Carsten Von Koblinski

Person

Bodensdorf, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor devices by filling grooves fo...
- Patent number 12,094,837
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device and electronic component
- Patent number 11,848,237
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thin semiconductor die
- Patent number 11,605,599
- Issue date Mar 14, 2023
- Infineon Technologies AG
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor oxide or glass based connection body with wiring stru...
- Patent number 11,527,468
- Issue date Dec 13, 2022
- Infineon Technologies AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices and method for forming semiconductor...
- Patent number 11,393,784
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide devices, semiconductor devices and methods for form...
- Patent number 11,342,433
- Issue date May 24, 2022
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughening of a metallization layer on a semiconductor wafer
- Patent number 11,322,400
- Issue date May 3, 2022
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device and electronic component
- Patent number 11,302,579
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass piece and methods of manufacturing glass pieces and semicondu...
- Patent number 11,148,943
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Alexander Breymesser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 11,081,457
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, electronic component and method of manufactur...
- Patent number 11,069,639
- Issue date Jul 20, 2021
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame
- Patent number 10,748,787
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device, electronic component and met...
- Patent number 10,672,664
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superjunction structure in a power semiconductor device
- Patent number 10,615,040
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing a semiconductor wafer and semiconductor wafer
- Patent number 10,431,471
- Issue date Oct 1, 2019
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded system and a method for adhesively bonding a hygroscopic mat...
- Patent number 10,332,814
- Issue date Jun 25, 2019
- Infineon Technologies AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF module
- Patent number 10,128,204
- Issue date Nov 13, 2018
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a plurality of glass members, a method of m...
- Patent number 10,112,861
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Andre Brockmeier
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of manufacturing semiconductor device with glass pieces
- Patent number 9,981,844
- Issue date May 29, 2018
- Infineon Technologies AG
- Alexander Breymesser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with plated lead frame, and method for manufac...
- Patent number 9,847,235
- Issue date Dec 19, 2017
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having insulating substrates and methods of f...
- Patent number 9,608,201
- Issue date Mar 28, 2017
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 9,601,376
- Issue date Mar 21, 2017
- Infineon Technologies AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having insulating substrates and methods of f...
- Patent number 9,391,263
- Issue date Jul 12, 2016
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a transformer device on a glass substrate
- Patent number 9,245,684
- Issue date Jan 26, 2016
- Infineon Technologies Austria AG
- Friedrich Kroener
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device, wafer assembly and methods of manufacturing w...
- Patent number 9,219,020
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a glass substrate, and method for manu...
- Patent number 9,117,801
- Issue date Aug 25, 2015
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for producing the same
- Patent number 9,013,890
- Issue date Apr 21, 2015
- Infineon Technologies AG
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a composite material, associated composite mat...
- Patent number 8,922,016
- Issue date Dec 30, 2014
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,865,522
- Issue date Oct 21, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BACKSIDE METALLIZATION LAYER AND A PR...
- Publication number 20240371793
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY FILLING GROOVES FO...
- Publication number 20230187381
- Publication date Jun 15, 2023
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
- Publication number 20220293558
- Publication date Sep 15, 2022
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Devices, Semiconductor Devices and Methods for Form...
- Publication number 20220246745
- Publication date Aug 4, 2022
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer, Semiconductor Device and Electronic Component
- Publication number 20220181211
- Publication date Jun 9, 2022
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT
- Publication number 20220033249
- Publication date Feb 3, 2022
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20210335739
- Publication date Oct 28, 2021
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...
- Publication number 20210305198
- Publication date Sep 30, 2021
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Thin Semiconductor Die
- Publication number 20210143108
- Publication date May 13, 2021
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Roughening of a Metallization Layer on a Semiconductor Wafer
- Publication number 20200402851
- Publication date Dec 24, 2020
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer, Semiconductor Device and Electronic Component
- Publication number 20200273750
- Publication date Aug 27, 2020
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Devices, Semiconductor Devices and Methods for Form...
- Publication number 20200176580
- Publication date Jun 4, 2020
- INFINEON TECHNOLOGIES AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Semiconductor Component and Method of Fabrica...
- Publication number 20200111759
- Publication date Apr 9, 2020
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Oxide or Glass Based Connection Body with Wiring Stru...
- Publication number 20200091058
- Publication date Mar 19, 2020
- INFINEON TECHNOLOGIES AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Methods of Manufacturing a Semiconductor...
- Publication number 20190267362
- Publication date Aug 29, 2019
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module, Electronic Component and Method of Manufactur...
- Publication number 20190267343
- Publication date Aug 29, 2019
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer, Semiconductor Device, Electronic Component and Met...
- Publication number 20190088550
- Publication date Mar 21, 2019
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Plurality of Glass Members, a Method of M...
- Publication number 20190023600
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Glass Piece and Methods of Manufacturing Glass Pieces and Semicondu...
- Publication number 20180265354
- Publication date Sep 20, 2018
- Alexander Breymesser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RF Module
- Publication number 20180108622
- Publication date Apr 19, 2018
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Method for Forming Semiconductor Devices
- Publication number 20180068975
- Publication date Mar 8, 2018
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superjunction Structure in a Power Semiconductor Device
- Publication number 20170358452
- Publication date Dec 14, 2017
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having Insulating Substrates and Methods of F...
- Publication number 20170148981
- Publication date May 25, 2017
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
At least partially balancing out thickness variations of a substrate
- Publication number 20170062289
- Publication date Mar 2, 2017
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Plurality of Glass Members, a Method of M...
- Publication number 20170029311
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Method of planarizing a semiconductor wafer and semiconductor wafer
- Publication number 20160315154
- Publication date Oct 27, 2016
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING INSULATING SUBSTRATES AND METHODS OF F...
- Publication number 20160284990
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...
- Publication number 20160247739
- Publication date Aug 25, 2016
- INFINEON TECHNOLOGIES AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing a Semiconductor De...
- Publication number 20160086854
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS

