Cathal Cassidy

Person

Okinawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Engineering high-performance palladium core magnesium oxide porous...
- Patent number 10,828,622
- Issue date Nov 10, 2020
- OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION
- Mukhles Ibrahim Sowwan
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device for wafer-scale integration
- Patent number 10,332,931
- Issue date Jun 25, 2019
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,870,988
- Issue date Jan 16, 2018
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,773,729
- Issue date Sep 26, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,735,101
- Issue date Aug 15, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal induced nanocrystallization of amorphous semiconductor quantu...
- Patent number 9,633,842
- Issue date Apr 25, 2017
- OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION
- Vidya Dhar Singh
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method of wafer-scale integration of semiconductor devices and semi...
- Patent number 9,608,035
- Issue date Mar 28, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,553,039
- Issue date Jan 24, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with internal substrate contact and method of...
- Patent number 9,245,843
- Issue date Jan 26, 2016
- AMS AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC VECTOR POTENTIAL-BASED LENS
- Publication number 20240429016
- Publication date Dec 26, 2024
- OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION
- Makoto Tokoro SCHREIBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERING HIGH-PERFORMANCE PALLADIUM CORE MAGNESIUM OXIDE POROUS...
- Publication number 20180193820
- Publication date Jul 12, 2018
- OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION
- Mukhles Ibrahim SOWWAN
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170365551
- Publication date Dec 21, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR WAFER-SCALE INTEGRATION
- Publication number 20170179183
- Publication date Jun 22, 2017
- ams AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20170025351
- Publication date Jan 26, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170018518
- Publication date Jan 19, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INDUCED NANOCRYSTALLIZATION OF AMORPHOUS SEMICONDUCTOR QUANTU...
- Publication number 20160042948
- Publication date Feb 11, 2016
- OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION
- Singh VIDYA DHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER-SCALE INTEGRATION OF SEMICONDUCTOR DEVICES AND SEMI...
- Publication number 20150129999
- Publication date May 14, 2015
- ams AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERNAL SUBSTRATE CONTACT AND METHOD OF...
- Publication number 20140367862
- Publication date Dec 18, 2014
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20140339698
- Publication date Nov 20, 2014
- ams AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS

Cathal Cassidy

Person

Patents Grantslast 30 patents

Engineering high-performance palladium core magnesium oxide porous...

Semiconductor device for wafer-scale integration

Method of producing a semiconductor device with through-substrate v...

Method of producing a semiconductor device with through-substrate v...

Semiconductor device with through-substrate via covered by a solder...

Metal induced nanocrystallization of amorphous semiconductor quantu...

Method of wafer-scale integration of semiconductor devices and semi...

Semiconductor device with through-substrate via covered by a solder...

Semiconductor device with internal substrate contact and method of...

Patents Applicationslast 30 patents

MAGNETIC VECTOR POTENTIAL-BASED LENS

ENGINEERING HIGH-PERFORMANCE PALLADIUM CORE MAGNESIUM OXIDE POROUS...

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

SEMICONDUCTOR DEVICE FOR WAFER-SCALE INTEGRATION

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

METAL INDUCED NANOCRYSTALLIZATION OF AMORPHOUS SEMICONDUCTOR QUANTU...

METHOD OF WAFER-SCALE INTEGRATION OF SEMICONDUCTOR DEVICES AND SEMI...

SEMICONDUCTOR DEVICE WITH INTERNAL SUBSTRATE CONTACT AND METHOD OF...

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...