Cemil Geyik

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect loss of high density package with magnetic material
- Patent number 12,009,320
- Issue date Jun 11, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable high speed high bandwidth IO signaling package architectur...
- Patent number 11,869,842
- Issue date Jan 9, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered adhesion promotion films
- Patent number 11,810,859
- Issue date Nov 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Density-graded adhesion layer for conductors
- Patent number 11,508,676
- Issue date Nov 22, 2022
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trace modulations in connectors for integrated-circuit packages
- Patent number 10,840,196
- Issue date Nov 17, 2020
- Intel Corporation
- Cemil Geyik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming hybrid socket structures for package interconnec...
- Patent number 10,303,225
- Issue date May 28, 2019
- Intel Corporation
- Kemal Aygun
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
- Publication number 20240113049
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...
- Publication number 20240088047
- Publication date Mar 14, 2024
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES
- Publication number 20240063100
- Publication date Feb 22, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEE...
- Publication number 20230420347
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-...
- Publication number 20230420377
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...
- Publication number 20230420358
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil S. Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PATHWAY ROUTING VIA THROUGH HOLE
- Publication number 20230420298
- Publication date Dec 28, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE SIGNAL INTEGRITY PERFORMANCE IN IN...
- Publication number 20230352416
- Publication date Nov 2, 2023
- Intel Corporation
- Cemil Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED ADHESION PROMOTION FILMS
- Publication number 20210257309
- Publication date Aug 19, 2021
- Intel Corporation
- SRINIVAS V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LOSS OF HIGH DENSITY PACKAGE WITH MAGNETIC MATERIAL
- Publication number 20210104476
- Publication date Apr 8, 2021
- Intel Corporation
- Zhiguo QIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...
- Publication number 20210028116
- Publication date Jan 28, 2021
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSITY-GRADED ADHESION LAYER FOR CONDUCTORS
- Publication number 20200365533
- Publication date Nov 19, 2020
- Intel Corporation
- RAHUL N. MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS
- Publication number 20200315023
- Publication date Oct 1, 2020
- Intel Corporation
- Suddhasattwa NAD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING HYBRID SOCKET STRUCTURES FOR PACKAGE INTERCONNEC...
- Publication number 20190101961
- Publication date Apr 4, 2019
- Intel Corporation
- Kemal Aygun
- G06 - COMPUTING CALCULATING COUNTING

Cemil Geyik

Person

Patents Grantslast 30 patents

Interconnect loss of high density package with magnetic material

Scalable high speed high bandwidth IO signaling package architectur...

Multi-layered adhesion promotion films

Density-graded adhesion layer for conductors

Trace modulations in connectors for integrated-circuit packages

Methods of forming hybrid socket structures for package interconnec...

Patents Applicationslast 30 patents

PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES

SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...

SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES

PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEE...

PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-...

INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...

MULTI-PATHWAY ROUTING VIA THROUGH HOLE

METHODS AND APPARATUS TO IMPROVE SIGNAL INTEGRITY PERFORMANCE IN IN...

MULTI-LAYERED ADHESION PROMOTION FILMS

INTERCONNECT LOSS OF HIGH DENSITY PACKAGE WITH MAGNETIC MATERIAL

SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...

DENSITY-GRADED ADHESION LAYER FOR CONDUCTORS

COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS

METHODS OF FORMING HYBRID SOCKET STRUCTURES FOR PACKAGE INTERCONNEC...