Cengiz Ahmet Palanduz

Person

Durham, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a substrate core with embedded capacitor and stru...
- Patent number 9,572,258
- Issue date Feb 14, 2017
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive silver paste for a metal-wrap-through silicon solar cell
- Patent number 9,246,030
- Issue date Jan 26, 2016
- E I du Pont de Nemours and Company
- Brian J Laughlin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sol-gel and mask patterning for thin-film capacitor fabrication, th...
- Patent number 8,623,737
- Issue date Jan 7, 2014
- Intel Corporation
- Huankiat Seh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of making thin film capacitors
- Patent number 8,499,426
- Issue date Aug 6, 2013
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic package substrate with recessed device
- Patent number 8,264,846
- Issue date Sep 11, 2012
- Intel Corporation
- Christopher C. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Split thin film capacitor for multiple voltages
- Patent number 7,986,532
- Issue date Jul 26, 2011
- Intel Corporation
- Cengiz A. Palanduz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High-capacitance density thin film dielectrics having columnar grai...
- Patent number 7,981,741
- Issue date Jul 19, 2011
- E. I. Du Pont de Nemours and Company
- Lijie Bao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for integration of thin-film capacitors into the build-up l...
- Patent number 7,841,075
- Issue date Nov 30, 2010
- E. I. Du Pont de Nemours and Company
- William Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making thin-film capacitors on metal foil using thick top...
- Patent number 7,818,855
- Issue date Oct 26, 2010
- E. I. Du Pont de Nemours and Company
- William Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a thin film capacitor
- Patent number 7,810,234
- Issue date Oct 12, 2010
- Intel Corporation
- Cengiz A. Palanduz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
iTFC with optimized C(T)
- Patent number 7,755,165
- Issue date Jul 13, 2010
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive device structure
- Patent number 7,733,626
- Issue date Jun 8, 2010
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Individual sub-assembly containing a ceramic interposer, silicon vo...
- Patent number 7,675,160
- Issue date Mar 9, 2010
- Intel Corporation
- Sriram Dattaguru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
iTFC with optimized C(T)
- Patent number 7,656,644
- Issue date Feb 2, 2010
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Piezo actuator for cooling
- Patent number 7,638,928
- Issue date Dec 29, 2009
- Intel Corporation
- Cengiz A. Palanduz
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Organic substrates with embedded thin-film capacitors, methods of m...
- Patent number 7,636,231
- Issue date Dec 22, 2009
- Intel Corporation
- John S. Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-k thin film grain size control
- Patent number 7,629,269
- Issue date Dec 8, 2009
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Split thin film capacitor for multiple voltages
- Patent number 7,586,756
- Issue date Sep 8, 2009
- Intel Corporation
- Cengiz A. Palanduz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors and methods of making the same
- Patent number 7,547,957
- Issue date Jun 16, 2009
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package substrate having a thin film capacitor s...
- Patent number 7,504,271
- Issue date Mar 17, 2009
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitors and methods of making the same
- Patent number 7,453,144
- Issue date Nov 18, 2008
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
iTFC with optimized C(T)
- Patent number 7,375,412
- Issue date May 20, 2008
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic substrates with embedded thin-film capacitors, methods of m...
- Patent number 7,372,126
- Issue date May 13, 2008
- Intel Corporation
- John S. Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a passive device structure
- Patent number 7,290,315
- Issue date Nov 6, 2007
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor having an anodic metal oxide substrate
- Patent number 7,242,073
- Issue date Jul 10, 2007
- Intel Corporation
- Larry E. Mosley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a substrate core with embedded capacitor and structures for...
- Patent number 7,224,571
- Issue date May 29, 2007
- Intel Corporation
- Sriram Srinivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method forming split thin film capacitors with multiple voltages
- Patent number 7,216,406
- Issue date May 15, 2007
- Intel Corporation
- Cengiz A. Palanduz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delivery regions for power, ground and I/O signal paths in an IC pa...
- Patent number 7,209,366
- Issue date Apr 24, 2007
- Intel Corporation
- Victor Prokofiev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon building blocks in integrated circuit packaging
- Patent number 7,205,638
- Issue date Apr 17, 2007
- Intel Corporation
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input/output routing on an electronic device
- Patent number 7,176,575
- Issue date Feb 13, 2007
- Intel Corporation
- Larry E. Mosley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOL-GEL AND MASK PATTERNING FOR THIN-FILM CAPACITOR FABRICATION, TH...
- Publication number 20140111924
- Publication date Apr 24, 2014
