Caroline A. Kovac

Person

Ridgefield, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-level circuit card structure
- Patent number 5,786,986
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Mark Fielding Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method employing organometallic interconnectors
- Patent number 5,503,698
- Issue date Apr 2, 1996
- International Business Machines Corporation
- Martin J. Goldberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding two surfaces together
- Patent number 5,462,628
- Issue date Oct 31, 1995
- International Business Machines Corporation
- Alfred Viehbeck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for conditioning an organic polymeric material
- Patent number 5,242,713
- Issue date Sep 7, 1993
- International Business Machines Corporation
- Alfred Viehbeck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for etching an organic polymeric material
- Patent number 5,203,955
- Issue date Apr 20, 1993
- International Business Machines Corporation
- Aldred Viehbeck
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Means of seeding and metallizing polymide
- Patent number 5,178,914
- Issue date Jan 12, 1993
- International Business Machines Corp.
- Ronald D. Goldblatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for conditioning an organic polymeric material
- Patent number 5,135,779
- Issue date Aug 4, 1992
- International Business Machines Corporation
- Alfred Viehbeck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical solder comprising a metal salt, polyphthalaldehyde and a s...
- Patent number 5,132,351
- Issue date Jul 21, 1992
- International Business Machines Corporation
- Martin J. Goldberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dam for lead encapsulation
- Patent number 5,130,781
- Issue date Jul 14, 1992
- IBM Corporation
- Caroline A. Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High strength low stress encapsulation of interconnected semiconduc...
- Patent number 5,047,834
- Issue date Sep 10, 1991
- International Business Machines Corporation
- Caroline A. Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for lead encapsulation
- Patent number 4,881,885
- Issue date Nov 21, 1989
- International Business Machines Corporation
- Caroline A. Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing substrates for deposition of metal seed from a...
- Patent number 4,869,930
- Issue date Sep 26, 1989
- International Business Machines Corporation
- Thomas C. Clarke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Double electronic device structure having beam leads solderlessly b...
- Patent number 4,862,322
- Issue date Aug 29, 1989
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision solder transfer method and means
- Patent number 4,832,255
- Issue date May 23, 1989
- International Business Machines Corporation
- Harry R. Bickford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polysiloxane modified cement
- Patent number 4,780,754
- Issue date Oct 25, 1988
- International Business Machines Corporation
- John J. Liutkus
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Selective deposition of copper
- Patent number 4,574,095
- Issue date Mar 4, 1986
- International Business Machines Corporation
- Thomas H. Baum
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Caroline A. Kovac

Person

Patents Grantslast 30 patents

Multi-level circuit card structure

Bonding method employing organometallic interconnectors

Method for bonding two surfaces together

Method for conditioning an organic polymeric material

Method for etching an organic polymeric material

Means of seeding and metallizing polymide

Method for conditioning an organic polymeric material

Chemical solder comprising a metal salt, polyphthalaldehyde and a s...

Dam for lead encapsulation

High strength low stress encapsulation of interconnected semiconduc...

Dam for lead encapsulation

Method for preparing substrates for deposition of metal seed from a...

Double electronic device structure having beam leads solderlessly b...

Precision solder transfer method and means

Polysiloxane modified cement

Selective deposition of copper