Cathryn J. Christiansen

Person

Huntington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrates for electrical resistivity measurements
- Patent number 11,841,296
- Issue date Dec 12, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Marvin Montaque
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with interdigitated conductive elements between metal...
- Patent number 10,770,407
- Issue date Sep 8, 2020
- GLOBALFOUNDRIES Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel test structure
- Patent number 10,475,677
- Issue date Nov 12, 2019
- GLOBALFOUNDRIES Inc.
- Tian Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for a security application
- Patent number 10,297,546
- Issue date May 21, 2019
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with continuous metal crack stop
- Patent number 10,109,599
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Cathryn J. Christiansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration testing of interconnect analogues having bottom-co...
- Patent number 9,851,397
- Issue date Dec 26, 2017
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge compression layers
- Patent number 9,831,194
- Issue date Nov 28, 2017
- GLOBALFOUNDRIES Inc.
- Tom C. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structures
- Patent number 9,780,031
- Issue date Oct 3, 2017
- Globalfoudries Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with variable dopant levels
- Patent number 9,768,065
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Inc.
- Ping-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium tungsten liner used with copper interconnects
- Patent number 9,685,370
- Issue date Jun 20, 2017
- GLOBALFOUNDRIES Inc.
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) test structure with monitor chain and test...
- Patent number 9,435,852
- Issue date Sep 6, 2016
- GLOBALFOUNDRIES, INC.
- Andrew T. Kim
- G01 - MEASURING TESTING
Information Patent Grant
Method of self-correcting power grid for semiconductor structures
- Patent number 9,214,427
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Cathryn J. Christiansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-correcting power grid for semiconductor structures method
- Patent number 9,087,841
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Cathryn J. Christiansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating open-ended via chains for testing via formation and die...
- Patent number 9,059,052
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal sensor for semiconductor circuits
- Patent number 8,562,210
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Wagdi W. Abadeer
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating air gap interconnect structures
- Patent number 8,383,507
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining critical current density for interconnect
- Patent number 8,232,809
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Chad M. Burke
- G01 - MEASURING TESTING
Information Patent Grant
Air gap interconnect structures and methods for forming the same
- Patent number 8,120,179
- Issue date Feb 21, 2012
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-mechanical cleavable structure
- Patent number 8,018,017
- Issue date Sep 13, 2011
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally programmable anti-reverse engineering interconnects where...
- Patent number 7,843,062
- Issue date Nov 30, 2010
- International Business Machines Corporation
- Fen Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of making thermally programmable anti-reverse engineering in...
- Patent number 7,709,401
- Issue date May 4, 2010
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLYSILICON RESISTOR ALIGNED BETWEEN GATE STRUCTURES
- Publication number 20240405019
- Publication date Dec 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Marvin G.L. Montaque
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATES FOR ELECTRICAL RESISTIVITY MEASUREMENTS
- Publication number 20230175995
- Publication date Jun 8, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Marvin Montaque
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH INTERDIGITATED CONDUCTIVE ELEMENTS BETWEEN METAL...
- Publication number 20200219826
- Publication date Jul 9, 2020
- GLOBALFOUNDRIES INC.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL TEST STRUCTURE
- Publication number 20190067056
- Publication date Feb 28, 2019
- GLOBALFOUNDRIES INC.
- Tian Shen
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECT STRUCTURES FOR A SECURITY APPLICATION
- Publication number 20190027433
- Publication date Jan 24, 2019
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH CONTINUOUS METAL CRACK STOP
- Publication number 20180174982
- Publication date Jun 21, 2018
- GLOBALFOUNDRIES INC.
- Cathryn J. Christiansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND RESISTOR STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20180102318
- Publication date Apr 12, 2018
- GLOBALFOUNDRIES INC.
- Cathryn J. Christiansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION TESTING OF INTERCONNECT ANALOGUES HAVING BOTTOM-CO...
- Publication number 20160258998
- Publication date Sep 8, 2016
- GLOBALFOUNDRIES INC.
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
TITANIUM TUNGSTEN LINER USED WITH COPPER INTERCONNECTS
- Publication number 20160181151
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURES
- Publication number 20160071790
- Publication date Mar 10, 2016
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OFSELF-CORRECTING A POWER GRID FOR SEMICONDUCTOR STRUCTURES
- Publication number 20150243601
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Cathryn J. Christiansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING OPEN-ENDED VIA CHAINS FOR TESTING VIA FORMATION AND DIE...
- Publication number 20150221567
- Publication date Aug 6, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-CORRECTING POWER GRID FOR SEMICONDUCTOR STRUCTURES METHOD
- Publication number 20150115400
- Publication date Apr 30, 2015
- International Business Machines Corporation
- Cathryn J. Christiansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING OPEN-ENDED VIA CHAINS FOR TESTING VIA FORMATION AND DIE...
- Publication number 20140339558
- Publication date Nov 20, 2014
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SENSOR FOR SEMICONDUCTOR CIRCUITS
- Publication number 20120128033
- Publication date May 24, 2012
- International Business Machines Corporation
- Wagdi W. Abadeer
- G01 - MEASURING TESTING
Information Patent Application
AIR GAP INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20120111825
- Publication date May 10, 2012
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING CRITICAL CURRENT DENSITY FOR INTERCONNECT
- Publication number 20110115508
- Publication date May 19, 2011
- International Business Machines Corporation
- Chad M. Burke
- G01 - MEASURING TESTING
Information Patent Application
AIR GAP INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20110108992
- Publication date May 12, 2011
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY PROGRAMMABLE ANTI-REVERSE ENGINEERING INTERCONNECTS AND M...
- Publication number 20100133691
- Publication date Jun 3, 2010
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY PROGRAMMABLE ANTI-REVERSE ENGINEERING INTERCONNECTS AND M...
- Publication number 20090212431
- Publication date Aug 27, 2009
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMO-MECHANICAL CLEAVABLE STRUCTURE
- Publication number 20060163685
- Publication date Jul 27, 2006
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Cathryn J. Christiansen

