publication date Dec 29, 2016
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...
- Publication number 20160340179
- Publication date Nov 24, 2016
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
- Publication number 20160167959
- Publication date Jun 16, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
- Publication number 20160040282
- Publication date Feb 11, 2016
- Raytheon Company
- Roland Gooch
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER
- Publication number 20160039665
- Publication date Feb 11, 2016
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVA...
- Publication number 20150321905
- Publication date Nov 12, 2015
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20150279755
- Publication date Oct 1, 2015
- Raytheon Company
- Roland W. Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE
- Publication number 20150249042
- Publication date Sep 3, 2015
- Raytheon Company
- Roland Gooch
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE
- Publication number 20150162479
- Publication date Jun 11, 2015
- Raytheon Company
- Roland Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING FORMATION OF OXIDE ON SOLDER
- Publication number 20150076216
- Publication date Mar 19, 2015
- Raytheon Company
- Buu Q. Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20150014854
- Publication date Jan 15, 2015
- Raytheon Company
- Roland W. Gooch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140193948
- Publication date Jul 10, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE
- Publication number 20140175590
- Publication date Jun 26, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...
- Publication number 20140053966
- Publication date Feb 27, 2014
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication of Window Cavity Cap Structures in Wafer Level Packaging
- Publication number 20130344638
- Publication date Dec 26, 2013
- Raytheon Company
- Buu Diep
- G01 - MEASURING TESTING

Buu Q. Diep

Person

Patents Grantslast 30 patents

Preventing epoxy bleed-out for biosensor devices

Method for manufacturing acoustic devices with improved performance

WLP BAW device with through-WLP vias

Fluidic sensor device having UV-blocking cover

BAW devices having top electrode leads with reduced reflectance

Wafer-level-packaged BAW devices with surface mount connection stru...

Method of stress relief in anti-reflective coated cap wafers for wa...

Wafer level package solder barrier used as vacuum getter

Wafer level MEMS package including dual seal ring

Wafer level package solder barrier used as vacuum getter

Wafer level MEMS package including dual seal ring

Hermetically sealed package having stress reducing layer

Wafer level package solder barrier used as vacuum getter

Method of stress relief in anti-reflective coated cap wafers for wa...

Hermetically sealed package having stress reducing layer

Wafer level packaged infrared (IR) focal plane array (FPA) with eva...

Getter structure and method for forming such structure

Integrated bondline spacers for wafer level packaged circuit devices

Integrated bondline spacers for wafer level packaged circuit devices

Reducing formation of oxide on solder

Method of forming deposited patterns on a surface

Wafer level package solder barrier used as vacuum getter

Disposable bond gap control structures

Protecting an optical surface

Fabrication of window cavity cap structures in wafer level packaging

Reducing formation of oxide on solder

Incident radiation detector packaging

Integrated bondline spacers for wafer level packaged circuit devices

Semiconductor device structures and their fabrication

Disposable bond gap control structures

Patents Applicationslast 30 patents

DETECTION OF SENSOR PASSIVATION FAILURE

METHOD FOR MANUFACTURING ACOUSTIC DEVICES WITH IMPROVED PERFORMANCE

METHODS FOR DEPOSITING PIEZOELECTRIC MATERIALS, AND MATERIALS DEPOS...

Assemblies Including an Acoustic Resonator Device and Methods of Fo...

METHOD FOR MANUFACTURING ACOUSTIC DEVICES WITH IMPROVED PERFORMANCE

PREVENTING EPOXY BLEED-OUT FOR BIOSENSOR DEVICES

WLP BAW DEVICE WITH THROUGH-WLP VIAS

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

WAFER-LEVEL-PACKAGED BAW DEVICES WITH SURFACE MOUNT CONNECTION STRU...

FLUIDIC SENSOR DEVICE HAVING UV-BLOCKING COVER

BAW DEVICES HAVING TOP ELECTRODE LEADS WITH REDUCED REFLECTANCE

WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...

HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER

GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE

HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER

WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVA...

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE

METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE

REDUCING FORMATION OF OXIDE ON SOLDER

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WA...

Fabrication of Window Cavity Cap Structures in Wafer Level Packaging