Carlo Gamboa

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Milpitas, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multiple die paddle leadframe and semiconductor device package
- Patent number 8,436,460
- Issue date May 7, 2013
- Cypress Semiconductor Corporation
- Carlo Gamboa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-flop semiconductor device packaging using bent leadfingers
- Patent number 8,283,772
- Issue date Oct 9, 2012
- Cypress Semiconductor Corporation
- Carlo Gamboa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and packaging method
- Patent number 8,106,489
- Issue date Jan 31, 2012
- Cypress Semiconductor Corporation
- Carlo Gamboa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-compensating die paddle design for high thermal-mismatched...
- Patent number 8,017,445
- Issue date Sep 13, 2011
- Cypress Semiconductor Corporation
- Bo Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with electrically isolated leads
- Patent number 7,608,914
- Issue date Oct 27, 2009
- Cypress Semiconductor Corporation
- Brett Alan Spurlock
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Optical Sensor Using a Laser Mounted on Top of a Semiconductor Die
- Publication number 20070206650
- Publication date Sep 6, 2007
- Karthik Ranganathan
- H01 - BASIC ELECTRIC ELEMENTS