Person

Patents Grantslast 30 patents

Semiconductor substrates for electrical resistivity measurements

IC structure with interdigitated conductive elements between metal...

Parallel test structure

Interconnect structures for a security application

Integrated circuit structure with continuous metal crack stop

Electromigration testing of interconnect analogues having bottom-co...

Edge compression layers

Wiring structures

Interconnect structures with variable dopant levels

Titanium tungsten liner used with copper interconnects

Integrated circuit (IC) test structure with monitor chain and test...

Method of self-correcting power grid for semiconductor structures

Self-correcting power grid for semiconductor structures method

Alternating open-ended via chains for testing via formation and die...

Thermal sensor for semiconductor circuits

Method for fabricating air gap interconnect structures

Determining critical current density for interconnect

Air gap interconnect structures and methods for forming the same

Thermo-mechanical cleavable structure

Thermally programmable anti-reverse engineering interconnects where...

Method of making thermally programmable anti-reverse engineering in...

Patents Applicationslast 30 patents

POLYSILICON RESISTOR ALIGNED BETWEEN GATE STRUCTURES

SEMICONDUCTOR SUBSTRATES FOR ELECTRICAL RESISTIVITY MEASUREMENTS

IC STRUCTURE WITH INTERDIGITATED CONDUCTIVE ELEMENTS BETWEEN METAL...

PARALLEL TEST STRUCTURE

INTERCONNECT STRUCTURES FOR A SECURITY APPLICATION

INTEGRATED CIRCUIT STRUCTURE WITH CONTINUOUS METAL CRACK STOP

COMPOUND RESISTOR STRUCTURE FOR SEMICONDUCTOR DEVICE

ELECTROMIGRATION TESTING OF INTERCONNECT ANALOGUES HAVING BOTTOM-CO...

TITANIUM TUNGSTEN LINER USED WITH COPPER INTERCONNECTS

WIRING STRUCTURES

METHOD OFSELF-CORRECTING A POWER GRID FOR SEMICONDUCTOR STRUCTURES

ALTERNATING OPEN-ENDED VIA CHAINS FOR TESTING VIA FORMATION AND DIE...

SELF-CORRECTING POWER GRID FOR SEMICONDUCTOR STRUCTURES METHOD

ALTERNATING OPEN-ENDED VIA CHAINS FOR TESTING VIA FORMATION AND DIE...

THERMAL SENSOR FOR SEMICONDUCTOR CIRCUITS

AIR GAP INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME

DETERMINING CRITICAL CURRENT DENSITY FOR INTERCONNECT

AIR GAP INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME

THERMALLY PROGRAMMABLE ANTI-REVERSE ENGINEERING INTERCONNECTS AND M...

THERMALLY PROGRAMMABLE ANTI-REVERSE ENGINEERING INTERCONNECTS AND M...

THERMO-MECHANICAL CLEAVABLE STRUCTURE