- Huankiat Seh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE SILVER PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL
- Publication number 20140083495
- Publication date Mar 27, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- BRIAN J. LAUGHLIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING THIN-FILM DIELECTRICS AND CAPACITORS ON MET...
- Publication number 20110311718
- Publication date Dec 22, 2011
- E.I. du Pont de Nemours and Company
- Cengiz Ahmet Palanduz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capaci...
- Publication number 20090316374
- Publication date Dec 24, 2009
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLIT THIN FILM CAPACITOR FOR MULTIPLE VOLTAGES
- Publication number 20090284944
- Publication date Nov 19, 2009
- Intel Corporation
- Cengiz A. Palanduz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE AREA THIN FILM CAPACITORS ON METAL FOILS AND METHODS OF MANUF...
- Publication number 20090238954
- Publication date Sep 24, 2009
- SEIGI SUH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSES FOR THE MANUFACTURE OF BARIUM TITANATE CAPACITORS ON NICK...
- Publication number 20090238955
- Publication date Sep 24, 2009
- E.I. du Pont de Nemours and Company
- Juan Carlos Figueroa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-CAPACITANCE DENSITY THIN FILM DIELECTRICS HAVING COLUMNAR GRAI...
- Publication number 20090035913
- Publication date Feb 5, 2009
- E.I. du Pont de Nemours and Company
- Lijie Bao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR INTEGRATION OF THIN-FILM CAPACITORS INTO THE BUILD-UP L...
- Publication number 20080316723
- Publication date Dec 25, 2008
- E.I. du Pont de Nemours and Company
- William Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM CAPACITORS AND METHODS OF MAKING THE SAME
- Publication number 20080263842
- Publication date Oct 30, 2008
- CENGIZ A. PALANDUZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC SUBSTRATES WITH EMBEDDED THIN-FILM CAPACITORS, METHODS OF M...
- Publication number 20080174938
- Publication date Jul 24, 2008
- Intel Corporation
- John S. Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Individual sub-assembly containing a ceramic interposer, silicon vo...
- Publication number 20080157274
- Publication date Jul 3, 2008
- Sriram Dattaguru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic interposer with silicon voltage regulator and array capacit...
- Publication number 20080157343
- Publication date Jul 3, 2008
- Sriram Dattaguru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC PACKAGE SUBSTRATE WITH RECESSED DEVICE
- Publication number 20080142961
- Publication date Jun 19, 2008
- Christopher C. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Making Thin-Film Capacitors on Metal Foil Using Thick Top...
- Publication number 20080112110
- Publication date May 15, 2008
- E.I. DuPont de Nemours and Company
- William Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
iTFC WITH OPTIMIZED C(T)
- Publication number 20080106844
- Publication date May 8, 2008
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
iTFC WITH OPTIMIZED C(T)
- Publication number 20080106848
- Publication date May 8, 2008
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM CAPACITORS AND METHODS OF MAKING THE SAME
- Publication number 20080054403
- Publication date Mar 6, 2008
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Passive device structure
- Publication number 20070271752
- Publication date Nov 29, 2007
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sol-gel and mask patterning for thin-film capacitor fabrication, th...
- Publication number 20070228517
- Publication date Oct 4, 2007
- Huankiat Seh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIVOLTAGE THIN FILM CAPACITOR
- Publication number 20070184609
- Publication date Aug 9, 2007
- Intel Corporation
- Cengiz A. Palanduz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film capacitors and methods of making the same
- Publication number 20070001259
- Publication date Jan 4, 2007
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Piezo actuator for cooling
- Publication number 20070001550
- Publication date Jan 4, 2007
- Cengiz A. Palanduz
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
SPLIT THIN FILM CAPACITOR FOR MULTIPLE VOLTAGES
- Publication number 20060285272
- Publication date Dec 21, 2006
- Intel Corporation
- Cengiz A. Palanduz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package substrate having a thin film capacitor s...
- Publication number 20060270111
- Publication date Nov 30, 2006
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic inductor with high inductance magnetic core
- Publication number 20060267718
- Publication date Nov 30, 2006
- Intel Corporation
- Islam A. Salama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor with co-planar electrodes
- Publication number 20060228855
- Publication date Oct 12, 2006
- Intel Corporation
- Yongki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reduced porosity high-k thin film mixed grains for thin film capaci...
- Publication number 20060220177
- Publication date Oct 5, 2006
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Organic substrates with embedded thin-film capacitors, methods of m...
- Publication number 20060220175
- Publication date Oct 5, 2006
- John S. Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-k thin film grain size control
- Publication number 20060220176
- Publication date Oct 5, 2006
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cengiz Ahmet Palanduz

