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Cary J. Baerlocher
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Meridian, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device including one or more stiffening elements
Patent number
8,716,849
Issue date
May 6, 2014
Micron Technology, Inc.
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices
Patent number
8,508,034
Issue date
Aug 13, 2013
Micron Technology, Inc.
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded stiffener for thin substrates
Patent number
8,148,803
Issue date
Apr 3, 2012
Micron Technology, Inc.
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package
Patent number
8,115,296
Issue date
Feb 14, 2012
Micron Technology, Inc.
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfilled semiconductor die assemblies and methods of forming the...
Patent number
8,093,730
Issue date
Jan 10, 2012
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit package having electrically discon...
Patent number
7,851,907
Issue date
Dec 14, 2010
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit package having electrically discon...
Patent number
7,468,559
Issue date
Dec 23, 2008
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable ball grid array
Patent number
7,459,773
Issue date
Dec 2, 2008
Micron Technology, Inc.
Todd O. Bolken
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Molded stiffener for thin substrates
Patent number
7,423,331
Issue date
Sep 9, 2008
Micron Technology, Inc.
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device having reduced bow and method for making...
Patent number
7,344,921
Issue date
Mar 18, 2008
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit package having electrically discon...
Patent number
7,342,319
Issue date
Mar 11, 2008
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded stiffener for thin substrates
Patent number
7,288,431
Issue date
Oct 30, 2007
Micron Technology, Inc.
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit package having electrically discon...
Patent number
7,276,802
Issue date
Oct 2, 2007
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit package having electrically discon...
Patent number
7,268,067
Issue date
Sep 11, 2007
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of fabricating underfilled, encapsulated semiconductor die...
Patent number
7,262,074
Issue date
Aug 28, 2007
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packages for semiconductor die
Patent number
7,239,029
Issue date
Jul 3, 2007
Micron Technology, Inc.
Todd O. Bolken
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Packages for semiconductor die
Patent number
7,144,245
Issue date
Dec 5, 2006
Micron Technology, Inc.
Todd O. Bolken
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Underfilled, encapsulated semiconductor die assemblies and methods...
Patent number
7,116,000
Issue date
Oct 3, 2006
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a stackable ball grid array
Patent number
7,101,730
Issue date
Sep 5, 2006
Micron Technology, Inc.
Todd O. Bolken
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit device having reduced bow and method for making...
Patent number
7,095,097
Issue date
Aug 22, 2006
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit and substrate encapsulation methods
Patent number
7,091,060
Issue date
Aug 15, 2006
Micron Technology, Inc.
Todd O. Bolken
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Moisture-resistant electronic device package and methods of assembly
Patent number
7,026,548
Issue date
Apr 11, 2006
Micron Technology, Inc.
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable ball grid array
Patent number
7,019,408
Issue date
Mar 28, 2006
Micron Technology, Inc.
Todd O. Bolken
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Moisture-resistant electronic device package and methods of assembly
Patent number
6,953,891
Issue date
Oct 11, 2005
Micron Technology, Inc.
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making an integrated circuit package having reduced bow
Patent number
6,887,740
Issue date
May 3, 2005
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for gate blocking X-outs during a molding process
Patent number
6,791,198
Issue date
Sep 14, 2004
Micron Technology, Inc.
Bret K. Street
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable ball grid array
Patent number
6,778,404
Issue date
Aug 17, 2004
Todd O. Bolken
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for gate blocking X-outs during a molding process
Patent number
6,776,599
Issue date
Aug 17, 2004
Micron Technology, Inc.
Bret K. Street
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for reduced flash encapsulation of microelectronic devices
Patent number
6,644,949
Issue date
Nov 11, 2003
Micron Technology, Inc.
Brad D. Rumsey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for reduced flash encapsulation of microelectr...
Patent number
6,638,595
Issue date
Oct 28, 2003
Micron Technology, Inc.
Brad D. Rumsey
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Molded Stiffener for Thin Substrates
Publication number
20120187552
Publication date
Jul 26, 2012
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES
Publication number
20120126386
Publication date
May 24, 2012
Micron Technology, Inc.
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20100264532
Publication date
Oct 21, 2010
Micron Technology, Inc.
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
Publication number
20080142950
Publication date
Jun 19, 2008
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Underfilled semiconductor die assemblies and methods of forming the...
Publication number
20070040264
Publication date
Feb 22, 2007
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded stiffener for thin substrates
Publication number
20060290011
Publication date
Dec 28, 2006
Micro Technology Inc.
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
Publication number
20060237845
Publication date
Oct 26, 2006
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
Publication number
20060237844
Publication date
Oct 26, 2006
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molding tool and a method of forming an electronic device package
Publication number
20060169490
Publication date
Aug 3, 2006
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit device having reduced bow and method for making...
Publication number
20060141673
Publication date
Jun 29, 2006
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded stiffener for thin substrates
Publication number
20060068527
Publication date
Mar 30, 2006
Micron Technology Inc.
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stackable ball grid array
Publication number
20060055020
Publication date
Mar 16, 2006
Todd O. Bolken
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
MOISTURE-RESISTANT ELECTRONIC DEVICE PACKAGE AND METHODS OF ASSEMBLY
Publication number
20050263312
Publication date
Dec 1, 2005
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Moisture-resistant electronic device package and methods of assembly
Publication number
20050057883
Publication date
Mar 17, 2005
Todd O. Bolken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded stiffener for thin substrates
Publication number
20050029549
Publication date
Feb 10, 2005
Micron Technology Inc.
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit device having reduced bow and method for making...
Publication number
20050023653
Publication date
Feb 3, 2005
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor integrated circuit package having electrically discon...
Publication number
20050026327
Publication date
Feb 3, 2005
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a stackable ball grid array
Publication number
20050019983
Publication date
Jan 27, 2005
Todd O. Bolken
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Stackable ball grid array
Publication number
20040164412
Publication date
Aug 26, 2004
Todd O. Bolken
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Underfilled, encapsulated semiconductor die assemblies and methods...
Publication number
20040164413
Publication date
Aug 26, 2004
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages for semiconductor die
Publication number
20040119173
Publication date
Jun 24, 2004
Todd O. Bolken
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Underfilled, encapsulated semiconductor die assemblies and methods...
Publication number
20040004294
Publication date
Jan 8, 2004
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit device having reduced bow and method for making...
Publication number
20030201547
Publication date
Oct 30, 2003
Micron Technology, Inc.
William D. Tandy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages for semiconductor die
Publication number
20030201526
Publication date
Oct 30, 2003
Todd O. Bolken
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor integrated circuit package having electrically discon...
Publication number
20030193088
Publication date
Oct 16, 2003
Micron Technology, Inc.
Frank L. Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded stiffener for thin substrates
Publication number
20030155636
Publication date
Aug 21, 2003
Chad A. Cobbley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages for semiconductor die
Publication number
20030098514
Publication date
May 29, 2003
Todd O. Bolken
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method and apparatus for gate blocking X-outs during a molding process
Publication number
20030100141
Publication date
May 29, 2003
Bret K. Street
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for gate blocking X-outs during a molding process
Publication number
20030088976
Publication date
May 15, 2003
Bret K. Street
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for gate blocking X-outs during a molding process
Publication number
20030088977
Publication date
May 15, 2003
Bret K. Street
H01 - BASIC ELECTRIC ELEMENTS