Cameron MCKNIGHT-MACNEIL

Person

Nepean, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Solder resist structure for embedded die packaging of power semicon...
- Patent number 12,166,115
- Issue date Dec 10, 2024
- Infineon Technologies Canada Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging for power semiconductor devices
- Patent number 11,776,883
- Issue date Oct 3, 2023
- GaN Systems Inc.
- Cameron Mcknight-Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of embedded die packaging comprising laser drilled vias
- Patent number 11,476,188
- Issue date Oct 18, 2022
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging for power semiconductor devices
- Patent number 11,342,248
- Issue date May 24, 2022
- GaN Systems Inc.
- Cameron Mcknight-Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN semiconductor device structure and method of fabrication by sub...
- Patent number 9,818,692
- Issue date Nov 14, 2017
- GaN Systems Inc.
- John Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault tolerant design for large area nitride semiconductor devices
- Patent number 9,818,857
- Issue date Nov 14, 2017
- GaN Systems Inc.
- Greg P. Klowak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,589,868
- Issue date Mar 7, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,589,869
- Issue date Mar 7, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault tolerant design for large area nitride semiconductor devices
- Patent number 9,153,509
- Issue date Oct 6, 2015
- GaN Systems Inc.
- Gregory P. Klowak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS
- Publication number 20230019052
- Publication date Jan 19, 2023
- GaN Systems Inc.
- Cameron MCKNIGHT-MACNEIL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER RESIST STRUCTURE FOR EMBEDDED DIE PACKAGING OF POWER SEMICON...
- Publication number 20220416069
- Publication date Dec 29, 2022
- GAN SYSTEMS INC.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES
- Publication number 20220246503
- Publication date Aug 4, 2022
- GaN Systems Inc.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS
- Publication number 20220115319
- Publication date Apr 14, 2022
- GAN SYSTEMS INC.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES
- Publication number 20220020669
- Publication date Jan 20, 2022
- GAN SYSTEMS INC.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaN SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATION BY SUB...
- Publication number 20160380090
- Publication date Dec 29, 2016
- GAN SYSTEMS INC.
- John ROBERTS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRISING LATERAL GaN...
- Publication number 20160307826
- Publication date Oct 20, 2016
- GAN SYSTEMS INC.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT TOLERANT DESIGN FOR LARGE AREA NITRIDE SEMICONDUCTOR DEVICES
- Publication number 20160284829
- Publication date Sep 29, 2016
- GAN SYSTEMS INC.
- Greg P. KLOWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRISING LATERAL GaN...
- Publication number 20160268185
- Publication date Sep 15, 2016
- GAN SYSTEMS INC.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRISING LATERAL GaN...
- Publication number 20160268190
- Publication date Sep 15, 2016
- GAN SYSTEMS INC.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT TOLERANT DESIGN FOR LARGE AREA NITRIDE SEMICONDUCTOR DEVICES
- Publication number 20150162252
- Publication date Jun 11, 2015
- GAN SYSTEMS INC.
- Gregory P. KLOWAK
- H01 - BASIC ELECTRIC ELEMENTS

Cameron MCKNIGHT-MACNEIL

Person

Patents Grantslast 30 patents

Solder resist structure for embedded die packaging of power semicon...

Embedded die packaging for power semiconductor devices

Fabrication of embedded die packaging comprising laser drilled vias

Embedded die packaging for power semiconductor devices

Packaging solutions for devices and systems comprising lateral GaN...

GaN semiconductor device structure and method of fabrication by sub...

Fault tolerant design for large area nitride semiconductor devices

Packaging solutions for devices and systems comprising lateral GaN...

Packaging solutions for devices and systems comprising lateral GaN...

Fault tolerant design for large area nitride semiconductor devices

Patents Applicationslast 30 patents

FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS

SOLDER RESIST STRUCTURE FOR EMBEDDED DIE PACKAGING OF POWER SEMICON...

EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES

FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS

EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES

GaN SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATION BY SUB...

PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRISING LATERAL GaN...

FAULT TOLERANT DESIGN FOR LARGE AREA NITRIDE SEMICONDUCTOR DEVICES

PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRISING LATERAL GaN...

PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRISING LATERAL GaN...

FAULT TOLERANT DESIGN FOR LARGE AREA NITRIDE SEMICONDUCTOR DEVICES