Person

Patents Grantslast 30 patents

Method of forming a substrate core with embedded capacitor and stru...

Conductive silver paste for a metal-wrap-through silicon solar cell

Sol-gel and mask patterning for thin-film capacitor fabrication, th...

Methods of making thin film capacitors

Ceramic package substrate with recessed device

Split thin film capacitor for multiple voltages

High-capacitance density thin film dielectrics having columnar grai...

Methods for integration of thin-film capacitors into the build-up l...

Method of making thin-film capacitors on metal foil using thick top...

Method of forming a thin film capacitor

iTFC with optimized C(T)

Passive device structure

Individual sub-assembly containing a ceramic interposer, silicon vo...

iTFC with optimized C(T)

Piezo actuator for cooling

Organic substrates with embedded thin-film capacitors, methods of m...

High-k thin film grain size control

Split thin film capacitor for multiple voltages

Thin film capacitors and methods of making the same

Integrated circuit package substrate having a thin film capacitor s...

Thin film capacitors and methods of making the same

iTFC with optimized C(T)

Organic substrates with embedded thin-film capacitors, methods of m...

Method for making a passive device structure

Capacitor having an anodic metal oxide substrate

Forming a substrate core with embedded capacitor and structures for...

Method forming split thin film capacitors with multiple voltages

Delivery regions for power, ground and I/O signal paths in an IC pa...

Silicon building blocks in integrated circuit packaging

Input/output routing on an electronic device

Patents Applicationslast 30 patents

SOL-GEL AND MASK PATTERNING FOR THIN-FILM CAPACITOR FABRICATION, TH...

CONDUCTIVE SILVER PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL

METHOD OF MANUFACTURING THIN-FILM DIELECTRICS AND CAPACITORS ON MET...

Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capaci...

SPLIT THIN FILM CAPACITOR FOR MULTIPLE VOLTAGES

LARGE AREA THIN FILM CAPACITORS ON METAL FOILS AND METHODS OF MANUF...

PROCESSES FOR THE MANUFACTURE OF BARIUM TITANATE CAPACITORS ON NICK...

HIGH-CAPACITANCE DENSITY THIN FILM DIELECTRICS HAVING COLUMNAR GRAI...

METHODS FOR INTEGRATION OF THIN-FILM CAPACITORS INTO THE BUILD-UP L...

THIN FILM CAPACITORS AND METHODS OF MAKING THE SAME

ORGANIC SUBSTRATES WITH EMBEDDED THIN-FILM CAPACITORS, METHODS OF M...

Individual sub-assembly containing a ceramic interposer, silicon vo...

Ceramic interposer with silicon voltage regulator and array capacit...

CERAMIC PACKAGE SUBSTRATE WITH RECESSED DEVICE

Method of Making Thin-Film Capacitors on Metal Foil Using Thick Top...

iTFC WITH OPTIMIZED C(T)

iTFC WITH OPTIMIZED C(T)

THIN FILM CAPACITORS AND METHODS OF MAKING THE SAME

Passive device structure

Sol-gel and mask patterning for thin-film capacitor fabrication, th...

MULTIVOLTAGE THIN FILM CAPACITOR

Thin film capacitors and methods of making the same

Piezo actuator for cooling

SPLIT THIN FILM CAPACITOR FOR MULTIPLE VOLTAGES

Integrated circuit package substrate having a thin film capacitor s...

Microelectronic inductor with high inductance magnetic core

Capacitor with co-planar electrodes

Reduced porosity high-k thin film mixed grains for thin film capaci...

Organic substrates with embedded thin-film capacitors, methods of m...

High-k thin film grain size control