Byung-Kook Sun

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing printed circuit board with embedded resistor
- Patent number 7,284,317
- Issue date Oct 23, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Suk-Hyun Cho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel multi-layer printed circuit board having improved intercon...
- Patent number 7,279,412
- Issue date Oct 9, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing package substrate with fine circuit pattern...
- Patent number 7,169,707
- Issue date Jan 30, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Duck Young Maeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing build-up multi-layer printed circuit board...
- Patent number 6,405,431
- Issue date Jun 18, 2002
- Samsung Electro-Mechanics Co., Ltd.
- Dong Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 6,393,696
- Issue date May 28, 2002
- Samsung Electro-Mechanics Co., Ltd.
- Kyung-Ro Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multi-layer printed circuit board
- Patent number 6,119,335
- Issue date Sep 19, 2000
- Samsung Electro-Mechanics Co., Ltd.
- Keon Yang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of fabricating printed circuit board
- Publication number 20060172533
- Publication date Aug 3, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Byung Kook Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating high density printed circuit board
- Publication number 20060102383
- Publication date May 18, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Hye Yeon Cha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating package substrate using electroless nickel pl...
- Publication number 20060060558
- Publication date Mar 23, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Duck Young Maeng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing package substrate with fine circuit pattern...
- Publication number 20060046485
- Publication date Mar 2, 2006
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Duck Young Maeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating PCB in parallel manner
- Publication number 20060029726
- Publication date Feb 9, 2006
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double-sided printed circuit board without via holes and method of...
- Publication number 20050284657
- Publication date Dec 29, 2005
- SUMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang-Sup Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing printed circuit board with embedded resistor
- Publication number 20050175385
- Publication date Aug 11, 2005
- Samsung Electro-Mechanics CO., LTD.
- Suk-Hyun Cho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Parallel multi-layer printed circuit board having improved intercon...
- Publication number 20050085065
- Publication date Apr 21, 2005
- Samsung Electro-Mechanics CO., LTD.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating multi-layered printed circuit board
- Publication number 20040194303
- Publication date Oct 7, 2004
- Samsung Electro-Mechanics CO., LTD.
- Eung-Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double-sided printed circuit board without via holes and method of...
- Publication number 20040124003
- Publication date Jul 1, 2004
- Chang-Sup Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Byung-Kook Sun

Person

Patents Grantslast 30 patents

Method of producing printed circuit board with embedded resistor

Parallel multi-layer printed circuit board having improved intercon...

Method of manufacturing package substrate with fine circuit pattern...

Method for manufacturing build-up multi-layer printed circuit board...

Method for manufacturing printed circuit board

Method for manufacturing multi-layer printed circuit board

Patents Applicationslast 30 patents

Method of fabricating printed circuit board

Method of fabricating high density printed circuit board

Method of fabricating package substrate using electroless nickel pl...

Method of manufacturing package substrate with fine circuit pattern...

Method of fabricating PCB in parallel manner

Double-sided printed circuit board without via holes and method of...

Method of producing printed circuit board with embedded resistor

Parallel multi-layer printed circuit board having improved intercon...

Method of fabricating multi-layered printed circuit board

Double-sided printed circuit board without via holes and method of...