Chad Peterson

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Porous showerhead for a processing chamber
- Patent number 11,111,582
- Issue date Sep 7, 2021
- Applied Materials, Inc.
- Sumit Agarwal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Decreasing the etch rate of silicon nitride by carbon addition
- Patent number 7,951,730
- Issue date May 31, 2011
- Applied Materials, Inc.
- Ritwik Bhatia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to mitigate impact of UV and E-beam exposure on semiconducto...
- Patent number 7,851,384
- Issue date Dec 14, 2010
- Applied Materials, Inc.
- Yijun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decreasing the etch rate of silicon nitride by carbon addition
- Patent number 7,501,355
- Issue date Mar 10, 2009
- Applied Materials, Inc.
- Ritwik Bhatia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-bias-deposited high-density-plasma chemical-vapor-deposition si...
- Patent number 6,667,248
- Issue date Dec 23, 2003
- Applied Materials Inc.
- Hichem M'Saad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
POROUS SHOWERHEAD FOR A PROCESSING CHAMBER
- Publication number 20200283900
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Sumit AGARWAL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DECREASING THE ETCH RATE OF SILICON NITRIDE BY CARBON ADDITION
- Publication number 20090137132
- Publication date May 28, 2009
- Ritwik Bhatia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decreasing the etch rate of silicon nitride by carbon addition
- Publication number 20080014761
- Publication date Jan 17, 2008
- Ritwik Bhatia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO MITIGATE IMPACT OF UV AND E-BEAM EXPOSURE ON SEMICONDUCTO...
- Publication number 20070281497
- Publication date Dec 6, 2007
- APPLIED MATERIALS, INC.
- Yijun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-k spacer integration into CMOS transistors
- Publication number 20070202640
- Publication date Aug 30, 2007
- Applied Materials, Inc.
- Amir Al-Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-power dielectric seasoning for stable wafer-to-wafer thickness...
- Publication number 20060093756
- Publication date May 4, 2006
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low-bias-deposited high-density-plasma chemical-vapor-deposition si...
- Publication number 20030050724
- Publication date Mar 13, 2003
- APPLIED MATERIALS, INC.
- Hichem M'Saad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Chad Peterson

Person

Patents Grantslast 30 patents

Porous showerhead for a processing chamber

Decreasing the etch rate of silicon nitride by carbon addition

Method to mitigate impact of UV and E-beam exposure on semiconducto...

Decreasing the etch rate of silicon nitride by carbon addition

Low-bias-deposited high-density-plasma chemical-vapor-deposition si...

Patents Applicationslast 30 patents

POROUS SHOWERHEAD FOR A PROCESSING CHAMBER

DECREASING THE ETCH RATE OF SILICON NITRIDE BY CARBON ADDITION

Decreasing the etch rate of silicon nitride by carbon addition

METHOD TO MITIGATE IMPACT OF UV AND E-BEAM EXPOSURE ON SEMICONDUCTO...

Low-k spacer integration into CMOS transistors

High-power dielectric seasoning for stable wafer-to-wafer thickness...

Low-bias-deposited high-density-plasma chemical-vapor-deposition si...