Carsten Von Koblinski

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor devices by filling grooves fo...

Semiconductor package and methods of manufacturing a semiconductor...

Composite wafer, semiconductor device and electronic component

Semiconductor device having a thin semiconductor die

Semiconductor oxide or glass based connection body with wiring stru...

Semiconductor package devices and method for forming semiconductor...

Silicon carbide devices, semiconductor devices and methods for form...

Roughening of a metallization layer on a semiconductor wafer

Composite wafer, semiconductor device and electronic component

Glass piece and methods of manufacturing glass pieces and semicondu...

Semiconductor package and methods of manufacturing a semiconductor...

Semiconductor module, electronic component and method of manufactur...

Semiconductor device with plated lead frame

Composite wafer, semiconductor device, electronic component and met...

Superjunction structure in a power semiconductor device

Method of planarizing a semiconductor wafer and semiconductor wafer

Bonded system and a method for adhesively bonding a hygroscopic mat...

RF module

Method of manufacturing a plurality of glass members, a method of m...

Method of manufacturing semiconductor device with glass pieces

Semiconductor device with plated lead frame, and method for manufac...

Semiconductor devices having insulating substrates and methods of f...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor devices having insulating substrates and methods of f...

Method for manufacturing a transformer device on a glass substrate

Semiconductor device, wafer assembly and methods of manufacturing w...

Semiconductor devices having a glass substrate, and method for manu...

Semiconductor packages and methods for producing the same

Method for producing a composite material, associated composite mat...

Method for manufacturing semiconductor devices having a glass subst...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A BACKSIDE METALLIZATION LAYER AND A PR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY FILLING GROOVES FO...

METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...

Silicon Carbide Devices, Semiconductor Devices and Methods for Form...

Composite Wafer, Semiconductor Device and Electronic Component

MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING A SEMICONDUCTOR...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...

Semiconductor Device Having a Thin Semiconductor Die

Roughening of a Metallization Layer on a Semiconductor Wafer

Composite Wafer, Semiconductor Device and Electronic Component

Silicon Carbide Devices, Semiconductor Devices and Methods for Form...

Semiconductor Device, Semiconductor Component and Method of Fabrica...

Semiconductor Oxide or Glass Based Connection Body with Wiring Stru...

Semiconductor Package and Methods of Manufacturing a Semiconductor...

Semiconductor Module, Electronic Component and Method of Manufactur...

Composite Wafer, Semiconductor Device, Electronic Component and Met...

Method of Manufacturing a Plurality of Glass Members, a Method of M...

Glass Piece and Methods of Manufacturing Glass Pieces and Semicondu...

RF Module

Semiconductor Devices and Method for Forming Semiconductor Devices

Semiconductor Device with Plated Lead Frame

Superjunction Structure in a Power Semiconductor Device

Semiconductor Devices Having Insulating Substrates and Methods of F...

At least partially balancing out thickness variations of a substrate

Method of Manufacturing a Plurality of Glass Members, a Method of M...

Method of planarizing a semiconductor wafer and semiconductor wafer

SEMICONDUCTOR DEVICES HAVING INSULATING SUBSTRATES AND METHODS OF F...

BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...

Semiconductor Device and Method of Manufacturing a Semiconductor De...